UNISONIC TECHNOLOGIES CO., LTD UTT2N10-H POWER MOSFET 1.6A, 100V HEXFET POWER MOSFET DESCRIPTION The UTC UTT2N10-H is an N-channel Power MOSFET, it uses UTC’s advanced technology to provide the customers with high switching speed and low gate charge. The UTC UTT2N10-H is suitable for Load/system switch. FEATURES * RDS(ON) < 235 mΩ @ VGS=4.5V, ID=1.3A RDS(ON) < 220 mΩ @ VGS=10V, ID=1.6A * High switching speed * Low gate charge SYMBOL ORDERING INFORMATION Ordering Number Note: UTT2N10G-AE2-R Pin Assignment: G: Gate D: Drain Package SOT-23-3 Pin Assignment 3 1 2 S G D Packing Tape Reel S: Source MARKING www.unisonic.com.tw Copyright © 2015 Unisonic Technologies Co., Ltd 1 of 6 QW-R209-082.B UTT2N10-H POWER MOSFET ABSOLUTE MAXIMUM RATING PARAMETER Drain-Source Voltage Gate-Source Voltage RATINGS UNIT 100 V ±16 V TA=25°C 1.6 A ID Continuous Drain Current TA=70°C 1.3 A (VGS @ 10V) Pulsed IDM 7.0 A TA=25°C 1.3 W Power Dissipation PD TA=70°C 0.8 W Linear Derating Factor 0.01 W/°C Junction Temperature TJ -55~+150 °C Storage Temperature Range TSTG -55~+150 °C Notes: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied. 2. Repetitive Rating : Pulse width limited by TJ 3. L=70mH, IAS=2.0A, VDD=50V, RG=25 Ω, Starting TJ = 25°C 4. ISD≤2.4A, di/dt≤200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C SYMBOL VDSS VGSS THERMAL RESISTANCE PARAMETER SYMBOL Junction to Ambient θJA Note: Surface mounted on 1 in square Cu board. UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw RATINGS 100 UNIT °C/W 2 of 6 QW-R209-082.B UTT2N10-H POWER MOSFET ELECTRICAL CHARACTERISTICS (TJ=25°C, unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS VGS=0V, ID=250µA 100 Breakdown Voltage Temperature Coefficient ∆BVDSS/∆TJ Reference to 25°C, ID=1mA VDS=100, VGS=0V Drain-Source Leakage Current IDSS VDS=100V, VGS=0V, TJ=125°C Forward VGS=16V Gate-Source Leakage Current IGSS Reverse VGS=-16V ON CHARACTERISTICS VGS=4.5V, ID=1.3A (Note 2) Static Drain-Source On-Resistance RDS(ON) VGS=10V, ID=1.6A (Note 2) Gate Threshold Voltage VGS(TH) VDS=VGS, ID=25µA 1.0 Forward Transconductance gFS VDS=50V, ID=1.6A 5.7 DYNAMIC PARAMETERS Input Capacitance CISS VGS=0V, VDS=25V, f=1.0MHz Output Capacitance COSS Reverse Transfer Capacitance CRSS Internal Gate Resistance RG SWITCHING PARAMETERS Total Gate Charge QG ID=1.6A, VDS=50V, VGS=4.5V Gate-to-Source Charge QGS1 (Note 2) Gate-to-Drain ("Miller") Charge QGD Turn-ON Delay Time tD(ON) VDD=50V, ID=1.0A, RG=6.8Ω Rise Time tR V Turn-OFF Delay Time tD(OFF) GS=4.5V, (Note 2) Fall Time tF SOURCE- DRAIN DIODE RATINGS AND CHARACTERISTICS Continuous Source Current (Body Diode) IS MOSFET symbol showing the integral reverse p-n Pulsed Source Current (Body Diode) ISM junction diode. (Note 1) TJ=25°C, IS=1.1A, VGS=0V Drain-Source Diode Forward Voltage VSD (Note 2) Reverse Recovery Time tRR TJ=25°C, IF=1.1A, VR=50V, di/dt=100A/us (Note 2) Reverse Recovery Charge QRR Notes: 1. Repetitive rating; pulse width limited by max. Junction temperature. 2. Pulse width ≤ 400µs; duty cycle ≤ 2%. UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw TYP MAX UNIT 20 V mV/°C µA 250 µA 100 -100 nA nA 235 220 2.5 mΩ mΩ V S 0.10 190 178 290 27 13 1.3 pF pF pF Ω 2.5 0.5 1.2 2.2 2.1 9.0 3.6 nC nC nC ns ns ns ns 20 13 1.1 A 7.0 A 1.3 V 30 20 ns nC 3 of 6 QW-R209-082.B UTT2N10-H POWER MOSFET TEST CIRCUITS AND WAVEFORMS 2 EAS= 1 2 LIAS VDS RG BVDSS BVDSS-VDD BVDSS ID L IAS 10V ID(t) DUT tP VDD VDD VDS(t) tP Unclamped Inductive Switching Test Circuit UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw Time Unclamped Inductive Switching Waveforms 4 of 6 QW-R209-082.B UTT2N10-H POWER MOSFET TYPICAL CHARACTERISTICS Drain Current vs. Source to Drain Voltage Maximum Safe Operating Area 100 1.0 10 0.8 100us 0.6 1 0.4 0.2 0 1ms 0. 1 TA=25°C Single Pulse 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Source to Drain Voltage, VSD (V) 0 Transfer Characteristics 0.01 0.1 100 0.2 0.1 0.05 10 1 0.02 0.01 PD 0.1 M 0.1 25°C 0.01 1.5 Single Pulse 2.0 2.5 3.0 3.5 4.0 Gate-Source Voltage, VGS (V) Drain Current vs. Drain Source Breakdown Voltage 1000 600 30 400 20 200 10 150 50 200 100 Drain Source Breakdown Voltage, BVDSS (V) UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw t1 Duty Factor=t1/t2 Peak TJ=PDM/RthJC+TC 0 1 10 Drain Current vs. Gate Threshold Voltage 50 40 0 t2 0.01 1E-006 0.0001 0.01 0.1 1E-005 0.001 Pulse Width, t (s) 800 0 10 Effective Transient Thermal Impedance Duty Factor=0.5 1 150°C 1 Drain-to-Source Voltage, -VDS (V) 100 10 10ms 0 50 100 150 200 Gate Threshold Voltage, VTH (V) 5 of 6 QW-R209-082.B UTT2N10-H POWER MOSFET TYPICAL CHARACTERISTICS Drain Source On-State Resistance Characteristics 2.0 On-state Characteristics 20 18 1.8 1.6 VG=8V 16 RDS(ON)+10 VG=10V 14 1.4 1.2 RDS(ON)+4.5 12 1.0 10 0.8 8.0 0.6 6.0 0.4 4.0 0.2 2.0 0 0 0 0.25 0.75 1.0 0.5 Drain to Source Voltage, VDS (V) VG=4.5V VG=6V VG=4V VG=3V VG=2V 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 Gate Threshold Voltage, VTH (V) UTC assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all UTC products described or contained herein. UTC products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. UNISONIC TECHNOLOGIES CO., LTD www.unisonic.com.tw 6 of 6 QW-R209-082.B