VSMB3940X01 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 940 nm, GaAlAs Double Hetero FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 • Peak wavelength: λp = 940 nm • High reliability • High radiant power • High radiant intensity • Angle of half intensity: ϕ = ± 60° 948553 • Low forward voltage • Suitable for high pulse current operation • High modulation bandwidth: fc = 24 MHz • Good spectral matching with Si photodetectors DESCRIPTION • Floor life: 168 h, MSL 3, acc. J-STD-020 VSMB3940X01 is an infrared, 940 nm emitting diode in GaAlAs double hetero (DH) technology with high radiant power and high speed, molded in a PLCC-2 package for surface mounting (SMD). • Lead (Pb)-free reflow soldering acc. J-STD-020 • AEC-Q101 qualified • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • IrDA compatible data transmission • Miniature light barrier • Photointerrupters • Optical switch • Control and drive circuits • Shaft encoders PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λp (nm) tr (ns) VSMB3940X01 13 ± 60 940 15 Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMB3940X01-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2 VSMB3940X01-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2 Note • MOQ: minimum order quantity Rev. 1.7, 05-Dec-13 Document Number: 81894 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB3940X01 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage IF 100 mA Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 1.5 A PV 160 mW Forward current Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb -40 to +85 °C Tstg -40 to +100 °C Soldering temperature t ≤ 5 s, 2 mm from case Tsd 260 °C Thermal resistance junction/ambient J-STD-051, leads 7 mm, soldered on PCB RthJA 250 K/W Storage temperature range 120 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 140 120 100 RthJA = 250 K/W 80 60 40 100 80 60 RthJA = 250 K/W 40 20 20 0 0 0 10 21343 20 30 40 50 60 70 80 90 0 100 Tamb - Ambient Temperature (°C) 10 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 21344 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of φe TEST CONDITION SYMBOL MIN. TYP. MAX. IF = 100 mA, tp = 20 ms VF 1.15 1.35 1.6 IF = 1 A, tp = 100 μs VF 2.2 V mV/K IF = 1 mA TKVF -1.8 IF = 100 mA TKVF -1.1 VR = 5 V IR VR = 0 V, f = 1 MHz, E = 0 mW/cm2 CJ IF = 100 mA, tp = 20 ms Ie 13 V mV/K 10 μA 21 mW/sr 70 7 UNIT pF IF = 1 A, tp = 100 μs Ie 130 IF = 100 mA, tp = 20 ms φe 40 mW IF = 1 mA TKφe -1.1 %/K IF = 100 mA TKφe -0.51 %/K ϕ ± 60 deg nm Angle of half intensity mW/sr Peak wavelength IF = 30 mA λp 940 Spectral bandwidth IF = 30 mA Δλ 25 nm Temperature coefficient of λp IF = 30 mA TKλp 0.25 nm/K Rise time IF = 100 mA, 20 % to 80 % tr 15 ns Fall time IF = 100 mA, 20 % to 80 % tf 15 ns IDC = 70 mA, IAC = 30 mA pp fc 24 MHz d 0.5 mm Cut-off frequency Virtual source diameter Rev. 1.7, 05-Dec-13 Document Number: 81894 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB3940X01 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 180 Ie rel - Relative Radiant Intensity (%) 100 10 tp = 100 µs tp/T= 0.001 1 0 1 2 140 120 IF = 100 mA 100 80 60 tp = 20 ms 40 3 VF - Forward Voltage (V) 21534 IF = 1 mA 160 - 60 - 40 - 20 Fig. 3 - Forward Current vs. Forward Voltage 20 60 80 100 106 104 102 IF = 100 mA 100 IF = 10 mA 98 tp = 20 ms 96 94 IF = 1 mA 92 Φe rel - Relative Radiant Power (%) 100 108 - 40 - 20 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) 21443 90 IF = 30 mA 80 70 60 50 40 30 20 10 0 840 90 880 920 960 1000 1040 λ - Wavelength (nm) 21445 Fig. 4 - Relative Forward Voltage vs. Ambient Temperature Fig. 7 - Relative Radiant Power vs. Wavelength 0° 1000 10° 20° 30° Ie, rel - Relative Radiant Intensity Ie - Radiant Intensity (mW/sr) 40 Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature 110 VF, rel - Relative Forward Voltage (%) 0 Tamb - Ambient Temperature (°C) 21444 100 10 1 tP = 0.1 ms 40° 1.0 0.9 50° 0.8 60° 70° 0.7 ϕ - Angular Displacement IF - Forward Current (mA) 1000 80° 0.1 1 21420 10 100 1000 IF - Forward Current (mA) Fig. 5 - Radiant Intensity vs. Forward Current Rev. 1.7, 05-Dec-13 0.6 0.4 0.2 0 948013-1 Fig. 8 - Relative Radiant Intensity vs. Angular Displacement Document Number: 81894 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB3940X01 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 0.9 1.75±0.1 3.5±0.2 0.8 Technical drawings according to DIN specifications C A 2.2 2.8±0.15 Pin identification Dimensions in mm Drawing-No.: 6.541-5067.01-4 Issue: 6; 23.09.13 Ø2.4 3 +0.15 Mounting Pad Layout Area covered with solderresist 4 2.6 (2.8) 1.2 1.6 (1.9) 4 Dimensions: Reflow and vapor phase (wave soldering) DRYPACK SOLDER PROFILE 300 255 °C 240 °C 217 °C 250 Temperature (°C) max. 260 °C 245 °C FLOOR LIFE 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, acc. to J-STD-020 DRYING 0 0 19841 50 100 150 200 250 300 Time (s) Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.7, 05-Dec-13 In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Document Number: 81894 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB3940X01 www.vishay.com Vishay Semiconductors TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. 10.0 9.0 120° 4.5 3.5 Identification Label: Vishay type group tape code production code quantity Blister tape Component cavity 14.4 max. 180 178 94 8665 Fig. 13 - Dimensions of Reel-GS08 2.2 2.0 3.5 3.1 3.6 3.4 4.5 3.5 4.0 3.6 13.00 12.75 2.5 1.5 8.3 7.7 Identification Label: Vishay type group tape code production code quantity 1.85 1.65 4.1 3.9 10.4 8.4 120° 5.75 5.25 4.1 3.9 63.5 60.5 94 8670 Fig. 10 - Blister Tape 1.6 1.4 13.00 12.75 2.5 1.5 Adhesive tape 0.25 2.05 1.95 94 8668 Fig. 11 - Tape Dimensions in mm for PLCC-2 MISSING DEVICES 62.5 60.0 321 329 14.4 max. 18857 Fig. 14 - Dimensions of Reel-GS18 A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. De-reeling direction 94 8158 COVER TAPE REMOVAL FORCE The removal force lies between 0.1 N and 1.0 N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. > 160 mm Tape leader 40 empty compartments min. 75 empty compartments Carrier leader Carrier trailer Fig. 12 - Beginning and End of Reel The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartements. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartements and sealed with cover tape. Rev. 1.7, 05-Dec-13 Document Number: 81894 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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