Document No.001-70705 Rev. *B ECN # 4489422 Cypress Semiconductor Package Qualification Report QTP#112106 VERSION *B September 2014 40 QFN (6x6x1.0mm) / 48 QFN (7x7x1.0mm) Stack Die NiPdAu, MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-70705 Rev. *B ECN # 4489422 PACKAGE QUALIFICATION HISTORY QTP Number 112106 Description of Qualification Purpose Qualification of 40/48 QFN 6x6x1.0mm/7x7x1.0mm (LT40B and LT48E) package dimensions at ASEKH (G) using G631 mold compound and FH900 Die Attach Film Date Jul 2011 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 7 Document No.001-70705 Rev. *B ECN # 4489422 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Mold Compound Name/Manufacturer: LT40B / LT48E 40 Quad Flat No-Lead(6X6X1.0mm) 48 Quad Flat No-Lead(7X7X1.0mm) G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: FH-900 Bond Diagram Designation 001-69183, 001-69180 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA C/W: 21.24°C/W, 30°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C Package Outline, Type, or Name: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R, KYEC Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 7 Document No.001-70705 Rev. *B ECN # 4489422 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Result P/F High Temp Storage 130 C, 85%RH, 5.25V / 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 150 C, no bias Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy (2200V) JEDEC EIA/JESD22-A114-B (500V) JESD22-C101 J-STD-020 P Ball Shear AEC-Q100-001 P Bond Pull MIL-STD-883 – Method 2011 P Pressure Cooker Test Temperature Cycle P P P P P P Internal Visual Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 P Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock JESD22-A106B Constructional Analysis Dye Penetrant Test Solderability, Steam Aged J-STD-002, JESD22-B102 P P P P 95% solder coverage minimum X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P Document No.001-70705 Rev. *B ECN # 4489422 Reliability Test Data QTP #: 112106 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN COMP 15 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN COMP 15 0 CYRF69103 (7B691035A) 4035722 611121434 G-TAIWAN COMP 15 0 CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN COMP 10 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN COMP 10 0 CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN COMP 10 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN COMP 10 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN COMP 5 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN COMP 5 0 CYRF69103 (7B691035A) 4035722 611121434 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN COMP 15 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN COMP 15 0 CYRF69103 (7B691035A) 4035722 611121434 G-TAIWAN COMP 15 0 G-TAIWAN COMP 9 0 COMP 8 0 STRESS: ESD-CHARGE DEVICE MODEL, (500V) CYRF69103 (7B691035A) 4035722 611121435 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMA340 (8C20322D) 4103513 611119447 G-TAIWAN 128 79 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN 128 79 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 7 Document No.001-70705 Rev. *B ECN # 4489422 Reliability Test Data QTP #: 112106 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STORAGE, 150C CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 500 80 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 1000 80 0 CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN COMP 5 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN COMP 5 0 CYRF69103 (7B691035A) 4035722 611121434 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN 168 80 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN 168 80 0 STRESS: PHYSICAL DIMENSION CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN COMP 30 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN COMP 30 0 CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN COMP 3 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN COMP 3 0 CYRF69103 (7B691035A) 4035722 611121434 G-TAIWAN COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN 1000 79 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN 1000 79 0 CYRF69103 (7B691035A) 4035722 611121434 G-TAIWAN 1000 80 0 CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN 200 80 0 CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN 1000 80 0 CYRF69103 (7B691035A) 4035722 611121435 G-TAIWAN COMP 15 0 CYWUSB6953 (7B6953A) 4037380 611120870 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-70705 Rev. *B ECN # 4489422 Document History Page Document Title: QTP 112106: 40 QFN (6X6X1.0MM) / 48 QFN (7X7X1.0MM), STACK DIE, NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN Document Number: 001-70705 Rev. ECN No. ** 3240851 *A 4104452 *B Orig. of Change NSR HSTO 4489422 HSTO Description of Change Initial spec release Sunset Review Remove VERSION 1.0 in front page Added reference Industry standards in reliability tests performed and removed all the reference Cypress specs. Updated test location facility based on current qualified test site Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7