Product Data Sheet Z5-MA – High-Power LED Superior high Flux for High Current System Z Power LED – Z5-MA SZ5-MA-W0-00 (Cool) RoHS AEC-Q101 Product Brief Description Features and Benefits • • The Z-Power series is designed for high flux output applications with high current operation capability. • It incorporates state of the art SMD design and low thermal resistant material. • The Z Power LED is ideal light sources for automotive lightings. • • • • • • • Super high Flux output and high Luminance Designed for high current operation SMT solderable RoHS compliant AEC-Q101 Qualified MSL 2 Level Viewing angle 120℃ ESD 8kV Key Applications • • • • • • • Rev1.0, June 1, 2016 1 Indoor lighting Outdoor lighting Automotive Architectural lighting Industrial lighting (High/Low bay) Portable Torch Home appliance www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 5 • Color Bin Structure 11 • Mechanical Dimensions 13 • Material Structure 14 • Recommended Solder Pad 15 • Reflow Soldering Characteristics 16 • Emitter Tape & Reel Packaging 17 • Product Nomenclature 18 • Handling of Silicone Resin for LEDs 19 • Precaution For Use 20 • Company Information 23 Rev1.0, June 1, 2016 2 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Performance Characteristics Table 1. Electro Optical Characteristics, IF =350mA, Tj = 25ºC, RH30% Parameter Symbol Min Typ Max Unit Forward Voltage [4] [1] VF 2.75 2.97 3.50 V Luminous Flux [2] [1] ΦV - 158 - lm Color Coordinate X 0.33 - Y 0.33 - 2θ1/2 120 deg. Rth JA 13 15.6 K/W Rth JS 4.5 5.5 K/W Rth JA 8.8 9.3 K/W Rth JS 2.3 3.8 K/W [3] [1] Viewing Angle [5] Real thermal resistance [6] Electrical thermal resistance [6] Table 2. Flux and Voltage Characteristics CCT (K) Part Number SZ5-MA-W0-00 Typical Luminous Flux [2] ФV [3] (lm) Typical Forward Voltage (VF) [4] [1] Tj(℃) Typ. Typ. 350mA 700mA* 1.2A* 350mA 700m* 1.2* 25 158 288 441 2.95 3.14 3.33 85 142 260 398 2.78 2.96 3.14 5200 Notes : (1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : 0.005, CCT 5% tolerance. (2) SSC maintains a tolerance of 7% on flux and power measurements. (3) ФV is the total luminous flux output as measured with an integrating sphere. (4) Tolerance is 0.06V on forward voltage measurements. (5) Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity (6) Thermal resistance = Rth JA : Junction/ambient , Rth JS : Junction/solder point PCB design for improved heat dissipation : area of 520 mm2 per LED, Metal core PCB. * No values are provided by real measurement. Only for reference purpose. Rev1.0, June 1, 2016 3 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Performance Characteristics Table 3. Absolute Maximum Ratings Tj = 25ºC, RH30% Value Parameter Symbol Forward Current [1] Peak Pulsed Forward Current Unit IF [2] Min. Typ. Max. - - 1.5 A 2.0 A IF Reverse Voltage VR - - 5 V Power Dissipation Pd - - 5.22 W Junction Temperature Tj - - 150 ºC Operating Temperature Topr - 40 - 125 ºC Storage Temperature Tstg - 40 - 125 ºC 8 KV ESD (R=1.5kΩ, C= 100pF) [3] Notes : (1) At Junction Temperature 25℃ condition. (2) Pulse width ≤10ms, duty cycle ≤ 10% condition. (3) (1) A ESD Protection device is included for protection. • • LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. All measurements were made under the standardized environment of Seoul Semiconductor. Rev1.0, June 1, 2016 4 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Characteristics Graph Fig 1. Color Spectrum, TS=25℃, IF=350mA Relative Emission Intensity 1.2 1.0 0.8 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 800 Wavelength (nm) Fig.2 Typical Spatial Distribution Rev1.0, June 1, 2016 5 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Characteristics Graph Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC Forward Current [mA] 1500 1200 900 600 300 0 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 Forward Voltage [V] Fig 4. Forward Current vs. Relative Luminous Flux, Tj = 25ºC △LF = Φv / Φv(350mA) 3.5 3.0 Φv 2.5 2.0 ▷ 1.5 1.0 0.5 0.0 150 300 450 600 750 900 1050 1200 1350 1500 Forward current (mA) Rev1.0, June 1, 2016 6 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Characteristics Graph Fig 5. Forward Current vs. CIE X, Y Shift , Tj = 25ºC △Cx = Cx – Cx (350mA) 0.03 ΔCx ΔCy 0.02 Cx, Cy 0.01 0.00 -0.01 ▷ -0.02 -0.03 300 600 900 1200 1500 Forward Current [mA] Rev1.0, June 1, 2016 7 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Characteristics Graph Fig 6. Relative Light Output vs. Junction Temperature, IF = 350mA △LF = Φv / Φv(25℃) 1.2 1.0 Φv 0.8 0.6 ▷ 0.4 0.2 0.0 -40 0 40 80 120 160 Junction Temperature [℃] Fig 7. Junction Temp. vs. CIE x, y Shift, IF = 350mA △Cx = Cx – Cx (25℃) 0.03 ΔCx ΔCy 0.02 Cx, Cy 0.01 0.00 -0.01 ▷ -0.02 -0.03 -40 Rev1.0, June 1, 2016 0 40 80 8 120 160 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Characteristics Graph Fig 8. Relative Forward vs. Junction Temperature, IF = 350mA △ VF = VF - VF(25℃) 0.4 0.3 VF 0.2 0.1 ▷ 0.0 -0.1 -0.2 -0.3 -40 -20 0 20 40 60 80 100 120 140 Junction Temperature [℃] Rev1.0, June 1, 2016 9 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Characteristics Graph Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.) = 150℃, IF =1500mA Maximum Forward Current IF [mA] 1600 1400 1200 Rth(j-s) Rth(j-a) 1000 800 600 400 200 0 -40 Don’t use below 100mA -20 0 20 40 60 80 100 120 140 Junction Temperature [℃] Rev1.0, June 1, 2016 10 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Color Bin Structure Table 4. Bin Code description, IF=350mA, Tj=25℃ Luminous Flux (lm) @ IF = 350mA Part Number SZ5-MA-W0-00 Bin Code Min. Max. V3 140 150 W1 150 160 W2 160 170 Color Chromaticity Coordinate Refer to page.13 Typical Forward Voltage (VF) Bin Code Min. Max. G 2.75 3.00 H 3.00 3.25 I 3.25 3.50 Available Rank Rev1.0, June 1, 2016 11 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Color Bin Structure CIE Chromaticity Diagram (Cool white), Tj =25℃, IF = 350mA A0 CIE x 0.3028 0.3041 0.3426 0.3115 A1 CIE y 0.3304 0.3240 0.3324 0.3393 CIE x 0.3115 0.3126 0.3210 0.3205 CIE y 0.3256 0.3187 0.3261 0.3334 CIE x 0.3207 0.3212 0.3293 0.3292 CIE y 0.3316 0.3243 0.3306 0.3384 CIE x 0.3293 0.3294 0.3366 0.3369 CIE y 0.3601 0.3514 0.3578 0.3669 CIE x 0.3369 0.3366 0.3440 0.3448 A5 CIE x 0.3136 0.3146 0.3221 0.3216 CIE y 0.3462 0.3389 0.3461 0.3539 CIE x 0.3292 0.3293 0.3373 0.3376 CIE y 0.3384 0.3306 0.3369 0.3451 CIE x 0.3376 0.3373 0.3456 0.3463 CIE y 0.3451 0.3369 0.3428 0.3514 CIE x 0.3448 0.3440 0.3514 0.3526 CIE x 0.3126 0.3136 0.3216 0.3210 CIE y 0.3539 0.3461 0.3534 0.3616 CIE x 0.3212 0.3217 0.3293 0.3293 CIE y 0.3616 0.3534 0.3601 0.3687 CIE x 0.3463 0.3456 0.3539 0.3552 A4 CIE y 0.3324 0.3256 0.3334 0.3408 CIE x 0.3055 0.3068 0.3146 0.3136 CIE y 0.3389 0.3316 0.3384 0.3461 CIE x 0.3293 0.3293 0.3369 0.3373 CIE y 0.3687 0.3601 0.3669 0.3760 CIE x 0.3373 0.3369 0.3448 0.3456 B2 C0 C4 Rev1.0, June 1, 2016 A3 CIE y 0.3240 0.3177 0.3256 0.3324 B1 B5 C3 CIE x 0.3456 0.3448 0.3526 0.3539 CIE x 0.3041 0.3055 0.3136 0.3126 B0 B4 CIE x 0.3217 0.3222 0.3294 0.3293 A2 CIE y 0.3393 0.3324 0.3408 0.3481 CIE y 0.3177 0.3113 0.3187 0.3256 B3 C1 CIE y 0.3461 0.3384 0.3451 0.3534 C2 CIE y 0.3534 0.3451 0.3514 0.3601 C5 CIE y 0.3514 0.3428 0.3487 0.3578 12 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Mechanical Dimensions ESD Protection Device Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.1mm Rev1.0, June 1, 2016 13 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Material Structure ④ ③ ⑤ ② ① Parts No. Name Description Materials ① Substrate Metal Ceramic Copper Alloy (Gold Plated) ② Chip Source Blue LED GaN on Sapphire ③ Wire Metal Gold Wire ④ Encapsulation Silicone +Phosphor ⑤ ESD Protection Device Si - Rev1.0, June 1, 2016 14 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Recommended Solder Pad Recommended PCB Solder Pad Solder Resist Solder Resist Recommended Stencil Pattern Solder Stencil Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) This drawing without tolerances are for reference only. (4) Undefined tolerance is ±0.1mm. Rev1.0, June 1, 2016 15 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Table 7. Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board. Rev1.0, June 1, 2016 16 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Emitter Tape & Reel Packaging Rev1.0, June 1, 2016 17 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Product Nomenclature Table 5. Part Numbering System : X1X2X3 - X4X5 - X6X7 - X8X9 Part Number Code Description Part Number X1 Company S X2 Z-Power LED series number Z X3 PKG series 5 X4 PKG series M M series X5 Revision number 1 New version X6 X7 Color Specification W0 Pure white WN Neutral white WW Warm white C8 CRI (min.) 80 C9 CRI (min.) 90 00 The others X8 X9 Color Specification Value Table 6. Lot Numbering System : Y1Y1Y2Y3Y3Y4Y5Y5Y5Y5 - Y6Y6Y6 - Y7Y7Y7 - Y8Y8Y8Y8Y8Y8Y8 Lot Number Code Description Y1 Year Y2 Month Y3 Day Y4 Production area Y5 Mass order Y6 Taping number Y7 Reel number Y8 Internal management number [1] Z1: Flux rank Rev1.0, June 1, 2016 Z2: Chromaticity Z3: VF rank 18 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) Avoid leaving fingerprints on silicone resin parts. Rev1.0, June 1, 2016 19 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing Z5 Series LEDs in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 30℃ Humidity : less than RH60% b. If the package has been opened more than 1 year (MSL_2) or the color of the desiccant changes, components should be dried for 10-24hr at 65±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored in a clean environment. We recommend LEDs store in nitrogen-filled container. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. Rev1.0, June 1, 2016 20 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Precaution for Use (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca n penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. T he result can be a significant loss of light output from the fixture. Knowledge of the properties of the m aterials selected to be used in the construction of fixtures can help prevent these issues. (14) The slug is electrically isolated. (15) Attaching LEDs, do not use adhesives that outgas organic vapor. (16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the rev erse voltage is applied to LED, migration can be generated resulting in LED damage. (17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev1.0, June 1, 2016 21 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev1.0, June 1, 2016 22 www.seoulsemicon.com Product Data Sheet Z5-MA – High-Power LED Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev1.0, June 1, 2016 23 www.seoulsemicon.com