FPBGA Pbfree Auwire1152

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
4.04%
0.222
Mold
34.02%
1.871
D/A Epoxy
0.57%
0.61%
0.0339
Solder Balls
20.33%
1.118
Foil
19.32%
21.10%
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Die size: 17.25 x 17.72 mm
Mold Compound composition:
75 to 95% Silica filler (LSC uses 88% in our calculation)
1 to 10% Epoxy resin (LSC uses 6% in our calculation)
2 to 8% Phenolic resin (LSC uses 6% in our calculation)
Mold Compound Density ranges between 1.95 and 2.05 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 15% in our calculation)
1 to 5% Functionalized Urethane (LSC uses 5% in our calculation)
1.647
0.1123
0.1123
Silica
Epoxy resin
Phenol resin
60676-86-0
-
0.45%
0.09%
0.28%
0.0250
0.0047
0.0156
Silver (Ag)
Organic esters and resins
Functionalized Urethane
7440-22-4
-
Gold (Au)
7440-57-5
Wire: 0.0127 mm (radius)
Assume 1 wire per solder ball
19.62%
0.61%
0.10%
1.079
0.0335
0.0056
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Qualified Solder ball compositions:
Sn96.5/Ag3/Cu0.5
13.14%
6.18%
0.723
0.340
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
1.063
1.160
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Notes / Assumptions:
29.94%
2.04%
2.04%
0.0313
Wire
Substrate
1152 fpBGA
5.50
Grams