MUR2100E Preferred Device SWITCHMODEt Power Rectifier Ultrafast “E” Series with High Reverse Energy Capability http://onsemi.com These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. ULTRAFAST RECTIFIER 2.0 AMPERES, 1000 VOLTS Features • 20 mjoules Avalanche Energy Guaranteed • Excellent Protection Against Voltage Transients in Switching • • • • • • Inductive Load Circuits Ultrafast 75 Nanosecond Recovery Time 175°C Operating Junction Temperature Low Forward Voltage Low Leakage Current High Temperature Glass Passivated Junction These are Pb−Free Devices* Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • PLASTIC AXIAL LEAD CASE 59 Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260°C Max for 10 Seconds Polarity: Cathode Indicated by Polarity Band MARKING DIAGRAM MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 1000 V Average Rectified Forward Current (Note 1) IF(AV) 2.0 @ TA = 35°C A Non-Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) IFSM 35 A TJ, Tstg −65 to +175 °C Symbol Value Unit RqJA (Note 3) °C/W Operating Junction Temperature and Storage Temperature Range Maximum Thermal Resistance, Junction−to−Ambient Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 July, 2006 − Rev. 6 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping † MUR2100E Axial Lead** 1000 Units/Bag MUR2100EG Axial Lead** 1000 Units/Bag MUR2100ERL Axial Lead** 5000/Tape & Reel MUR2100ERLG Axial Lead** 5000/Tape & Reel Device THERMAL CHARACTERISTICS Characteristic A MUR2100E YYWW G G 1 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. **This package is inherently Pb−Free. Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MUR2100E/D MUR2100E ELECTRICAL CHARACTERISTICS Characteristic Symbol Value Unit Maximum Instantaneous Forward Voltage (Note 2) (IF = 2.0 A, TJ = 150°C) (IF = 2.0 A, TJ = 25°C) VF Maximum Instantaneous Reverse Current (Note 2) (Rated dc Voltage, TJ = 100°C) (Rated dc Voltage, TJ = 25°C) iR Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) (IF = 0.5 A, IR = 1.0 A, IREC = 0.25 A) trr Maximum Forward Recovery Time (IF = 1.0 A, di/dt = 100 A/ms, IREC to 1.0 V) tfr 75 ns WAVAL 10 mJ IF, INSTANTANEOUS FORWARD CURRENT (A) 10 VF @ 175°C 150°C 1.0 100°C 25°C 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VF, INSTANTANEOUS VOLTAGE (V) Figure 1. Maximum Forward Voltage 10 IF, INSTANTANEOUS FORWARD CURRENT (A) ns 100 75 Controlled Avalanche Energy (See Test Circuit in Figure 6) VF @ 175°C 100°C 150°C 1.0 25°C 0.1 0.0 mA 600 10 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. 0.1 0.0 V 1.75 2.20 0.5 1.0 1.5 2.0 2.5 3.0 VF, INSTANTANEOUS VOLTAGE (V) Figure 2. Typical Forward Voltage http://onsemi.com 2 3.5 MUR2100E 1.0E−01 1.0E−01 IR, REVERSE CURRENT (A) IR, REVERSE CURRENT (A) VR @ 175°C 1.0E−02 1.0E−03 150°C 100°C 1.0E−04 1.0E−05 25°C 1.0E−06 1.0E−07 1.0E−02 1.0E−03 VR @ 175°C 1.0E−04 150°C 1.0E−05 100°C 1.0E−06 1.0E−07 25°C 1.0E−08 1.0E−08 0 200 400 600 800 1000 0 3.0 2.5 DC 1.5 SQUARE WAVE 0.5 0 50 100 150 200 PF(AV), AVERAGE POWER DISSIPATION (A) 3.5 2 SQUARE WAVE DC 1 0 0 0.5 1.5 2 Figure 6. Power Dissipation 10 1 40 1 IF(AV), AVERAGE FORWARD CURRENT (A) 100 20 1000 3 Figure 5. Current Derating 0 800 4 TA, AMBIENT TEMPERATURE (°C) C, CAPACITANCE (pF) IF(AV), AVERAGE FORWARD CURRENT (A) 4.0 0 600 Figure 4. Typical Reverse Current Figure 3. Maximum Reverse Current 1.0 400 VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) 2.0 200 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) Figure 7. Typical Capacitance http://onsemi.com 3 2.5 MUR2100E NOTE 3. − AMBIENT MOUNTING DATA Data shown for thermal resistance, junction−to−ambient (RqJA) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. TYPICAL VALUES FOR RqJA IN STILL AIR Lead 1/8 52 67 Mounting Method 1 2 RqJA 3 Length, L 1/4 1/2 65 72 80 87 Units °C/W °C/W 50 °C/W MOUNTING METHOD 1 L L ÉÉÉÉÉÉÉÉÉÉÉ MOUNTING METHOD 2 ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ L L Vector Pin Mounting ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ MOUNTING METHOD 3 L = 3/8 ″ Board Ground Plane P.C. Board with 1−1/2 ″ X 1−1/2″ Copper Surface http://onsemi.com 4 MUR2100E PACKAGE DIMENSIONS AXIAL LEAD CASE 59−10 ISSUE U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. ALL RULES AND NOTES ASSOCIATED WITH JEDEC DO−41 OUTLINE SHALL APPLY 4. POLARITY DENOTED BY CATHODE BAND. 5. LEAD DIAMETER NOT CONTROLLED WITHIN F DIMENSION. B K D DIM A B D F K F A POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) INCHES MIN MAX 0.161 0.205 0.079 0.106 0.028 0.034 −−− 0.050 1.000 −−− MILLIMETERS MIN MAX 4.10 5.20 2.00 2.70 0.71 0.86 −−− 1.27 25.40 −−− STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE F K SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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