Combination of power and control electronics on a circuit board - with Wirelaid partial thick copper technology it s possible (PDF)

Partial high current solutions WIRELAID
The technology and technical application
Agenda
Introduction
Design Guide
WIRELAID
versus
Standard
www.we-online.de
Markets and
target groups
Example of use
Seite 2
Advantages of
WIRELAID
05.11.2013
Introduction
Requirements of the market:
Power (3-200A)
Signal (SMD, fine line)
Benefit
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Seite 3
05.11.2013
Introduction
The priciple

Use of embedded copper wires to realise high current tracks

Combination of power and signal processing electronics

Competitive alternative to PCBs with thick copper technology or
parallel arrangement of additional layers
The technics

The copper wires are fixed onto the under side (treatment) of the copper foil using resistance welding

After lamination the process, wires are embedded by prepregs into a multilayer PCB

WIRELAID copper foil forms external layer and is structured with standard PCB processes

Therefore external layer are SMD-capable
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Seite 4
05.11.2013
Production process
1
2
3
4
5
6
7
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Seite 5
• Welding first point
• Wire is cut to length
• Second welding point
• Turning the „WIRELAID foil“
• Lamination process
• Embedding wires
• Wirelaid Multilayer
05.11.2013
Production process
1
2
3
4
5
6
7
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Seite 6
• Anschweißen des ersten Punktes
• Ziehen und Ablängen des Drahtes
• Schweißung des zweiten Punktes
• Wenden der bestückten Folie
• Verpressen der Folie
• Einbetten der Drähte
• Fertiger Multilayer
05.11.2013
Types of wires
Flat wire
_____________
F08
0,8 x 0,25mm²
Cross-sectional-area :
F14
Cross-sectional-area :
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0,2mm²
1,4 x 0,35mm²
0,5mm²
Seite 7
05.11.2013
3 dimensional way of installation

Wirelaid 3D




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Seite 8
Depth-milled slot
Suited for complicated installation space
Partial thick copper with “hinge” character
Bending radius <1mm
05.11.2013
WIRELAID vs. Standard
Introduction
Design Guide
WIRELAID
versus
Standard
www.we-online.de
Markets and
target groups
Example of use
Seite 9
Advantages of
WIRELAID
05.11.2013
WIRELAID vs. Standard
0,63mm²
Requirements: 20A at 20K allowed temperature rise
8,9mm
4,5mm
1,9mm
WIRELAID use:
Reduction of
78,7%
WIRELAID
F14
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Cross-sectional
area
track width Wirelaid
(35µm base Cu)
Track width standard
(35µm base Cu)
Reduction
0,5mm²
1,9mm
8,9mm
78,7%
Seite 10
05.11.2013
Poll
1. Guess how many amps two wires (F14) can carry with maximum temperature rise
of 20K?
1. 12A
2. 23A
3. 38A
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Seite 11
05.11.2013
Design Guide
Introduction
Design Guide
WIRELAID
versus
Standard
www.we-online.de
Markets and
target groups
Example of use
Seite 12
Advantages of
WIRELAID
05.11.2013
Ampacity
Wires welded under the internal layer
rise of temperature (ΔT in °C)
Copper thickness conductor 70µm
Strom [A] 
Leiterbreite [mm]
Draht
1x300 
0.9
2x300 
1.8
1x800 
1.4
2x800 
3.1
3x800 
4.8
4x800 
6.5
x F14 2.0
1x14002 
2x1400 
4.3
3x1400 
6.6
4x1400 
8.9
35µm
38
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 60 62 64 66 68 70 72 74 76 78 80 82 84
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8 13 19 28 40
3 6 8 12 16
3 6 9 13 18
2 2 4 5 7
1 1 2 3 4
0 1 2 2 3
2 2 4,3mm
3 5 5
0 1 1 2 3
0 0 1 1 2
0 0 0 1 1
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Strom [A] 
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 60 62 64 66 68 70 72 74 76 78 80 82 84
4,3mm
Draht
1x300
2x300
1x800
2x800
3x800
4x800
1x1400
2x1400
3x1400
4x1400
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Leiterbreite [mm]
0.9
1.8
1.4
3.1
4.8
6.5
2.0
4.3
6.6
8.9
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05.11.2013
Wirelaid sample
depth-milled bendable area
clearance – view on
embedded wires
cross-sectional area of
embedded wires
Signal
processing
electronics
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Power
electronics
Seite 14
05.11.2013
Example of use
Introduction
Design Guide
WIRELAID
versus
Standard
www.we-online.de
Markets and
target groups
Example of use
Seite 15
Advantages of
WIRELAID
05.11.2013
Frequently asked questions by customers

Mr Jürgen Westenkirchner
–

Business Development – Sales – Technical Customer Support
FAQ about WIRELAID technology – experience from everyday professional life
1. Hot Spots aon angled wirelaid tracks
2. Connection of Wirelaid layers
3. Layouting Wirelaid layers
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Seite 16
05.11.2013
Frequently asked questions by customers
Hot Spots aon angled wirelaid tracks

Increased current density

Dinstance between wires according to design rules

Problem investigation
–
Thermal analysis
–
Explanation:
• Power derating on ohmic resistance
– P = I² x R, increased current density S
–
Solution: No hot spots thriugh local high thermal capacity
Relation:
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I [A] = 9,1 [mm²]
Seite 17
0,68
*
ΔT [K]0,43
05.11.2013
Frequently asked questions by customers
Connection of Wirelaid layers
–
–
–
–

No „through wire connection“
Distance between wires according to design guide
Connection through pad after wire`s end
The more vias the better the thermal management
Problem investigation
–
Similar to angled wires, but with a higher local thermal capacity with the help of cable,
pressfits, etc
» in correlation with the conductivity and the emissivity (radiation, Cu
0,76))
– Leads to temperatur increment
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Seite 18
05.11.2013
Frequently asked questions by customers
Layout

For implementing the WIRELAID technology in your PCB build-up, use an additional help layer
showing the relevant wires (width and length) in Gerber format

The combination of “bottom” and “wirelaid_bottom” represents the “Wirelaid copper foil” in the
shown build-up
top
wirelaid_bottom
(Help layer)
bottom
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Seite 19
05.11.2013
Example of use a)


Permanent current load
Allowed temperature
70 A
80C°
before:
8 layer build-up, 6 inner layer 105µm Cu
after:
4 layer with embedded wires (highlighted) under one layer
Advantages in cost by reduced amount of layers and thickness of copper foil
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Seite 20
05.11.2013
Example of use b)


Permanent current load
Allowed temperature
50 A
80C°
Before:
3 PCBs, 6 layers with 70µm
After:
1 PCB , 6 layers with 70µm + Wirelaid 3D
Advantages in cost through production , solder process and omission of connectors
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Seite 21
05.11.2013
Markets and target groups
Introduction
Design Guide
WIRELAID
versus
Standard
www.we-online.de
Markets and
target groups
Example of use
Seite 22
Advantages of
WIRELAID
05.11.2013
Applications
Automotive
Motor electr..
Hybrid
techology
Gear box
electr.
Automotive
Comfort
electr.
Energy supply
Sensor and
monitoring
system
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Seite 23
05.11.2013
Applications
Industrial electronics
Con-/inverter
Sensor
systems
Thyristor
activation
control
system
Motor drive
Industrial
electronics
Switching
power
supply
Voltage
distribution
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Power
supply
Seite 24
05.11.2013
Perspective - Powerflex

Embedded wires into depth-milled „Semiflex-area“

Combination of Wirelaid 3D and Semiflex
–
–
Transfer of signals through Semiflex area
Transfer of currents through Wirelaid 3D
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Seite 25
05.11.2013
Advantages of Wirelaid
Introduction
Design Guide
WIRELAID
versus
Standard
www.we-online.de
Markets and
target groups
Example of use
Seite 26
Advantages of
WIRELAID
05.11.2013
Vorteile der Technologie

High currents without thick copper technology
–
–
–
–

Cost reduction
–
–
–
–

High currents within small areas
Combination of power and signal processing electronics on one single layer
Partial power management
Thinner copper layers possible
Economical use of PCB area
Reduction of layers
Reduced efforts with soldering process
Omission of connectors
Reliability
–
–
Electrical connection without cable or connector
Improvement of heat dissipation
 Reduced system costs
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Seite 27
05.11.2013
I appreciate your attention.
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Seite 28
05.11.2013