Si3871DV Datasheet

Si3871DV
New Product
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET With Schottky Diode
FEATURES
MOSFET PRODUCT SUMMARY
VDS (V)
−20
20
rDS(on) (W)
D TrenchFETr Power MOSFET
D LITTLE FOOTr Plus Integrated Low Vf
Schottky
D Optimized for Fast Switching Portable
Devices
D Shoot Thru Resistant
ID (A)
0.105 @ VGS = −4.5 V
−2.7
0.175 @ VGS = −2.5 V
−1.38
SCHOTTKY PRODUCT SUMMARY
APPLICATIONS
VKA (V)
Vf (v)
Diode Forward Voltage
IF (A)
20
0.40 V @ 1.0 A
1.0
D Low Voltage Synchronous Buck
D Low Voltage Inverter
S
A
D
K
TSOP-5
Top View
D/K
1
S
2
G
3
5
A
G
3 mm
4
D/K
2.85 mm
P-Channel MOSFET
Ordering Information: Si3871DV-T1—E3 (Lead Free)
Marking Code:
IBxx
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 sec
Steady State
Drain-Source Voltage (MOSFET and Schottky)
VDS
−20
Reverse Voltage (Schottky)
VKA
20
Gate-Source Voltage (MOSFET)
VGS
Continuous Drain Current (TJ = 150_C) (MOSFET)a
TA = 25_C
TA = 70_C
Pulsed Drain Current (MOSFET)
IS
Average Foward Current (Schottky)
Maximum Power Dissipation (Schottky)a
Operating Junction and Storage Temperature Range
−12
−2.7
−2.3
−2.1
−1.8
−7
−1.13
IF
Pulsed Foward Current (Schottky)
V
−12
IDM
Continuous Source Current (MOSFET Diode Conduction)a
Maximum Power Dissipation (MOSFET)a
ID
−0.83
7
TA = 25_C
1.25
0.92
TA = 70_C
0.80
0.59
1.25
0.92
TA = 25_C
TA = 70_C
0.80
TJ, Tstg
A
1.0
IFM
PD
Unit
W
0.59
−55 to 150
_C
Notes
a. Surface Mounted on 1” x1” FR4 Board.
Document Number: 72954
S-41077—Rev. A, 31-May-04
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Si3871DV
New Product
Vishay Siliconix
THERMAL RESISTANCE RATINGS
Parameter
Device
t v 5 sec
JJunction-to-Ambient
ti t A bi ta
Symbol
Typical
Maximum
MOSFET
80
100
Schottky
80
100
110
135
110
135
70
85
70
85
MOSFET
St d State
Steady
St t
Junction to Foot
Junction-to-Foot
Steady State
RthJA
Schottky
MOSFET
Schottky
RthJF
Unit
_C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = −250 mA
−0.6
Typ
Max
Unit
−1.5
V
"100
nA
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain Source On-State
Drain-Source
On State Resistancea
Forward Transconductancea
Diode Forward Voltagea
rDS(on)
VDS = 0 V, VGS = "12 V
VDS = −20 V, VGS = 0 V
−1
VDS = −20 V, VGS = 0 V, TJ = 75_C
−10
VDS w −5 V, VGS = −4.5 V
−5
mA
A
VGS = −4.5 V, ID = −2.7 A
0.085
0.105
VGS = −2.5 V, ID = −1.8 A
0.145
0.175
gfs
VDS = −5 V, ID = −2.7 A
6
VSD
IS = −1.13 A, VGS = 0 V
−0.78
−1.10
3.5
5.3
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
0.9
Rg
9.4
td(on)
35
55
55
85
40
60
29
36
15
30
Typ
Max
Gate Resistance
Turn-On Delay Time
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
0.9
VDS = −10 V,, VGS = −4.5 V,, ID = −2.7 A
VDD = −10 V, RL = 10 W
ID ^ −1 A, VGEN = −4.5 V, Rg = 6 W
IF = −1.13 A, di/dt = 100 A/ms
nC
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
SCHOTTKY SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Forward Voltage Drop
VF
Maximum Reverse Leakage
g Current
Irm
Junction Capacitance
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CT
Test Condition
Min
IF = 1.0 A
0.35
0.40
IF = 1.0 A, TJ = 125_C
0.28
0.32
0.500
Vr = 20 V
0.05
Vr = 20 V, TJ = 85_C
2
20
Vr = 20 V, TJ = 125_C
10
100
Vr = 10 V
90
Unit
V
mA
pF
Document Number: 72954
S-41077—Rev. A, 31-May-04
Si3871DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
MOSFET
Output Characteristics
Transfer Characteristics
8
8
7
VGS = 5 thru 3 V
6
I D − Drain Current (A)
I D − Drain Current (A)
7
2.5 V
5
4
3
2V
2
6
5
4
3
TC = 125_C
2
25_C
1.5 V
1
1
−55_C
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
0.0
5.0
1.5
2.0
2.5
On-Resistance vs. Drain Current
Capacitance
500
0.4
400
0.3
VGS = 2.5 V
VGS = 4.5 V
0.1
3.0
Ciss
300
200
Coss
100
0.0
Crss
0
0
1
2
3
4
5
6
7
8
0
4
ID − Drain Current (A)
Gate Charge
16
20
On-Resistance vs. Junction Temperature
VDS = 10 V
ID = 2.7 A
VGS = 4.5 V
ID = 2.7 A
1.4
4
3
2
1.2
1.0
0.8
1
0
0.0
12
1.6
rDS(on) − On-Resiistance
(Normalized)
5
8
VDS − Drain-to-Source Voltage (V)
6
V GS − Gate-to-Source Voltage (V)
1.0
VGS − Gate-to-Source Voltage (V)
0.5
0.2
0.5
VDS − Drain-to-Source Voltage (V)
C − Capacitance (pF)
r DS(on) − On-Resistance ( W )
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Qg − Total Gate Charge (nC)
Document Number: 72954
S-41077—Rev. A, 31-May-04
4.0
4.5
0.6
−50
−25
0
25
50
75
100
125
150
TJ − Junction Temperature (_C)
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Si3871DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
MOSFET
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.5
TJ = 150_C
1
TJ = 25_C
0.1
0.0
ID = 2.7 A
0.4
r DS(on) − On-Resistance ( W )
I S − Source Current (A)
10
0.3
0.2
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
1.4
1
VSD − Source-to-Drain Voltage (V)
3
4
5
6
7
8
VGS − Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
0.4
50
0.3
40
ID = 250 mA
0.2
30
Power (W)
V GS(th) Variance (V)
2
0.1
20
0.0
10
−0.1
−0.2
−50
−25
0
25
50
75
100
125
0
10−3
150
10−2
TJ − Temperature (_C)
10−1
1
10
Time (sec)
Safe Operating Area
100
IDM Limited
I D − Drain Current (A)
10
rDS(on) Limited
1 ms
1
ID(on)
Limited
0.1
10 ms
100 ms
1s
10 s
dc
TA = 25_C
Single Pulse
BVDSS Limited
0.01
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
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Document Number: 72954
S-41077—Rev. A, 31-May-04
Si3871DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
MOSFET
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 90_C/W
0.02
3. TJM − TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10−4
10−3
10−2
10−1
1
10
100
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
10−3
10−2
10−1
Square Wave Pulse Duration (sec)
1
10
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
SCHOTTKY
Reverse Current vs. Junction Temperature
Forward Voltage Drop
100
10
I F − Forward Current (A)
I R − Reverse Current (mA)
10
1
0.1
20 V
10 V
0.01
1
TJ = 150_C
TJ = 25_C
0.001
0.0001
−50
−25
0
25
50
75
100
TJ − Junction Temperature (_C)
Document Number: 72954
S-41077—Rev. A, 31-May-04
125
150
0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
VF − Forward Voltage Drop (V)
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Si3871DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
600
CT − Junction Capacitance (pF)
SCHOTTKY
500
400
300
200
100
0
0
4
8
12
16
20
VKA − Reverse Voltage (V
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
PDM
0.1
0.1
t1
0.05
t2
1. Duty Cycle, D =
0.02
2. Per Unit Base = RthJA = 95_C/W
3. TJM − TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10−4
t1
t2
10−3
10−2
10−1
1
100
10
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Foot
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
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10−3
10−2
10−1
Square Wave Pulse Duration (sec)
1
10
Document Number: 72954
S-41077—Rev. A, 31-May-04
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Document Number: 91000
Revision: 18-Jul-08
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