Si3812DV Vishay Siliconix N-Channel 20 V (D-S) MOSFET with Schottky Diode FEATURES MOSFET PRODUCT SUMMARY VDS (V) 20 RDS(on) () ID (A) 0.125 at VGS = 4.5 V 2.4 0.200 at VGS = 2.5 V 1.8 SCHOTTKY PRODUCT SUMMARY VKA (V) VF (V) Diode Forward Voltage IF (A) 20 0.48 V at 0.5 A 0.5 • Halogen-free According to IEC 61249-2-21 Definition • LITTLE FOOT® Plus • 100 % Rg Tested • Compliant to RoHS Directive 2002/95/EC D K S A TSOP-6 Top View A 1 K 6 G 3 mm S 2 5 N/C G 3 4 D 2.85 mm N-Channel MOSFET Ordering Information: Si3812DV-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol 5s VDS Drain-Source Voltage (MOSFET) Steady State 20 Reverse Voltage (Schottky) VKA 20 Gate-Source Voltage (MOSFET) VGS ± 12 Continuous Drain Current (TJ = 150 °C) (MOSFET)a TA = 25 °C TA = 85 °C ID 2.4 Continuous Source Current (MOSFET Diode Conduction)a V V 2.0 1.7 IDM Pulsed Drain Current (MOSFET) 1.4 8 IS 1.05 0.75 Average Foward Current (Schottky) IF 0.5 0.5 Pulsed Foward Current (Schottky) IFM 8 8 TA = 25 °C 1.15 0.83 TA = 85 °C 0.59 0.53 1.0 0.76 Maximum Power Dissipation (MOSFET)a a Maximum Power Dissipation (Schottky) Operating Junction and Storage Temperature Range TA = 25 °C PD TA = 85 °C 0.52 TJ, Tstg Unit A W 0.48 - 55 to 150 °C Note: a. Surface mounted on 1" x 1" FR4 board. Document Number: 71069 S11-0651-Rev. G, 11-Apr-11 www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Si3812DV Vishay Siliconix THERMAL RESISTANCE RATINGS Parameter Device t5s Schottky Junction-to-Ambienta Steady State Junction to Foot (MOSFET Drain, Schottky Cathode) Symbol MOSFET Steady State MOSFET RthJA Schottky MOSFET Schottky RthJF Typical Maximum 93 110 103 125 130 150 140 165 75 90 80 95 Unit °C/W Note: a. Surface mounted on 1" x 1" FR4 board. MOSFET AND SCHOTTKY SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) Parameter Symbol Test Conditions Min. 0.6 Typ. Max. Unit ± 100 nA Static VGS(th) VDS = VGS, ID = 250 µA Gate-Body Leakage IGSS VDS = 0 V, VGS = ± 12 V Zero Gate Voltage Drain Current (MOSFET and Schottky) IDSS On-State Drain Currenta ID(on) Gate Threshold Voltage Drain-Source On-State Resistancea Forward Transconductancea Schottky Diode Forward Voltagea RDS(on) V VDS = 16 V, VGS = 0 V 1 VDS = 16 V, VGS = 0 V, TJ = 85 °C 10 VDS 5 V, VGS = 4.5 V 5 µA A VGS = 4.5 V, ID = 2.4 A 0.100 0.125 VGS = 2.5 V, ID = 1.0 A 0.160 0.200 gfs VDS = 5 V, ID = 2.4 A 5 VSD IS = 1.5 A, VGS = 0 V 0.79 1.1 2.1 4.0 S V Dynamicb Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time VDS = 10 V, VGS = 4.5 V, ID = 2.4 A 0.4 Rg 1 td(on) tr td(off) Fall Time tf Source-Drain Reverse Recovery Time trr nC 0.3 3.7 10 17 VDD = 10 V, RL = 10 ID 1 A, VGEN = 4.5 V, Rg = 6 30 50 14 25 6 12 IF = 3.0 A, dI/dt = 100 A/µs 30 50 ns Notes: a. Pulse test; pulse width 300 µs, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. SCHOTTKY SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) Parameter Symbol Forward Voltage Drop VF Maximum Reverse Leakage Current Irm Junction Capacitance CT Test Conditions Typ. Max. IF = 0.5 A Min. 0.42 0.48 IF = 0.5 A, TJ = 125 °C 0.33 0.4 VR = 20 0.002 0.100 VR = 20 V, TJ = 75 °C 0.06 1 VR = 20 V, TJ = 125 °C 1.5 10 VR = 10 V 31 Unit V mA pF Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 Document Number: 71069 S11-0651-Rev. G, 11-Apr-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Si3812DV Vishay Siliconix MOSFET TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 10 10 VGS = 4.5 V thru 3.5 V TC = - 55 °C 8 3V I D - Drain Current (A) I D - Drain Current (A) 8 6 2.5 V 4 2V 2 25 °C 125 °C 6 4 2 1.5 V 0 0 1 2 3 4 0 0.0 5 1.0 1.5 2.0 2.5 3.0 VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V) Output Characteristics Transfer Characteristics 3.5 4.0 300 0.5 250 0.4 C - Capacitance (pF) R DS(on) - On-Resistance () 0.5 0.3 VGS = 2.5 V 0.2 VGS = 4.5 V Ciss 200 150 100 Coss 0.1 50 Crss 0 0.0 0 1 2 3 4 5 6 0 7 16 VDS - Drain-to-Source Voltage (V) Capacitance 20 1.8 VDS = 10 V ID = 2.4 A 1.6 1.8 0.9 VGS = 4.5 V ID = 2.4 A 1.4 (Normalized) R DS(on) - On-Resistance VGS - Gate-to-Source Voltage (V) 12 ID - Drain Current (A) 2.7 0.0 0.0 8 On-Resistance vs. Drain Current 4.5 3.6 4 1.2 1.0 0.8 0.5 1.0 1.5 2.0 2.5 0.6 - 50 - 25 0 25 50 75 100 125 150 Qg - Total Gate Charge (nC) TJ - Junction Temperature (°C) Gate Charge On-Resistance vs. Junction Temperature Document Number: 71069 S11-0651-Rev. G, 11-Apr-11 www.vishay.com 3 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Si3812DV Vishay Siliconix MOSFET TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 0.40 10 R DS(on) - On-Resistance () I S - Source Current (A) ID = 2.4 A TJ = 150 °C 1 TJ = 25 °C 0.32 ID = 1 A 0.24 0.16 0.08 0.00 0.1 0 0.3 0.6 1.2 0.9 1.5 0 1 2 3 4 5 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V) Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage 0.4 8 ID = 250 µA 6 0.0 Power (W) V GS(th) Variance (V) 0.2 - 0.2 4 2 - 0.4 - 0.6 - 50 0 - 25 0 25 50 75 100 125 150 0.01 0.1 TJ - Temperature (°C) 10 1 30 Time (s) Threshold Voltage Single Pulse Power, Junction-to-Ambient 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: PDM 0.1 0.1 t1 0.05 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = R thJA = 130 °C/W 0.02 3. T JM - TA = PDMZthJA(t) 4. Surface Mounted Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 10 100 600 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient www.vishay.com 4 Document Number: 71069 S11-0651-Rev. G, 11-Apr-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Si3812DV Vishay Siliconix MOSFET TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (s) 1 10 Normalized Thermal Transient Impedance, Junction-to-Foot SCHOTTKY TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 5 1 I F - Forward Current (A) I R - Reverse Current (mA) 20 10 0.1 20 V 10 V 0.01 TJ = 150 °C 1 TJ = 25 °C 0.001 0.0001 0.1 0 25 50 75 100 125 150 0 0.2 0.4 0.6 0.8 TJ - Junction Temperature (°C) VF - Forward Voltage Drop (V) Reverse Current vs. Junction Temperature Forward Voltage Drop 1.0 CT - Junction Capacitance (pF) 150 120 90 60 30 0 0 4 8 12 16 20 VKA - Reverse Voltage (V) Capacitance Document Number: 71069 S11-0651-Rev. G, 11-Apr-11 www.vishay.com 5 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Si3812DV Vishay Siliconix SCHOTTKY TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 Notes: 0.2 PDM 0.1 0.1 t1 0.05 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = R thJA = 140 °C/W 0.02 3. T JM - TA = PDMZthJA(t) 4. Surface Mounted Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 10 100 600 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient 2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (s) 1 10 Normalized Thermal Transient Impedance, Junction-to-Foot Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?71069. www.vishay.com 6 Document Number: 71069 S11-0651-Rev. G, 11-Apr-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000