CY7C1089DV33 64-Mbit (8M x 8) Static RAM Features Functional Description ■ High speed ❐ tAA = 12 ns The CY7C1089DV33 is a high-performance CMOS static RAM organized as 8,388,608 words by 8 bits. ■ Low active power ❐ ICC = 300 mA ■ Low complementary metal oxide semiconductor (CMOS) standby power ❐ ISB2 = 100 mA To write to the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW. Data on the eight I/O pins (I/O0 through I/O7) is then written into the location specified on the address pins (A0 through A22). ■ Operating voltages of 3.3 ± 0.3 V ■ 2.0-V data retention ■ Automatic power-down when deselected ■ Transistor-transistor logic (TTL)-compatible inputs and outputs ■ Easy memory expansion with CE1 and CE2 features ■ Available in Pb-free 48-ball fine ball grid array (FBGA) package To read from the device, take Chip Enables (CE1 LOW and CE2 HIGH) LOW and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. Under these conditions, the contents of the memory location specified by the address pins appear on the I/O pins. See Truth Table on page 9 for a complete description of Read and Write modes. The input and output pins (I/O0 through I/O7) are placed in a high impedance state when the device is deselected (CE1 LOW or CE2 HIGH), the outputs are disabled (OE HIGH), or during a write operation (CE1 LOW, CE2 HIGH and WE LOW). Logic Block Diagram 8M x 8 ARRAY SENSE AMPS A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 ROW DECODER INPUT BUFFER I/O0 – I/O7 WE COLUMN DECODER OE A10 A11 A 12 A 13 A 14 A15 A16 A17 A18 A19 A20 A21 A22 CE2 CE1 Selection Guide Description –12 Unit Maximum access time 12 ns Maximum operating current 300 mA Maximum CMOS standby current 100 mA Cypress Semiconductor Corporation Document Number: 001-53993 Rev. *B • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised February 21, 2011 [+] Feedback CY7C1089DV33 Contents Pin Configuration.............................................................. Maximum Ratings ............................................................. Operating Range ............................................................... DC Electrical Characteristics........................................... Capacitance....................................................................... Thermal Resistance .......................................................... Data Retention Characteristics........................................ AC Switching Characteristics.......................................... Switching Waveforms....................................................... Truth Table ........................................................................ Ordering Information ........................................................ Ordering Code Definition ............................................. Document Number: 001-53993 Rev. *B 3 4 4 4 4 4 5 6 7 9 9 9 Package Diagram............................................................ Acronyms ........................................................................ Document Conventions ................................................. Units of Measure ....................................................... Document History Page ................................................. Sales, Solutions, and Legal Information ...................... Worldwide Sales and Design Support ....................... Products .................................................................... PSoC Solutions ......................................................... 10 10 10 10 11 11 11 11 11 Page 2 of 11 [+] Feedback CY7C1089DV33 Pin Configuration Figure 1. 48-Ball FBGA (Top View) [1] 1 2 3 4 5 6 A22 OE A0 A1 A2 CE2 A NC NC A3 A4 CE1 NC B I/O0 NC A5 A6 NC I/O4 C VSS I/O1 A17 A7 I/O5 VCC D VCC I/O2 A18 A16 I/O6 VSS E I/O3 NC A14 A15 NC I/O7 F NC A21 A12 A13 WE NC G A19 A8 A9 A10 A11 A20 H Note 1. NC pins are not connected to the die. Document Number: 001-53993 Rev. *B Page 3 of 11 [+] Feedback CY7C1089DV33 Maximum Ratings Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage temperature ................................ –65 °C to +150 °C Current into outputs (LOW) ......................................... 20 mA Static discharge voltage............................................ >2001 V (MIL-STD-883, Method 3015) Ambient temperature with power applied ........................................... –55 °C to +125 °C Latch up current ...................................................... >140 mA Operating Range Supply voltage on VCC relative to GND[2] .....–0.5 V to +4.6 V DC voltage applied to outputs in high-Z state[2]................................... –0.5 V to VCC + 0.5 V Range Ambient Temperature VCC DC input voltage[2] ............................... –0.5 V to VCC + 0.5 V Industrial –40 °C to +85 °C 3.3V ± 0.3V DC Electrical Characteristics Over the Operating Range Parameter Description Test Conditions VOH Output HIGH voltage VCC = Min, IOH = –4.0 mA VOL Output LOW voltage VCC = Min, IOL = 8.0 mA VIH Input HIGH voltage VIL Input LOW voltage[2] –12 Min Unit Max 2.4 – V – 0.4 V 2.0 VCC + 0.3 V –0.3 0.8 V IIX Input leakage current GND < VIN < VCC –1 +1 μA IOZ Output leakage current GND < VOUT < VCC, Output disabled –1 +1 μA ICC – 300 mA ISB1 VCC operating supply current VCC = Max, f = fMAX = 1/tRC, IOUT = 0 mA CMOS levels Automatic CE power-down Max VCC, CE1 > VIH, CE2 < VIL, VIN > VIH or VIN < VIL, f = fMAX current — TTL inputs – 120 mA ISB2 Automatic CE power-down current —CMOS inputs – 100 mA Max VCC, CE1 > VCC – 0.3V, CE2 < 0.3V, VIN > VCC – 0.3V, or VIN < 0.3V, f = 0 Capacitance Tested initially and after any design or process changes that may affect these parameters. Parameter Description CIN Input capacitance COUT I/O capacitance Test Conditions TA = 25 °C, f = 1 MHz, VCC = 3.3 V FBGA Unit 32 pF 40 pF Thermal Resistance Tested initially and after any design or process changes that may affect these parameters. Parameter Description ΘJA Thermal resistance (junction to ambient) ΘJC Thermal resistance (junction to case) Test Conditions Still air, soldered on a 3 × 4.5 inch, four layer printed circuit board FBGA Unit 55 °C/W 23.04 °C/W Note 2. VIL (min) = –2.0V and VIH(max) = VCC + 2V for pulse durations of less than 20 ns. Document Number: 001-53993 Rev. *B Page 4 of 11 [+] Feedback CY7C1089DV33 Figure 2. AC Test Loads and Waveforms[3] High-Z characteristics 3.3V 50Ω VTH = 1.5V OUTPUT Z0 = 50Ω R1 317Ω OUTPUT 30 pF* R2 351Ω 5 pF* (a) * Capacitive load consists of all components of the test environment ALL INPUT PULSES 3.0V 90% 10% 10% GND Rise Time > 1 V/ns INCLUDING JIG AND SCOPE (b) 90% (c) Fall Time: > 1 V/ns Data Retention Characteristics Over the Operating Range Parameter Description Min Typ Max Unit 2 – – V – – 100 mA Chip deselect to data retention time 0 – – ns Operation recovery time 12 – – ns VDR VCC for data retention ICCDR Data retention current tCDR[4] tR[ 5] Conditions VCC = 2V , CE1 > VCC – 0.2V, CE2 < 0.2V, VIN > VCC – 0.2V or VIN < 0.2V Figure 3. Data Retention Waveform DATA RETENTION MODE 3.0V VCC tCDR VDR > 2V 3.0V tR CE1 CE2 Notes 3. Valid SRAM operation does not occur until the power supplies have reached the minimum operating VDD (3.0V). 100 μs (tpower) after reaching the minimum operating VDD, normal SRAM operation begins including reduction in VDD to the data retention (VCCDR, 2.0V) voltage. 4. Tested initially and after any design or process changes that may affect these parameters. 5. Full device operation requires linear VCC ramp from VDR to VCC(min.) > 50 μs or stable at VCC(min.) > 50 μs. Document Number: 001-53993 Rev. *B Page 5 of 11 [+] Feedback CY7C1089DV33 AC Switching Characteristics Over the Operating Range [6] Parameter –12 Description Min Max Unit Read Cycle tpower VCC(typical) to the first access[7] 100 – μs tRC Read cycle time 12 – ns tAA Address to data valid – 12 ns tOHA Data hold from address change 3 – ns tACE CE1 LOW and CE2 HIGH to data valid – 12 ns tDOE OE LOW to data valid – 7 ns tLZOE OE LOW to low-Z 1 – ns – 7 ns 3 – ns – 7 ns 0 – ns – 12 ns [8] tHZOE OE HIGH to high-Z tLZCE CE1 LOW and CE2 HIGH to low-Z [8] tHZCE tPU tPD CE1 HIGH and CE2 LOW to high-Z [8] CE1 LOW and CE2 HIGH to power-up [9] CE1 HIGH and CE2 LOW to power-down [9] Write Cycle [10, 11] tWC Write cycle time 12 – ns tSCE CE1 LOW and CE2 HIGH to write end 9 – ns tAW Address setup to write end 9 – ns tHA Address hold from write end 0 – ns tSA Address setup to write start 0 – ns tPWE WE pulse width 9 – ns tSD Data setup to write end 7 – ns tHD Data hold from write end 0 – ns WE HIGH to low-Z[8] 3 – ns WE LOW to high-Z[8] – 7 ns tLZWE tHZWE Notes 6. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, and input pulse levels of 0 to 3.0V. Test conditions for the read cycle use output loading shown in part a) of AC Test Loads and Waveforms[3], unless specified otherwise. 7. tPOWER gives the minimum amount of time that the power supply is at typical VCC values until the first memory access is performed. 8. tHZOE, tHZCE, tHZWE, tLZOE, tLZCE, and tLZWE are specified with a load capacitance of 5 pF as in (b) of AC Test Loads and Waveforms[3]. 9. These parameters are guaranteed by design and are not tested. 10. The internal write time of the memory is defined by the overlap of WE, CE1 = VIL, and CE2 = VIH. Chip enables must be active and WE must be LOW to initiate a write, and the transition of any of these signals can terminate. The input data setup and hold timing should be referenced to the edge of the signal that terminates the write. 11. The minimum write cycle time for Write Cycle No. 2 (WE controlled, OE LOW) is the sum of tHZWE and tSD. Document Number: 001-53993 Rev. *B Page 6 of 11 [+] Feedback CY7C1089DV33 Switching Waveforms Figure 4. Read Cycle No. 1 [12, 13, 14] tRC RC ADDRESS tOHA DATA OUT tAA PREVIOUS DATA VALID DATA VALID Figure 5. Read Cycle No. 2 (OE Controlled) [12, 14, 15] tRC ADDRESS CE tACE OE tHZOE tDOE tHZCE tLZOE DATA OUT HIGH IMPEDANCE tLZCE VCC SUPPLY CURRENT HIGH IMPEDANCE DATA VALID tPD tPU 50% 50% ICC ISB Notes 12. CE refers to the internal logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. For all other combinations, CE is HIGH. 13. The device is continuously selected. CE = VIL. 14. WE is HIGH for read cycle. 15. Address valid before or similar to CE transition LOW. Document Number: 001-53993 Rev. *B Page 7 of 11 [+] Feedback CY7C1089DV33 Switching Waveforms (continued) Figure 6. Write Cycle No. 1 (CE Controlled) [16, 17, 18] tWC ADDRESS tSA CE tSCE tAW tHA tPWE WE tSD tHD DATAIN VALID DATA I/O Figure 7. Write Cycle No. 2 (WE Controlled, OE LOW) [16, 17, 18] tWC ADDRESS tSCE CE tAW tHA tSA tPWE WE tHZWE DATA I/O tSD tHD DATAIN VALID tLZWE Notes 16. CE refers to the internal logical combination of CE1 and CE2 such that when CE1 is LOW and CE2 is HIGH, CE is LOW. For all other combinations, CE is HIGH. 17. Data I/O is high impedance if OE = VIH. 18. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high impedance state. Document Number: 001-53993 Rev. *B Page 8 of 11 [+] Feedback CY7C1089DV33 Truth Table CE1 CE2 OE WE I/O0 – I/O7 Mode Power H X X X High-Z Power down Standby (ISB) X L X X High-Z Power down Standby (ISB) L H L H Data Out Read all bits Active (ICC) L H X L Data In Write all bits Active (ICC) L H H H High-Z Selected, Outputs disabled Active (ICC) Ordering Information Speed (ns) 12 Ordering Code CY7C1089DV33-12BAXI Package Diagram 001-50044 Package Type 48-ball FBGA (8 × 9.5 × 1.4 mm) (Pb-free) Operating Range Industrial Ordering Code Definition CY 7 C 1 08 9 D V33 - xx xxx x Temperature Range: x = I I = Industrial Package Type: xxx = BAX BAX = 48-ball FBGA (Pb-free) Speed: xx = 12 ns V33 = Voltage range (3 V to 3.6 V) D = C9, 90 nm Technology 9 = Data width × 8 bits 08 = 64-Mbit density 1 = Fast Asynchronous SRAM family Technology Code: C = CMOS 7 = SRAM CY = Cypress Document Number: 001-53993 Rev. *B Page 9 of 11 [+] Feedback CY7C1089DV33 Package Diagram Figure 8. 48-Ball FBGA (8 x 9.5 x 1.4 mm) (001-50044) 001-50044 *C Acronyms Document Conventions Description Units of Measure CMOS complementary metal oxide semiconductor Symbol FBGA fine ball grid array °C degrees Celsius I/O input/output μA microamperes SRAM static random access memory mA milliampere TTL transistor-transistor logic MHz megahertz Acronym Document Number: 001-53993 Rev. *B Unit of Measure ns nanoseconds pF picofarads V volts Ω ohms W watts Page 10 of 11 [+] Feedback CY7C1089DV33 Document History Page Document Title: CY7C1089DV33, 64-Mbit (8M x 8) Static RAM Document Number: 001-53993 REV. ECN NO. Submission Date Orig. of Change Description of Change ** 2746867 07/31/2009 *A 3100499 12/02/2010 VKN/AESA New Data sheet PRAS Updated Note 12. Changed datasheet status from Preliminary to Final. Updated Package Diagram and Sales, Solutions, and Legal Information. Added Acronyms, Document Conventions and Ordering Code Definition. *B 3178259 21/02/2011 PRAS Post to external web. Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. 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Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-53993 Rev. *B Revised February 21, 2011 Page 11 of 11 All product and company names mentioned in this document are the trademarks of their respective holders. [+] Feedback