SKiiP 25AC12T4V1
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
Inverter - IGBT
MiniSKiiP® 2
VCES
Tj = 25 °C
1200
V
IC
λpaste=0.8 W/(mK) Ts = 25 °C
Tj = 175 °C
Ts = 70 °C
69
A
56
A
IC
λpaste=2.5 W/(mK) Ts = 25 °C
Tj = 175 °C
Ts = 70 °C
78
A
ICnom
ICRM
VGES
tpsc
SKiiP 25AC12T4V1
Features
• Trench 4 IGBTs
• Robust and soft freewheeling diodes in
CAL technology
• Highly reliable spring contacts for
electrical connections
• UL recognised: File no. E63532
Typical Applications*
• Inverter up to 26 kVA
• Typical motor power 15 kW
Tj
• VCEsat , VF= chip level value
• Case temp. limited to TC = 125°C max.
(for baseplateless modules TC = TS)
• product rel. results valid for Tj ≤ 150
(recomm. Top = -40 … +150°C)
A
V
10
µs
-40 ... 175
°C
λpaste=0.8 W/(mK) Ts = 25 °C
Tj = 175 °C
Ts = 70 °C
60
A
48
A
IF
λpaste=2.5 W/(mK) Ts = 25 °C
Tj = 175 °C
Ts = 70 °C
68
A
IFnom
55
A
50
A
IFRM
IFRM = 3 x IFnom
150
A
IFSM
10 ms, sin 180°, Tj = 150 °C
270
A
-40 ... 175
°C
Tj
Module
It(RMS)
Tterminal = 80 °C, 20 A per spring
Tstg
AC sinus 50 Hz, t = 1 min
100
A
-40 ... 125
°C
2500
V
Characteristics
Symbol
Conditions
Inverter - IGBT
IC = 50 A
VCE(sat)
VGE = 15 V
chiplevel
VCE0
chiplevel
min.
typ.
max.
Unit
Tj = 25 °C
1.85
2.10
V
Tj = 150 °C
2.20
2.40
V
Tj = 25 °C
0.80
0.90
V
Tj = 150 °C
0.70
0.80
V
Tj = 25 °C
21
24
mΩ
rCE
VGE = 15 V
chiplevel
VGE(th)
VGE = VCE, IC = 2 mA
ICES
VGE = 0 V, VCE = 1200 V, Tj = 25 °C
Coes
Cres
VCE = 25 V
VGE = 0 V
Tj = 150 °C
5
30
32
mΩ
5.8
6.5
V
0.1
0.3
mA
f = 1 MHz
2.77
nF
f = 1 MHz
0.21
nF
f = 1 MHz
0.16
nF
nC
QG
- 8 V...+ 15 V
283
RGint
4.0
Tj = 150 °C
Ω
54
ns
Tj = 150 °C
36
ns
Tj = 150 °C
6
mJ
Tj = 150 °C
340
ns
tf
Tj = 25 °C
VCC = 600 V
IC = 50 A
RG on = 12 Ω
RG off = 12 Ω
di/dton = 1300 A/µs
di/dtoff = 640 A/µs
Tj = 150 °C
70
ns
Eoff
VGE = +15/-15 V
Tj = 150 °C
4.5
mJ
Rth(j-s)
per IGBT, λpaste=0.8 W/(mK)
0.71
K/W
Rth(j-s)
per IGBT, λpaste=2.5 W/(mK)
0.56
K/W
td(on)
tr
Eon
td(off)
© by SEMIKRON
Tj = 150 °C
150
-20 ... 20
IF
Cies
AC
VCC = 800 V
VGE ≤ 15 V
VCES ≤ 1200 V
A
A
Inverse - Diode
Visol
Remarks
ICRM = 3 x ICnom
64
50
Rev. 4.0 – 04.05.2016
1
SKiiP 25AC12T4V1
Characteristics
Symbol
Conditions
Inverse - Diode
VF = VEC IF = 50 A
VGE = 0 V
chiplevel
VF0
chiplevel
rF
MiniSKiiP® 2
typ.
max.
Unit
Tj = 25 °C
2.22
2.54
V
Tj = 150 °C
2.18
2.50
V
Tj = 25 °C
1.30
1.50
V
Tj = 150 °C
0.90
1.10
V
Tj = 25 °C
18
21
mΩ
26
28
mΩ
8
µC
3.2
mJ
Rth(j-s)
Tj = 150 °C
IF = 50 A
Tj = 150 °C
di/dtoff = 1400 A/µs T = 150 °C
j
VGE = +15/-15 V
T
j = 150 °C
VCC = 600 V
per Diode, λpaste=0.8 W/(mK)
0.95
K/W
Rth(j-s)
per Diode, λpaste=2.5 W/(mK)
0.78
K/W
IRRM
Qrr
Err
SKiiP 25AC12T4V1
chiplevel
min.
51
Module
-
LCE
Ms
Features
• Trench 4 IGBTs
• Robust and soft freewheeling diodes in
CAL technology
• Highly reliable spring contacts for
electrical connections
• UL recognised: File no. E63532
Typical Applications*
A
to heat sink
nH
2
w
2.5
Nm
55
g
1670 ±
3%
Ω
Temperature Sensor
R100
Tr=100°C (R25=1000Ω)
2
R(T)
R(T)=1000Ω[1+A(T-25°C)+B(T-25°C)
], A = 7.635*10-3 °C-1,
B = 1.731*10-5 °C-2
• Inverter up to 26 kVA
• Typical motor power 15 kW
Remarks
• VCEsat , VF= chip level value
• Case temp. limited to TC = 125°C max.
(for baseplateless modules TC = TS)
• product rel. results valid for Tj ≤ 150
(recomm. Top = -40 … +150°C)
AC
2
Rev. 4.0 – 04.05.2016
© by SEMIKRON
SKiiP 25AC12T4V1
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TS)
Fig. 3: Typ. turn-on /-off energy = f (IC)
Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic
Fig. 6: Typ. gate charge characteristic
© by SEMIKRON
Rev. 4.0 – 04.05.2016
3
SKiiP 25AC12T4V1
Fig. 7: Typ. switching times vs. IC
Fig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Transient thermal impedance of IGBT and Diode
Fig. 10: CAL diode forward characteristic
Fig. 11: Typ. CAL diode peak reverse recovery current
Fig. 12: Typ. CAL diode recovery charge
4
Rev. 4.0 – 04.05.2016
© by SEMIKRON
SKiiP 25AC12T4V1
pinout, dimensions
pinout
© by SEMIKRON
Rev. 4.0 – 04.05.2016
5
SKiiP 25AC12T4V1
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, chapter IX.
*IMPORTANT INFORMATION AND WARNINGS
The specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics
("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in
typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective
application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their
applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical
injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is
compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written
document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of
the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is
given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation,
warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the
applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual
property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of
intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain
dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document
supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make
changes.
6
Rev. 4.0 – 04.05.2016
© by SEMIKRON