Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 6.98% 0.3003 Mold 34.95% 1.503 D/A Epoxy 0.98% 0.61% 0.0264 Solder Balls 24.12% 1.037 Foil 21.76% 10.59% with SnPb Solder Balls % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 225°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 19.8 x 21.0 mm 29.88% 3.84% 1.05% 0.17% 1.285 0.1653 0.0451 0.0075 Silica Epoxy and Phenolic Resin Antimony Oxide Carbon Black 60676-86-0 1309-64-4 - 0.79% 0.17% 0.03% 0.0338 0.0072 0.0013 Silver Organic esters and resins Functionalized Urethane 7440-22-4 - Mold Compound composition: 80 to 95% silica filler (LSC uses 85.5% in our calculation) 5 to 20% Epoxy and Phenolic resin (LSC uses 11% in our calculation) 1 to 5% Antimony Oxide (LSC uses 3% in our calculation) 0 to 0.5% Carbon Black LSC uses 0.5% in our calculation) Mold Compound Density ranges between 1.95 and 2.2 grams/cc Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 10 to 30% Organic Esters and Resins (LSC uses 17% in our calculation) 1 to 5% Functionalized Urethane (LSC uses 3% in our calculation) Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per solder ball 0.0422 Wire Substrate 900 fpBGA 4.20 Grams 15.19% 8.92% 0.653 0.384 Tin (Sn) Lead (Pb) 7440-31-5 7439-92-1 Solder ball composition Sn63/Pb37 14.80% 6.96% 0.636 0.299 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.936 0.455 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B4