VISHAY SI5445BDC-T1-E3

Si5445BDC
New Product
Vishay Siliconix
P-Channel 1.8-V (G-S) MOSFET
PRODUCT SUMMARY
VDS (V)
−8
FEATURES
rDS(on) (W)
ID (A)
0.033 @ VGS = −4.5 V
−7.1
0.043 @ VGS = −2.5 V
−6.2
0.060 @ VGS = −1.8 V
−5.3
D TrenchFETr Power MOSFET
Qg (Typ)
14
1206-8 ChipFETr
S
1
D
D
D
D
G
D
D
G
S
Marking Code
BM XX
Lot Traceability
and Date Code
D
Part # Code
Bottom View
P-Channel MOSFET
Ordering Information: Si5445BDC-T1—E3
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
−8
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 85_C
Pulsed Drain Current
ID
IS
TA = 25_C
Maximum Power Dissipationa
TA = 85_C
Operating Junction and Storage Temperature Range
PD
V
−5.2
−7.1
−5.2
−3.7
IDM
Continuous Source Currenta
"20
−2.1
−1.1
2.5
1.3
1.3
0.7
TJ, Tstg
Unit
−55 to 150
Soldering Recommendations (Peak Temperature)b, c
A
W
_C
260
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Symbol
t v 5 sec
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
45
50
85
95
17
20
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73251
S-50133—Rev. A, 24-Jan-05
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Si5445BDC
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = −250 mA
−0.45
Typ
Max
Unit
−1.0
V
"100
nA
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source
Drain
Source On
On-State
State Resistancea
Voltagea
VDS = −8 V, VGS = 0 V
−1
VDS = −8 V, VGS = 0 V, TJ = 85_C
−5
VDS p−5 V, VGS = −4.5 V
mA
−20
A
VGS = −4.5 V, ID = −5.2 A
0.027
0.033
VGS = −2.5 V, ID = −4.5 A
0.035
0.043
VGS = −1.8 V, ID = −1.7 A
0.050
0.060
gfs
VDS = −5 V, ID = −5.2 A
18
VSD
IS = −1.1 A, VGS = 0 V
−0.8
−1.2
14
21
VDS = −4 V, VGS = −4.5 V, ID = −5.2 A
1.8
rDS(on)
Forward Transconductancea
Diode Forward
VDS = 0 V, VGS = "8 V
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
f = 1 MHz
8
td(on)
Rise Time
VDD = −4 V, RL = 4 W
ID ^ −1 A, VGEN = −4.5 V, Rg = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
Reverse Recovery Charge
Qrr
W
12
tr
Turn-Off Delay Time
nC
3.3
IF = −1.1
11A
A, di/dt = 100 A/ms
20
22
35
75
115
50
75
75
115
40
60
ns
nC
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
20
20
VGS = 5 thru 2.5 V
TC = −55_C
2V
25_C
16
I D − Drain Current (A)
I D − Drain Current (A)
16
12
8
1.5 V
4
125_C
12
8
4
1V
0
0.0
0.5
1.0
1.5
2.0
2.5
VDS − Drain-to-Source Voltage (V)
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2
3.0
0
0.0
0.5
1.0
1.5
2.0
2.5
VGS − Gate-to-Source Voltage (V)
Document Number: 73251
S-50133—Rev. A, 24-Jan-05
Si5445BDC
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
2000
0.14
C − Capacitance (pF)
r DS(on) − On-Resistance ( W )
0.16
0.12
0.10
0.08
VGS = 1.8 V
0.06
VGS = 2.5 V
0.04
1600
Ciss
1200
800
Coss
400
0.02
Crss
VGS = 4.5 V
0.00
0
0
4
8
12
16
20
0
1
2
ID − Drain Current (A)
Gate Charge
5
6
7
8
On-Resistance vs. Junction Temperature
1.6
VDS = 10 V
ID = 5.2 A
VGS = 4.5 V
ID = 5.2 A
4
1.4
rDS(on) − On-Resiistance
(Normalized)
V GS − Gate-to-Source Voltage (V)
4
VDS − Drain-to-Source Voltage (V)
5
3
2
1
1.2
1.0
0.8
0
0
3
6
9
12
15
0.6
−50
18
−25
0
Qg − Total Gate Charge (nC)
25
50
75
100
125
150
TJ − Junction Temperature (_C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.16
20
TJ = 150_C
0.14
r DS(on) − On-Resistance ( W )
I S − Source Current (A)
3
10
TJ = 25_C
0.12
0.10
ID = 2 A
0.08
ID = 5.2 A
0.06
0.04
0.02
1
0.0
0.00
0.2
0.4
0.6
0.8
1.0
VSD − Source-to-Drain Voltage (V)
Document Number: 73251
S-50133—Rev. A, 24-Jan-05
1.2
0
1
2
3
4
5
VGS − Gate-to-Source Voltage (V)
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Si5445BDC
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.4
50
40
ID = 250 mA
0.2
Power (W)
V GS(th) Variance (V)
0.3
0.1
30
20
0.0
10
−0.1
−0.2
−50
−25
0
25
50
75
100
125
0
10−3
150
10−2
10−1
TJ − Temperature (_C)
1
10
100
600
Time (sec)
Safe Operating Area
100
IDM Limited
*rDS(on) Limited
I D − Drain Current (A)
10
P(t) = 0.001
P(t) = 0.01
1
0.1
ID(on)
Limited
P(t) = 0.1
P(t) = 1
P(t) = 10
dc
TC = 25_C
Single Pulse
BVDSS Limited
0.01
0.1
1
10
VDS − Drain-to-Source Voltage (V)
*VGS u minimum VGS at which rDS(on) is specified
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 80_C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10−4
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4
10−3
10−2
10−1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 73251
S-50133—Rev. A, 24-Jan-05
Si5445BDC
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
10−3
10−2
10−1
Square Wave Pulse Duration (sec)
1
10
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and
Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see
http://www.vishay.com/ppg?73251.
Document Number: 73251
S-50133—Rev. A, 24-Jan-05
www.vishay.com
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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