FPBGA SNPB Auwire900

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
6.98%
0.3003
Mold
34.95%
1.503
D/A Epoxy
0.98%
0.61%
0.0264
Solder Balls
24.12%
1.037
Foil
21.76%
10.59%
with SnPb Solder Balls
% of Total
Weight (g)
Pkg. Wt.
MSL: 3
Peak Reflow Temp: 225°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 19.8 x 21.0 mm
29.88%
3.84%
1.05%
0.17%
1.285
0.1653
0.0451
0.0075
Silica
Epoxy and Phenolic Resin
Antimony Oxide
Carbon Black
60676-86-0
1309-64-4
-
0.79%
0.17%
0.03%
0.0338
0.0072
0.0013
Silver
Organic esters and resins
Functionalized Urethane
7440-22-4
-
Mold Compound composition:
80 to 95% silica filler (LSC uses 85.5% in our calculation)
5 to 20% Epoxy and Phenolic resin (LSC uses 11% in our calculation)
1 to 5% Antimony Oxide (LSC uses 3% in our calculation)
0 to 0.5% Carbon Black LSC uses 0.5% in our calculation)
Mold Compound Density ranges between 1.95 and 2.2 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 17% in our calculation)
1 to 5% Functionalized Urethane (LSC uses 3% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball
0.0422
Wire
Substrate
900 fpBGA
4.20
Grams
15.19%
8.92%
0.653
0.384
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Solder ball composition Sn63/Pb37
14.80%
6.96%
0.636
0.299
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.936
0.455
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B4