QTP 112106:40 QFN (6X6X1.0MM) / 48 QFN (7X7X1.0MM), STACK DIE, NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN

Document No.001-70705 Rev. *B
ECN # 4489422
Cypress Semiconductor
Package Qualification Report
QTP#112106 VERSION *B
September 2014
40 QFN (6x6x1.0mm) /
48 QFN (7x7x1.0mm)
Stack Die
NiPdAu, MSL3, 260C Reflow
ASEK-Taiwan (G)
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-70705 Rev. *B
ECN # 4489422
PACKAGE QUALIFICATION HISTORY
QTP
Number
112106
Description of Qualification Purpose
Qualification of 40/48 QFN 6x6x1.0mm/7x7x1.0mm (LT40B and
LT48E) package dimensions at ASEKH (G) using G631 mold
compound and FH900 Die Attach Film
Date
Jul 2011
Company Confidential
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Page 2 of 7
Document No.001-70705 Rev. *B
ECN # 4489422
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Mold Compound Name/Manufacturer:
LT40B / LT48E
40 Quad Flat No-Lead(6X6X1.0mm)
48 Quad Flat No-Lead(7X7X1.0mm)
G631 / Sumitomo
Mold Compound Flammability Rating:
V-0 / UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index: >28%
54 (typical) / 28 (Min. value)
Lead Frame Designation:
Full Metal Pad
Lead Frame Material:
Copper /PPF
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
SAW Process
Die Attach Supplier:
Hitachi
Die Attach Material:
FH-900
Bond Diagram Designation
001-69183, 001-69180
Wire Bond Method:
Thermosonic
Wire Material/Size:
0.8mil / Au
Thermal Resistance Theta JA C/W:
21.24°C/W, 30°C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
49-41999
Name/Location of Assembly (prime) facility:
G-ASEK Taiwan
MSL LEVEL
3
REFLOW PROFILE
260C
Package Outline, Type, or Name:
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R, KYEC
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-70705 Rev. *B
ECN # 4489422
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Accelerated Saturation Test
(HAST)
Test Condition (Temp/Bias)
Result
P/F
High Temp Storage
130 C, 85%RH, 5.25V / 5.5V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
150 C, no bias
Electrostatic Discharge
Human Body Model (ESD-HBM)
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Acoustic Microscopy
(2200V)
JEDEC EIA/JESD22-A114-B
(500V)
JESD22-C101
J-STD-020
P
Ball Shear
AEC-Q100-001
P
Bond Pull
MIL-STD-883 – Method 2011
P
Pressure Cooker Test
Temperature Cycle
P
P
P
P
P
P
Internal Visual
Criteria: Meet external and internal characteristics of
Cypress package
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
MIL-STD-883-2014
P
Final Visual Inspection
JESD22-B101B
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Thermal Shock
JESD22-A106B
Constructional Analysis
Dye Penetrant Test
Solderability, Steam Aged
J-STD-002, JESD22-B102
P
P
P
P
95% solder coverage minimum
X-Ray
MIL-STD-883 - 2012
Company Confidential
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Page 4 of 7
P
Document No.001-70705 Rev. *B
ECN # 4489422
Reliability Test Data
QTP #: 112106
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
COMP
15
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
COMP
15
0
CYRF69103 (7B691035A)
4035722
611121434
G-TAIWAN
COMP
15
0
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
COMP
10
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
COMP
10
0
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
COMP
10
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
COMP
10
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYIS
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
COMP
5
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
COMP
5
0
CYRF69103 (7B691035A)
4035722
611121434
G-TAIWAN
COMP
5
0
STRESS: DYE PENETRATION TEST
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
COMP
15
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
COMP
15
0
CYRF69103 (7B691035A)
4035722
611121434
G-TAIWAN
COMP
15
0
G-TAIWAN
COMP
9
0
COMP
8
0
STRESS: ESD-CHARGE DEVICE MODEL, (500V)
CYRF69103 (7B691035A)
4035722
611121435
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY8CTMA340 (8C20322D)
4103513
611119447
G-TAIWAN
128
79
0
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY8C20236A (8C202662B)
5049067
611123647
G-TAIWAN
128
79
0
Company Confidential
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Page 5 of 7
Document No.001-70705 Rev. *B
ECN # 4489422
Reliability Test Data
QTP #: 112106
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: HIGH TEMP STORAGE, 150C
CY7C60323 (8C214340A)
4008254
611114333
G-TAIWAN
500
80
0
CY7C60323 (8C214340A)
4008254
611114333
G-TAIWAN
1000
80
0
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
COMP
5
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
COMP
5
0
CYRF69103 (7B691035A)
4035722
611121434
G-TAIWAN
COMP
5
0
STRESS: INTERNAL VISUAL
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
168
80
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
168
80
0
STRESS: PHYSICAL DIMENSION
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
COMP
30
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
COMP
30
0
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
COMP
3
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
COMP
3
0
CYRF69103 (7B691035A)
4035722
611121434
G-TAIWAN
COMP
3
0
STRESS: SOLDERABILITY
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
1000
79
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
1000
79
0
CYRF69103 (7B691035A)
4035722
611121434
G-TAIWAN
1000
80
0
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
200
80
0
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
1000
80
0
CYRF69103 (7B691035A)
4035722
611121435
G-TAIWAN
COMP
15
0
CYWUSB6953 (7B6953A)
4037380
611120870
G-TAIWAN
COMP
15
0
STRESS: THERMAL SHOCK
STRESS: X-RAY
Company Confidential
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Page 6 of 7
Document No.001-70705 Rev. *B
ECN # 4489422
Document History Page
Document Title:
QTP 112106: 40 QFN (6X6X1.0MM) / 48 QFN (7X7X1.0MM), STACK DIE, NIPDAU, MSL3 260C
REFLOW ASEK- TAIWAN
Document Number:
001-70705
Rev. ECN
No.
**
3240851
*A
4104452
*B
Orig. of
Change
NSR
HSTO
4489422 HSTO
Description of Change
Initial spec release
Sunset Review
Remove VERSION 1.0 in front page
Added reference Industry standards in reliability tests performed and
removed all the reference Cypress specs.
Updated test location facility based on current qualified test site
Align qualification report based on the new template in the front page
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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