MC14042B D

MC14042B
Quad Transparent Latch
The MC14042B Quad Transparent Latch is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. Each latch has a separate data input, but all four
latches share a common clock. The clock polarity (high or low) used to
strobe data through the latches can be reversed using the polarity
input. Information present at the data input is transferred to outputs Q
and Q during the clock level which is determined by the polarity input.
When the polarity input is in the logic “0” state, data is transferred
during the low clock level, and when the polarity input is in the logic
“1” state the transfer occurs during the high clock level.
http://onsemi.com
SOIC−16
D SUFFIX
CASE 751B
Features
•
•
•
•
•
•
•
•
•
Buffered Data Inputs
Common Clock
Clock Polarity Control
Q and Q Outputs
Double Diode Input Protection
Supply Voltage Range = 3.0 Vdc to 1 8 Vdc
Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
This Device is Pb−Free and is RoHS Compliant
MAXIMUM RATINGS (Voltages Referenced to VSS)
Unit
−0.5 to +18.0
V
−0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
±10
mA
PD
Power Dissipation,
per Package (Note 1)
500
mW
TA
Ambient Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
VDD
Vin, Vout
Iin, Iout
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 9
Q3
1
16
VDD
Q0
2
15
Q3
Q0
3
14
D3
D0
4
13
D2
CLOCK
5
12
Q2
POLARITY
6
11
Q2
D1
7
10
Q1
VSS
8
9
Q1
MARKING DIAGRAM
Value
Symbol
PIN ASSIGNMENT
1
16
14042BG
AWLYWW
1
A
WL
YY, Y
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Indicator
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Publication Order Number:
MC14042B/D
MC14042B
TRUTH TABLE
Clock
Polarity
Q
0
1
1
0
0
0
1
1
Data
Latch
Data
Latch
LOGIC DIAGRAM
5
D0
LATCH
1
4
CLOCK
POLARITY
Q0
2
Q0
3
6
D1
LATCH
2
7
Q1
10
Q1
9
D2
LATCH
3
13
VDD = PIN 16
VSS = PIN 8
Q2
11
Q2
12
D3
LATCH
4
14
Q3
1
Q3
15
ORDERING INFORMATION
Package
Shipping†
MC14042BDG
SOIC−16
(Pb−Free)
48 Units / Rail
NLV14042BDG*
SOIC−16
(Pb−Free)
48 Units / Rail
MC14042BDR2G
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
NLV14042BDR2G*
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
http://onsemi.com
2
MC14042B
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
−55_C
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
25_C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
125_C
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
“0” Level
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
–3.0
–0.64
–1.6
–4.2
−
−
−
−
–2.4
–0.51
–1.3
–3.4
–4.2
–0.88
–2.25
–8.8
−
−
−
−
–1.7
–0.36
–0.9
–2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
±0.1
−
±0.00001
±0.1
−
±1.0
mAdc
Input Capacitance
(Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
−
−
−
1.0
2.0
4.0
−
−
−
0.002
0.004
0.006
1.0
2.0
4.0
−
−
−
30
60
120
mAdc
IT
5.0
10
15
Vin = 0 or VDD
Input Voltage
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
“1” Level
VIH
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current (Notes 3 & 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs all
buffers switching)
mAdc
IT = (1.0 mA/kHz) f + IDD
IT = (2.0 mA/kHz) f + IDD
IT = (3.0 mA/kHz) f + IDD
mAdc
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL − 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.004.
http://onsemi.com
3
MC14042B
SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time, D to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 135 ns
tPLH, tPHL = (0.66 ns/pF) CL + 57 ns
tPLH, tPHL = (0.5 ns/pF) CL + 35 ns
tPLH,
tPHL
Propagation Delay Time, Clock to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 135 ns
tPLH, tPHL = (0.66 ns/pF) CL + 57 ns
tPLH, tPHL = (0.5 ns/pF) CL + 35 ns
tPLH,
tPHL
Clock Pulse Width
tWH
Clock Pulse Rise and Fall Time
Hold Time
Setup Time
VDD
Min
Typ
(Note 6)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
5.0
10
15
−
−
−
220
90
60
440
180
120
5.0
10
15
−
−
−
220
90
60
440
180
120
5.0
10
15
300
100
80
150
50
40
−
−
−
5.0
10
15
−
−
−
−
−
−
15
5.0
4.0
5.0
10
15
100
50
40
50
25
20
−
−
−
5.0
10
15
50
30
25
0
0
0
−
−
−
Unit
ns
no
ns
ns
ms
tTLH,
tTHL
th
ns
tsu
ns
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
http://onsemi.com
4
MC14042B
VDD
1
f
16
20 ns
5
6
4
PULSE
GENERATOR 1
7
13
2
3
10
9
11
12
1
15
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
CLOCK
POLARITY
D0
D1
D2
14
D3
20 ns
90%
50%
DATA INPUT
tPLH
tPHL
90%
Q OUTPUT
For Power Dissipation test, each output
is loaded with capacitance CL.
VSS
tTHL
Figure 1. AC and Power Dissipation Test Circuit and Timing Diagram
(Data to Output)
VDD
16
PULSE
GENERATOR 1
5
PULSE
GENERATOR 2
4
CLOCK
6
POLARITY
D0
7
D1
13
D2
14
D3
NOTE: CL connected to output under test.
20* ns
8
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
2
3
10
9
11
12
1
15
VSS
20 ns
90%
50%
CLOCK INPUT
P.G. 1
10%
tWH
20 ns
90%
50%
DATA INPUT
P.G. 2
tsu
th
tPLH
Q OUTPUT
90%
50%
10%
*Input clock rise time is 20 ns except for maximum rise time test.
Figure 2. AC Test Circuit and Timing Diagram
(Clock to Output)
http://onsemi.com
5
tTHL
tPHL
90%
10%
8
50%
10%
tTLH
Q OUTPUT
10%
50%
tTLH
MC14042B
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE K
−A−
16
9
1
8
−B−
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
8 PL
0.25 (0.010)
M
B
S
DIM
A
B
C
D
F
G
J
K
M
P
R
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT*
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC14042B/D