FPBGA Pbfree Auwire1156

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
4.12%
0.222
Mold
32.73%
1.767
D/A Epoxy
0.58%
0.63%
0.0339
Solder Balls
20.78%
1.122
Foil
19.68%
21.49%
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
MSL: 3
Peak Reflow Temp: 250°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 17.5 x 17.72 mm
Mold Compound composition:
75 to 95% Silica filler (LSC uses 88% in our calculation)
1 to 10% Epoxy resin (LSC uses 6% in our calculation)
2 to 8% Phenolic resin (LSC uses 6% in our calculation)
Mold Compound Density ranges between 1.95 and 2.05 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 15% in our calculation)
1 to 5% Functionalized Urethane (LSC uses 5% in our calculation)
28.80%
1.96%
1.96%
1.555
0.1060
0.1060
Silica
Epoxy resin
Phenol resin
60676-86-0
-
0.46%
0.09%
0.03%
0.0250
0.0047
0.0016
Silver (Ag)
Organic esters and resins
Functionalized Urethane
7440-22-4
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball
0.0313
Wire
Substrate
1156 fpBGA
5.40
Grams
20.05%
0.62%
0.10%
1.083
0.0337
0.0056
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Qualified Solder ball compositions:
Sn96.5/Ag3/Cu0.5
13.38%
6.30%
0.723
0.340
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
1.063
1.160
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B1