P3PSL450A Low Voltage, Timing-Safe] Peak EMI Reduction IC Functional Description P3PSL450A/AH is a versatile low voltage peak EMI reduction IC based on Timing−Safe technology. P3PSL450A/AH accepts one input from an external reference, and locks on to it delivering a 1x Timing−Safe output clock. P3PSL450A/AH has a Frequency Selection (FS) control that facilitates selecting one of the two frequency ranges within the operating frequency range. Refer frequency Selection table. The device has an SSEXTR pin to select different deviations depending upon the value of an external resistor connected at this pin to GND. P3PSL450A/AH has an MR pin for selecting one of the two Modulation Rates. PD# provides the Power Down option. P3PSL450A is a Low drive part and P3PSL450AH is a High drive part. Refer to DC/AC Electrical characteristic table. P3PSL450A/AH operates over a supply voltage range of 1.8 V $ 0.2 V, and is available in an 8 Pin WDFN (2 mm x 2 mm) Package. General Features • • • • • • • • • • http://onsemi.com MARKING DIAGRAM 1 1 WDFN8 CASE 511AQ XX MG G XX = Specific Device Code M = Date Code G = Pb−Free Device PIN CONFIGURATION 1x, LVCMOS Timing−Safe Peak EMI Reduction Input Clock Frequency: 15 MHz − 60 MHz Output Clock Frequency (Timing−Safe): 15 MHz − 60 MHz Analog Frequency Deviation Selection Two different Modulation Rate Selection Option Power Down option for Power Save Low and High Drive Parts Supply Voltage: 1.8 V $ 0.2 V 8 Pin WDFN (2 mm X 2 mm) Package These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant CLKIN 1 FS 2 8 VDD 7 SSEXTR PD# 3 6 MR GND 4 5 ModOUT ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. Application • P3PSL450A/AH is targeted for use in consumer electronic applications like mobile phones, Camera modules, MFP and DPF MR VDD SSEXTR CLKIN PLL ModOUT (Timing−Safe) PD# GND FS Figure 1. Block Diagram © Semiconductor Components Industries, LLC, 2010 July, 2010 − Rev. 1 1 Publication Order Number: P3PSL450A/D P3PSL450A Table 1. PIN DESCRIPTION Pin # Pin Name Type 1 CLKIN I External reference Clock input. Description 2 FS I Frequency Select. Has an internal pull−down resistor. see Frequency Selection table 3 PD# I Power Down. Pull LOW to enable Power Down. Pull HIGH to disable power down. Output Clock will be LOW when power down is enabled. Has an internal pull−up resistor 4 GND P Ground 5 ModOUT O Buffered modulated Timing−Safe clock output 6 MR I Modulation Rate Select. When LOW selects Low Modulation Rate. Selects High Modulation Rate when pulled HIGH. Has an internal pull−up resistor. 7 SSEXTR I Analog Frequency Deviation Selection through external resistor to GND. 8 VDD P 1.8 V Supply Voltage Table 2. FREQUENCY SELECTION TABLE FS Frequency (MHz) 0 15−30 1 30−60 Table 3. ABSOLUTE MAXIMUM RATING Parameter Min Max Unit Supply Voltage to Ground Potential −0.3 +2.7 V DC Input Voltage(CLKIN) −0.3 +2.7 V DC Input Voltage (Except CLKIN) −0.3 VDD + 0.3 V Storage Temperature −65 +150 °C Max. Soldering Temperature (10 sec) 260 °C Junction Temperature 150 °C Static Discharge Voltage (As per JEDEC STD22−A114−B) 2000 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 4. OPERATING CONDITIONS Symbol Min Max Unit Supply Voltage 1.6 2 V TA Operating Temperature −20 +85 °C CL Load Capacitance 15 pF CIN Input Capacitance 7 pF VDD Parameter http://onsemi.com 2 P3PSL450A Table 5. DC ELECTRICAL CHARACTERISTICS FOR VDD = 1.8 V $ 0.2 V Symbol Parameter VDD Test Conditions Supply Voltage VIH Input HIGH Voltage VIL Input LOW Voltage IIH Input HIGH Current IIL Input LOW Current VOH Min Typ Max Unit 1.6 1.8 2 V 0.65 * VDD Output HIGH Voltage V 0.35 * VDD V VIN = VDD 5 mA VIN = 0 V 5 mA IOH = −8 mA (P3PSL450A) 0.75 * VDD V IOH = −16 mA (P3PSL450AH) VOL Output LOW Voltage IOL = 8 mA (P3PSL450A) 0.25 * VDD V 10 mA mA IOL = 16 mA (P3PSL450AH) ICC Static Supply Current IDD Dynamic Supply Current Zo CLKIN & PD# pins pulled to GND Unloaded Output Output Impedance FS = 0, @ 15 MHz 1.7 2.2 FS = 0, @ 30 MHz 3.0 3.7 FS = 1, @ 30 MHz 2.6 3.7 FS = 1, @ 60 MHz 4.3 6.4 P3PSL450A 23 P3PSL450AH 17 W Table 6. AC ELECTRICAL CHARACTERISTICS FOR VDD = 1.8 V $ 0.2 V Parameter Test Conditions Min Max Unit FS = 0 15 30 MHz FS = 1 30 60 FS = 0 15 30 FS = 1 30 60 Measured at VDD / 2 45 Input Frequency ModOUT Duty Cycle (Notes 1 and 2) Rise Time (Notes 1 and 2) Measured between 20% to 80% Fall Time (Notes 1 and 2) Measured between 80% to 20% Cycle−to−Cycle Jitter (Note 2) Unloaded output with SSEXTR pin OPEN 50 55 % P3PSL450A 1.3 2.1 ns P3PSL450AH 1 1.7 P3PSL450A 1.3 2.1 P3PSL450AH FS = 0 FS = 1 PLL Lock Time 2 Typ 1 1.7 15 MHz $150 $250 24 MHz $100 $150 30 MHz $80 $150 30 MHz $150 $250 60 MHz $100 $150 Stable power supply, valid clock presented on CLKIN pin, PD# toggled from Low to High 1. All parameters are specified with 15 pF loaded output. 2. Parameter is guaranteed by design and characterization. Not 100% tested in production http://onsemi.com 3 1 ns ps ms P3PSL450A SWITCHING WAVEFORMS t1 t2 VDD/2 VDD/2 VDD/2 OUTPUT Figure 2. Duty Cycle Timing 80% 80% 20% 20% OUTPUT t3 t4 Figure 3. Output Rise/Fall Time Input Timing−Safe Output TSKEW ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ TSKEW/2 TSKEW/2 One clock cycle (T) TSKEW represents input−output skew when spread spectrum is ON For example, TSKEW/2 = $0.20 * T for an Input clock of 24 MHz, translates in to (1/24 MHz) * 0.20 = 8.33 ns Figure 4. Input−Output Skew Input Input Timing-Safe ModOUT ModOUT with SSOFF Figure 5. Typical Example of Timing−Safe Waveform http://onsemi.com 4 P3PSL450A DEVIATION VERSUS SSEXTR RESISTANCE CHARTS 3.0 2.0 1.5 1.0 0.5 0.0 0 1.5 1.0 0.0 0 100 200 300 400 500 600 700 800 900 1000 100 200 300 400 500 600 700 800 900 1000 RESISTANCE (kW) RESISTANCE (kW) Figure 6. Deviation vs SSEXTR Chart (CLKIN = 15 MHz) Figure 7. Deviation vs SSEXTR Chart (CLKIN = 15 MHz) 3 FS = 0, MR = 0 FS = 0, MR = 1 2.5 DEVIATION ($%) 2.5 DEVIATION ($%) 2.0 0.5 3 2 1.5 1 2 1.5 1 0.5 0.5 0 FS = 0, MR = 1 2.5 DEVIATION ($%) 2.5 DEVIATION ($%) 3.0 FS = 0, MR = 0 0 0 0 100 200 300 400 500 600 700 800 900 1000 100 200 300 400 500 600 700 800 900 1000 RESISTANCE (kW) RESISTANCE (kW) Figure 8. Deviation vs SSEXTR Chart (CLKIN = 24 MHz) Figure 9. Deviation vs SSEXTR Chart (CLKIN = 24 MHz) 2.5 1.5 FS = 0, MR = 0 FS = 0, MR = 1 DEVIATION ($%) DEVIATION ($%) 2.0 1.5 1.0 1.0 0.5 0.5 0.0 0 0.0 0 100 200 300 400 500 600 700 800 900 1000 100 200 300 400 500 600 700 800 900 1000 RESISTANCE (kW) RESISTANCE (kW) Figure 10. Deviation vs SSEXTR Chart (CLKIN = 30 MHz) Figure 11. Deviation vs SSEXTR Chart (CLKIN = 30 MHz) http://onsemi.com 5 P3PSL450A DEVIATION VERSUS SSEXTR RESISTANCE CHARTS 3.0 2.0 1.5 1.0 0 1.0 0 100 200 300 400 500 600 700 800 900 1000 RESISTANCE (kW) RESISTANCE (kW) Figure 12. Deviation vs SSEXTR Chart (CLKIN = 30 MHz) Figure 13. Deviation vs SSEXTR Chart (CLKIN = 30 MHz) 3.0 FS = 1, MR = 0 2.0 1.5 1.0 FS = 1, MR = 1 2.5 DEVIATION ($%) 2.5 DEVIATION ($%) 1.5 0.0 100 200 300 400 500 600 700 800 900 1000 3.0 2.0 1.5 1.0 0.5 0.5 0.0 2.0 0.5 0.5 0.0 FS = 1, MR = 1 2.5 DEVIATION ($%) 2.5 DEVIATION ($%) 3.0 FS = 1, MR = 0 0 0.0 0 100 200 300 400 500 600 700 800 900 1000 100 200 300 400 500 600 700 800 900 1000 RESISTANCE (kW) RESISTANCE (kW) Figure 14. Deviation vs SSEXTR Chart (CLKIN = 48 MHz) Figure 15. Deviation vs SSEXTR Chart (CLKIN = 48 MHz) 2.5 1.5 FS = 1, MR = 0 FS = 1, MR = 1 DEVIATION ($%) DEVIATION ($%) 2.0 1.5 1.0 1.0 0.5 0.5 0.0 0 0.0 0 100 200 300 400 500 600 700 800 900 1000 100 200 300 400 500 600 700 800 900 1000 RESISTANCE (kW) RESISTANCE (kW) Figure 16. Deviation vs SSEXTR Chart (CLKIN = 60 MHz) Figure 17. Deviation vs SSEXTR Chart (CLKIN = 60 MHz) http://onsemi.com 6 P3PSL450A Recommended Noise reduction Filter VDDIN R C1 0.1 mF C2 2.2 mF 8 1 CLKIN VDD VDD Rs ModOUT Frequency Selection Control 2 FS VDD P3PSL450A/AH SSEXTR ModOUT Clock 5 Rx Analog Deviation Control. SSEXTR can be Pulled HIGH to turn OFF SS. 7 VDD Power down Control 3 PD# MR GND 6 Modulation Rate Control 4 NOTE: Refer to Pin Description table for Functionality details Figure 18. Typical Application Schematic http://onsemi.com 7 P3PSL450A PCB LAYOUT RECOMMENDATION For optimum device performance, following guidelines are recommended. • Dedicated VDD and GND planes. • The device must be isolated from system power supply noise. A 0.1 mF and a 2.2 mF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between the decoupling capacitor and VDD pin. The PCB trace to VDD pin and the ground via should be kept as short as possible. All the VDD pins should have decoupling capacitors. • In an optimum layout all components are on the same side of the board, minimizing vias through other signal layers. A typical layout is shown in the Figure below: As short as possible R As short as possible CLKIN VDD FS SSEXTR PD# MR GND ModOUT Rs ORDERING INFORMATION Marking Temperature Package Type Shipping† P3PSL450AG−08CR FA −20°C to +85°C 8− pin (2 mm x 2 mm) WDFN (Pb−Free) Tape & Reel P3PSL450AHG−08CR FC −20°C to +85°C 8− pin (2 mm x 2 mm) WDFN (Pb−Free) Tape & Reel Ordering Code †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb−Free. http://onsemi.com 8 P3PSL450A PACKAGE DIMENSIONS WDFN8 2x2, 0.5P CASE 511AQ−01 ISSUE A D PIN ONE REFERENCE 2X A B L1 ÍÍÍ ÍÍÍ ÍÍÍ DETAIL A E OPTIONAL CONSTRUCTIONS 0.10 C 2X 0.10 C ÉÉ ÉÉ TOP VIEW EXPOSED Cu A3 DETAIL B 0.05 C 0.05 C MOLD CMPD OPTIONAL CONSTRUCTION C MILLIMETERS MIN MAX 0.80 0.70 0.05 0.00 0.20 REF 0.20 0.30 2.00 BSC 2.00 BSC 0.50 BSC 0.50 0.60 --0.15 RECOMMENDED SOLDERING FOOTPRINT* A1 SIDE VIEW DIM A A1 A3 b D E e L L1 DETAIL B A 8X SEATING PLANE 7X 0.78 PACKAGE OUTLINE DETAIL A 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL. L L 8X 4 L 2.30 0.88 8 5 e/2 e 8X b 0.10 C A 0.05 C 8X 1 0.35 B 0.50 PITCH DIMENSIONS: MILLIMETERS NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW Timing−Safe is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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