Reliability Report

AOS Semiconductor
Product Reliability Report
AOTF11S65,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOTF11S65.
Accelerated environmental tests are performed on a specific sample size, and then followed by
electrical test at end point. Review of final electrical test result confirms that AOTF11S65 passes
AOS quality and reliability requirements.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Reliability Stress Test Summary and Result
Reliability Evaluation
Appendix: Test data
I. Product Description:
The AOTF11S65 has been fabricated using the advanced MOS high voltage process that is
designed to deliver high levels of performance and robustness in switching applications. By
providing low RDS(on), Qg and EOSS along with guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply designs.
TM
For Halogen Free add "L" suffix to part number: AOTF11S65L
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bonding
Mold Material
Moisture Level
AOTF11S65
Standard sub-micron
650V Power Transistor
TO220F
Bare Cu
Soft solder
Al wire
Epoxy resin with silica filler
Up to Level 1
2
III. Result of Reliability Stress for AOTF11S65
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
21 lots
168hrs
500 hrs
1000 hrs
3 lots
5 lots
Temp = 150°c ,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
3 lots
5 lots
77 pcs / lot
HAST
130°c , 85%RH,
33.3 psi, Vgs =
100% of Vgs max
96 hrs
15 lots
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hrs
HTGB
HTRB
Temperature
Cycle
-65°c to 150°c ,
air to air,
250 / 500
cycles
Lot
Attribution
Total
Sample size
Number
of
Failures
Reference
Standard
4158pcs
0
JESD22A113
616pcs
0
JESD22A108
0
JESD22A108
1155pcs
0
JESD22A110
(Note A*)
18 lots
77 pcs / lot
1386pcs
0
JESD22A102
(Note A*)
77 pcs / lot
0
JESD22A104
77 pcs / lot
616pcs
21 lots
(Note A*)
1617pcs
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3.52
MTTF = 32413 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOTF11S65). Failure Rate Determination is based on
JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate (FIT) = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.83 x 10 / [2x (8x77x500 +10x77x1000) x259] = 3.52
9
8
MTTF = 10 / FIT = 2.84 x 10 hrs = 32413 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 x 10-5eV / K
130 deg C
150 deg C
2.59
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