Component Construction Vishay Semiconductors Component Construction Photodetector and infrared emitter components are available in plastic or metal packages. Plastic devices mostly include a lens to improve radiant sensitivity or radiant intensity. Detector chips are mounted on flat leadframe surfaces while leadframes for emitters have a silver plated reflector performing higher radiant intensity. Devices in metal packages are hermetically sealed, are released for extended operating temperature range and have small optical and mechanical tolerances. IRED chip PIN diode chip Collimating lens AU-bond wire Black plastic package daylight blocking filter Reflector Plastic package Lead frame Anode Cathode 94 8165 Cathode Anode PIN diode chip 94 8314 Chip Glass window Bond wire Reflector cone filled with epoxy Metal can package White plastic case Anode Leadframe Cathode Polarity identification 96 11621-1 94 8315 www.vishay.com 1 For technical questions concerning emitters, contact: [email protected] For technical questions concerning detectors, contact: [email protected] Document Number: 80081 Rev. 1.3, 06-Jun-08