WFF4N65L
Product Description
Silicon N-Channel MOSFET
Features
D
�
4.0A,650V,RDS(on)(Max2.5Ω)@VGS=10V
�
Low Crss (typical 3.62pF )
�
Fast switching
�
100% avalanche tested
�
Improved dv/dt capability
�
Maximum Junction Temperature Range(150℃)
G
S
General Description
This Power
MOSFET is produced using Winsemi's advanced
planar stripe,VDMOS technology.this latest technology has been
especially designed to minimize on-state resistance, have a high
rugged avalanche characteristics .This devices is specially well
suited for half bridge and full bridge resonant topology line a
electronic lamp ballast, high efficiency switched mode power
supplies, active power factor correction.
Absolute Maximum Ratings
Symbol
VDSS
Parameter
Value
Units
650
V
Continuous Drain Current(@Tc=25℃)
4
A
Continuous Drain Current(@Tc=100℃)
2.5
A
16
A
±30
V
Drain Source Voltage
ID
IDM
Drain Current Pulsed
(Note1)
VGS
Gate to Source Voltage
EAS
Single Pulsed Avalanche Energy
(Note2)
256
mJ
EAR
Repetitive Avalanche Energy
(Note1)
11
mJ
dv/dt
Peak Diode Recovery dv /dt
(Note3)
5.5
V/ns
33
W
Derating Factor above 25℃
0.26
W/℃
TJ
Junction Temperature
150
℃
Tstg
Storage Temperature
-55~150
℃
Total Power Dissipation(@Tc=25℃)
PD
Thermal Characteristics
Symbol
Value
Parameter
Min
Typ
Max
Units
RQJC
Thermal Resistance , Junction -to -Case
-
-
3.79
℃/W
RQJA
Thermal Resistance , Junction-to -Ambient
-
-
62.5
℃/W
WT-F119-Rev.A0 Dec.2015(B0）
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WFF4N65L Product Description
Silicon N-Channel MOSFET
Electrical Characteristics(Tc=25℃)
Characteristics
Symbol
Gate leakage current
Gate-source breakdown voltage
Drain Cut -off current
Test Condition
Min
Type
Max
Unit
IGSS
VGS=±30V,VDS=0V
-
-
±100
nA
V(BR)GSS
IG=±10 µA,VDS=0V
±30
-
-
V
VDS=650V,VGS=0V,TC=25℃
-
-
10
µA
VDS=520V,Tc=125℃
-
-
100
µA
ID=250 µA,Referenced to 25℃
-
0.65
-
V/℃
IDSS
Breakdown voltage Temperature coefficient
△BVDSS/△TJ
V(BR)DSS
ID=250 µA,VGS=0V
650
-
-
V
Gate threshold voltage
VGS(th)
VDS=VGS,ID=250 µA
2
-
4
V
Drain -source ON resistance
RDS(ON)
VGS=10V,ID=2A
-
2.1
2.5
Ω
Forward Transconductance
gfs
VDS=40V,ID=2A
-
2.5
-
S
Input capacitance
Ciss
VDS=25V,
-
637
800
Reverse transfer capacitance
Crss
VGS=0V,
-
3.62
10
Output capacitance
Coss
f=1MHz
-
62
82
VDD=300V,
-
20
60
Drain -source breakdown voltage
Turn-on Rise time
tr
Turn-on delay time
Td(on)
ID=4.0A
-
18
40
tf
RG=25Ω
-
19
90
-
46
90
-
15.5
28
-
3.40
-
-
6.51
-
Min
Type
Switching time
pF
ns
Turn-off Fall time
Turn-off delay time
(Note4,5)
Td(off)
Total gate charge(gate-source
VDD=480V,
Qg
plus gate-drain)
VGS=10V,
nC
Gate-source charge
Qgs
Gate-drain("miller") Charge
Qgd
ID=4.0A
(Note,5)
Source-Drain Ratings and Characteristics(Ta=25℃)
Characteristics
Symbol
Test Condition
Max
Unit
Continuous drain reverse current
IDR
-
-
-
4.5
A
Pulse drain reverse current
IDRP
-
-
-
16
A
Forward voltage(diode)
VDSF
IDR=4.0A,VGS=0V
-
-
1.4
V
Reverse recovery time
trr
IDR=4.0A,VGS=0V,
-
260
-
ns
Reverse recovery charge
Qrr
dIDR /dt =100 A /µs
-
1.33
-
µC
Note 1.Repeativity rating :pulse width limited by junction temperature
2.L=42mH IAS=4.0A,VDD=50V,RG=25Ω,Starting TJ=25℃
3.ISD≤4.5A,di/dt≤200A/us,VDD<BVDSS,Starting TJ=25℃
4.Pulse Test:Pulse Width≤300us,Duty Cycle≤2%
5. Essentially independent of operating temperature.
This transistor is an electrostatic sensitive device
Please handle with caution
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WFF4N65L Product Description
Silicon N-Channel MOSFET
10
VGS
TOP 15V
10V
8V
7V
6.5V
6V
5.5V
Bottom 5V
1 5 0℃
ID[A]
ID[A]
10
1
25℃
1
Note:
1.250us pulse test
2. VD S =40V
Note:
1.250us pulse test
2.Tc=250℃
0 .1
10
2
4
8
6
VDS[V]
10
V G S [V ]
Fig.1 On Region Characteristics
Fig.2 Transfer Characteristics
10
3.2
3.0
VGS=10V
2.6
25℃
IDR[A]
VGS=20V
2.4
]
RDS(ON)[Ω]
2.8
1
150℃
2.2
Note:
1.250us pulse test
2.VGS=0V
2.0
Note:Tj=25℃
1.8
0.1
0
1
2
3
4
5
6
0.4
0.5
0.6
0.7
0.8
ID[A]
0.9
1.0
1.1
1.2
1.3
VGS[V]
Fig.3 On-Resistance Variation vs Drain
Current and Gate Voltage
Fig.4 Body Diode Forward Voltage Variation
vs. Source Current and Temperature
12
1500
Ciss=Cgs+Cgd(Cds =shorted)
VDS=480V
C iss
1000
C o ss
500
Note:
1.V G S =0V
2 . f=1MHz
C rss
10
VDS=300V
VDS=120V
8
6
4
2
V
Ca pacitance[pF ]
Crs s =Cgd
VGS Gate Source Voltage[v]
Coss=Cds+Cgd
0
0
10
-1
10
0
10
1
0
V D S [V]
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6
8 10 12
14 16 18
20 22
24 26 28
30
Qg Toltal Gate Charge[nC]
Fig.5 Capacitance Characteristics
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Fig.6 Gate Charge Characteristics
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WFF4N65L Product Description
Silicon N-Channel MOSFET
3.0
1.15
2.5
BVDS(on)(Normalized)
BVDSS(Normalized)
1.10
1.05
1.00
0.95
Notes：
3、VGS=0V
4、ID=250uA
0.90
2.0
1.5
1.0
Notes：
1、VGS=10V
2、ID=2.0A
0.5
0
-75
-50
-25
0
25
50
75
100
125
0
150
-75
-50
-25
0
25
50
75
100
125
150
Tj[℃]
Tj[℃]
Fig.8On-Resistance Variation
vs. Temperature
Fig.7 Breakdown Voltage Variation
vs. Temperature
4
Operation in This Area
is L im ite d b y R D S(on)
10
1
100us
1m s
3
I D [A]
100ms
100
D C
10
2
-1
1
N otes:
1 .Tc= 2 5 °C
2 . T J=150°C
3.Single pulse
1 0 -2
100
0
101
10 2
103
25
VD S [V]
50
75
100
125
150
Tc [℃]
Fig.10 Maximum Drain Current
vs Case temperature
Fig.9 Maximum Safe Operation Area
Z θJ C ( t),T her mal R esp ons e
I D[A]
10ms
D =0 . 5
0
10
0 .2
*N o te ：
0 .1
1.Z θJ C ( t) =3.79°C/W Max.
2.Duty Factor,D=t1/t2
3.T JM- T C =PDM * Z θJ C ( t)
0.05
0.02
-1
10
PD M
0.01
t1
t2
S in g le P u lse
10
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
T 1 [sec]
Fig.11 Transient thermal Response Curve
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WFF4N65L Product Description
Silicon N-Channel MOSFET
50K Ω
12V
VG S
Same type
as D U T
Qg
200nF
10V
300nF
VD S
VG S
Qg s
Qg d
DUT
3m A
Ch a rg e
Fig.12 Gate Test circuit & Waveform
VD S
RG
RL
VD S
90%
VD D
VG S
VG S
DUT
10V
10%
td(on)
tr
td(off)
to n
tf
to f f
Fig.13 Resistive Switching Test Circuit & Waveform
L
EA S =
VD S
B V DSS
B V D S S - VD D
B V DSS
IA S
ID
RG
VD D
DUT
10V
1
L IA S 2
2
I D( t)
VD S( t )
VD D
tp
tp
Tim e
Fig.14 Unclamped Inductive Switching Test Circuit & Waveform
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WFF4N65L Product Description
Silicon N-Channel MOSFET
DUT
VD S
IS D
L
Driver
RG
S am e Type
as DUT
VG S
VD D
dv/dt controlled by RG
IS D conteolled by pulse period
VG S
D =
(Driver)
Gate Pulse Width
Gate Pulse Period
10V
IF M ,Body Diode Forward Current
IS D
di/dt
(DUT)
IR M
Body Diode Reverse Current
VD S
(DUT)
Body Diode Recovery dv/dt
VD D
VS D
Body Diode
Forward Voltage Drop
Fig.15 Peak Diode Recovery dv/dt Test Circuit & Waveform
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WFF4N65L Product Description
Silicon N-Channel MOSFET
TO-220F Package Dimension
U n it:m m
E
符 号
Symbol
M IN
MAX
A
4 .5
4 .9
B
-
1 .4 7
b
0 .7
0 .9
c
0 .4 5
0 .6
D
1 5 .6 7
1 6 .0 7
E
9 .9 6
1 0 .3 6
Q
F
L2
D
P
e
B
F
2 .3 4
2 .7 4
L
1 2 .5 8
1 3 .3 8
L2
3 .1 3
3 .3 3
ФP
3 .0 8
3 .2 8
Q
3 .2
3 .4
Q1
2 .5 6
2 .9 6
L
b
C
2.54TYPE
Q1
e
A
e
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WFF4N65L Product Description
Silicon N-Channel MOSFET
NOTE:
1.We strongly recommend customers check carefully on the trademark when buying our product, if there is any
question, please don't be hesitate to contact us.
2.Please do not exceed the absolute maximum ratings of the device when circuit designing.
3.Winsemi Microelectronics Co., Ltd reserved the right to make changes in this specification sheet and is
subject to change without prior notice.
CONTACT:
Winsemi Microelectronics Co., Ltd.
ADD:Room 1002, East, Phase 2, HighTech Plaza,Tian-An Cyber Park,Che gong miao, FuTian, Shenzhen, P.R.
China.
Post Code : 518040
Tel : +86-755-8250 6288
FAX : +86-755-8250 6299
Web Site : www.winsemi.com
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