FPBGA Pbfree Auwire900_9065nmprods

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
1.64%
0.0672
Mold
41.74%
1.711
D/A Epoxy
0.23%
0.64%
0.0264
Solder Balls
21.82%
0.895
Foil
22.82%
11.10%
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
(90nm and 65nm products)
MSL: 3
Peak Reflow Temp: 250°C
Substance
CAS #
Silicon chip
7440-21-3
Die size: 9.49 x 9.80 mm
Notes / Assumptions:
37.07%
2.09%
1.67%
0.08%
0.83%
1.520
0.0856
0.0685
0.0034
0.0342
Silica (Fused or Amorphous)
Epoxy resin
Phenol resin
Carbon Black
Other
60676-86-0
1333-86-4
-
Mold Compound composition:
85 to 95% Silica Fused or Amorphous (LSC uses 88.8% in our calculation)
1.5 to 8% Epoxy resin (LSC uses 5% in our calculation)
3 to 6% Phenol resin (LSC uses 4% in our calculation)
Carbon Black appox. 0.2%
Others approx. 2%
0.18%
0.05%
0.0076
0.0019
Silver
Organic esters and resins
7440-22-4
7440-22-4
-
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball
0.0094
Wire
Substrate
900 fpBGA
4.10
Grams
21.05%
0.65%
0.11%
0.863
0.0268
0.0045
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn96.5/Ag3/Cu0.5
15.52%
7.30%
0.636
0.299
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.936
0.455
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B4