Reliability Report

AOS Semiconductor
Product Reliability Report
AOD407
rev C
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOD407. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOD407 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
Quality Assurance Information
I. Product Description:
The AOD407 uses advanced trench technology to provide excellent RDS(ON), low gate charge and
low gate resistance. With the excellent thermal resistance of the DPAK package, this device is
well suited for high current load applications.
-RoHS Compliant
-Halogen Free
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II. Die / Package Information:
AOD407
Standard sub-micron
Low voltage P channel process
3 leads TO252
Bare Cu
Soft solder
G: Au 1.3mils; S: Al 12mils
Epoxy resin with silica filler
UL-94 V-0
Ti / Ni / Ag
Up to Level 1 *
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Flammability Rating
Backside Metallization
Moisture Level
Note * based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AOD407
Test Item
Test Condition
Time
Point
Solder
Reflow
Precondition
HTGB
168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vgs=100% of Vgsmax
HTRB
HAST
Pressure Pot
Lot Attribution
Total
Sample
size
-
9 lots
1210pcs
0
168 / 500
hrs
6 lots
492pcs
0
1000 hrs
(Note A*)
168 / 500
hrs
6 lots
1000 hrs
(Note A*)
130 +/- 2°c , 85%RH,
33.3 psi, Vgs = 80% of
Vgs max
100 hrs
9 lots
121°c , 29.7psi,
100%RH
96 hrs
Temp = 150°c ,
Vds=80% of Vdsmax
(Note B**)
5 lots
(Note B**)
Temperature
Cycle
-65°c to 150°c ,
air to air,
250 / 500
cycles
8 lots
(Note B**)
Number
of
Failures
77+5 pcs /
lot
492pcs
0
77+5 pcs /
lot
495pcs
0
50+5 pcs /
lot
275pcs
0
50+5 pcs /
lot
440pcs
0
50+5 pcs /
lot
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III. Result of Reliability Stress for AOD407
Continues
DPA
Internal Vision
Cross-section
X-ray
CSAM
NA
5
5
5
5
5
5
0
NA
5
5
0
Bond Integrity
Room Temp
150°°c bake
150°°c bake
0hr
250hr
500hr
40
40
40
40 wires
40 wires
40 wires
0
Solderability
245°°c
5 sec
15
15 leads
0
Solder dunk
260°°c
10secs
3 cycles
1
30 units
0
Note A: The HTGB and HTRB reliability data presents total of available AOD407 burn-in data up
to the published date.
Note B: The pressure pot, temperature cycle and HAST reliability data for AOD407 comes from
the AOS generic package qualification data.
IV. Reliability Evaluation
FIT rate (per billion): 9
MTTF = 12331 years
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