AOS Semiconductor Product Reliability Report AOD407 rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD407. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD407 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information I. Product Description: The AOD407 uses advanced trench technology to provide excellent RDS(ON), low gate charge and low gate resistance. With the excellent thermal resistance of the DPAK package, this device is well suited for high current load applications. -RoHS Compliant -Halogen Free 2 II. Die / Package Information: AOD407 Standard sub-micron Low voltage P channel process 3 leads TO252 Bare Cu Soft solder G: Au 1.3mils; S: Al 12mils Epoxy resin with silica filler UL-94 V-0 Ti / Ni / Ag Up to Level 1 * Process Package Type Lead Frame Die Attach Bond wire Mold Material Flammability Rating Backside Metallization Moisture Level Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AOD407 Test Item Test Condition Time Point Solder Reflow Precondition HTGB 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax HTRB HAST Pressure Pot Lot Attribution Total Sample size - 9 lots 1210pcs 0 168 / 500 hrs 6 lots 492pcs 0 1000 hrs (Note A*) 168 / 500 hrs 6 lots 1000 hrs (Note A*) 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 100 hrs 9 lots 121°c , 29.7psi, 100%RH 96 hrs Temp = 150°c , Vds=80% of Vdsmax (Note B**) 5 lots (Note B**) Temperature Cycle -65°c to 150°c , air to air, 250 / 500 cycles 8 lots (Note B**) Number of Failures 77+5 pcs / lot 492pcs 0 77+5 pcs / lot 495pcs 0 50+5 pcs / lot 275pcs 0 50+5 pcs / lot 440pcs 0 50+5 pcs / lot 3 III. Result of Reliability Stress for AOD407 Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°°c bake 150°°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°°c 5 sec 15 15 leads 0 Solder dunk 260°°c 10secs 3 cycles 1 30 units 0 Note A: The HTGB and HTRB reliability data presents total of available AOD407 burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AOD407 comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 9 MTTF = 12331 years 4