MUR490E, MUR4100E MUR4100E is a Preferred Device SWITCHMODEt Power Rectifiers Ultrafast “E’’ Series with High Reverse Energy Capability http://onsemi.com These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. ULTRAFAST RECTIFIERS 4.0 AMPS, 900 − 1000 VOLTS Features • 20 mJ Avalanche Energy Guaranteed • Excellent Protection Against Voltage Transients in Switching • • • • • • • Inductive Load Circuits Ultrafast 75 Nanosecond Recovery Time 175°C Operating Junction Temperature Low Forward Voltage Low Leakage Current High Temperature Glass Passivated Junction Reverse Voltage to 1000 V These are Pb−Free Devices AXIAL LEAD CASE 267−05 STYLE 1 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 1.1 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal MARKING DIAGRAM A MUR 4xxxE YYWW G G Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • 220°C Max for 10 Seconds, 1/16″ from Case Polarity: Cathode Indicated by Polarity Band MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MUR490E MUR4100E VRRM VRWM VR Average Rectified Forward Current (Sq. Wave) (Mounting Method #3 Per Note 1) IF(AV) 4.0 @ TA = 35°C A Nonrepetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) IFSM 70 A Operating Junction Storage Temperature TJ, Tstg −65 to +175 V 900 1000 Thermal Resistance, Junction−to−Case ORDERING INFORMATION Package Shipping † MUR490E Axial Lead* 500 Units / Bulk MUR4100E Axial Lead* 500 Units / Bulk MUR4100EG Axial Lead* 500 Units / Bulk MUR4100ERL Axial Lead* 1,500/Tape & Reel MUR4100ERLG Axial Lead* 1,500/Tape & Reel Device °C THERMAL CHARACTERISTICS Characteristic A = Assembly Location MUR4xxxE = Device Code xxx = 90 or 100 YY = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) Symbol Max Unit RqJC See Note 1 °C/W Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 3 1 Publication Order Number: MUR490E/D MUR490E, MUR4100E ELECTRICAL CHARACTERISTICS Characteristics Symbol Value Unit Maximum Instantaneous Forward Voltage (Note 1) (iF = 3.0 Amps, TJ = 150°C) (iF = 3.0 Amps, TJ = 25°C) (iF = 4.0 Amps, TJ = 25°C) vF V Maximum Instantaneous Reverse Current (1) (Rated dc Voltage, TJ = 100°C) (Rated dc Voltage, TJ = 25°C) iR Maximum Reverse Recovery Time (IF = 1.0 Amp, di/dt = 50 Amp/ms) (IF = 0.5 Amp, iR = 1.0 Amp, IREC = 0.25 Amp) trr Maximum Forward Recovery Time (IF = 1.0 Amp, di/dt = 100 Amp/ms, Recovery to 1.0 V) tfr 75 ns WAVAL 20 mJ 1.53 1.75 1.85 mA 900 25 ns 100 75 Controlled Avalanche Energy (See Test Circuit in Figure 6) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. IR, REVERSE CURRENT (m A) 20 25°C TJ = 175°C 10 100°C 7.0 3.0 2.0 TJ = 175°C 100°C 25°C *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 0 100 200 300 400 500 600 700 800 1.0 VR, REVERSE VOLTAGE (VOLTS) 0.7 Figure 2. Typical Reverse Current* 0.5 IF(AV) , AVERAGE FORWARD CURRENT (AMPS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 5.0 1000 400 200 100 40 20 10 4.0 2.0 1.0 0.4 0.2 0.1 0.04 0.02 0.01 0.004 0.002 0.001 0.3 0.2 0.1 0.07 0.05 0.03 10 Rated VR RqJA = 28°C/W 8.0 6.0 dc 4.0 SQUARE WAVE 2.0 0 0 0.02 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 vF, INSTANTANEOUS VOLTAGE (VOLTS) 1.8 50 100 150 200 TA, AMBIENT TEMPERATURE (°C) 2 Figure 3. Current Derating (Mounting Method #3 Per Note 1) Figure 1. Typical Forward Voltage http://onsemi.com 2 900 1000 2 10 70 60 50 TJ = 175°C 9.0 8.0 5.0 7.0 6.0 C, CAPACITANCE (pF) PF(AV) , AVERAGE POWER DISSIPATION (WATTS) MUR490E, MUR4100E 10 5.0 (Capacitive IPK =20 IAV Load) 4.0 dc 3.0 SQUAREWAVE 2.0 0 1.0 2.0 3.0 5.0 4.0 TJ = 25°C 30 20 10 9.0 8.0 7.0 1.0 0 40 0 10 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 4. Power Dissipation 20 30 40 VR, REVERSE VOLTAGE (VOLTS) 50 Figure 5. Typical Capacitance +VDD IL 40 mH COIL BVDUT VD MERCURY SWITCH ID ID IL DUT S1 VDD t0 Figure 6. Test Circuit t1 t2 t Figure 7. Current−Voltage Waveforms The unclamped inductive switching circuit shown in Figure 6 was used to demonstrate the controlled avalanche capability of the new “E’’ series Ultrafast rectifiers. A mercury switch was used instead of an electronic switch to simulate a noisy environment when the switch was being opened. When S1 is closed at t0 the current in the inductor IL ramps up linearly; and energy is stored in the coil. At t1 the switch is opened and the voltage across the diode under test begins to rise rapidly, due to di/dt effects, when this induced voltage reaches the breakdown voltage of the diode, it is clamped at BVDUT and the diode begins to conduct the full load current which now starts to decay linearly through the diode, and goes to zero at t2. By solving the loop equation at the point in time when S1 is opened; and calculating the energy that is transferred to the diode it can be shown that the total energy transferred is equal to the energy stored in the inductor plus a finite amount of energy from the VDD power supply while the diode is in breakdown (from t1 to t2) minus any losses due to finite component resistances. Assuming the component resistive elements are small Equation (1) approximates the total energy transferred to the diode. It can be seen from this equation that if the VDD voltage is low compared to the breakdown voltage of the device, the amount of energy contributed by the supply during breakdown is small and the total energy can be assumed to be nearly equal to the energy stored in the coil during the time when S1 was closed, Equation (2). The oscilloscope picture in Figure 8, shows the information obtained for the MUR8100E (similar die construction as the MUR4100E Series) in this test circuit conducting a peak current of one ampere at a breakdown voltage of 1300 V, and using Equation (2) the energy absorbed by the MUR8100E is approximately 20 mjoules. Although it is not recommended to design for this condition, the new “E’’ series provides added protection against those unforeseen transient viruses that can produce unexplained random failures in unfriendly environments. http://onsemi.com 3 MUR490E, MUR4100E EQUATION (1): ǒ BV 2 DUT W [ 1 LI LPK AVAL 2 BV –V DUT DD Ǔ CH1 CH2 500V 50mV A 20ms 953 V VERT CHANNEL 2: IL 0.5 AMPS/DIV. CHANNEL 1: VDUT 500 VOLTS/DIV. EQUATION (2): 2 W [ 1 LI LPK AVAL 2 TIME BASE: 20 ms/DIV. 1 CH1 ACQUISITIONS SAVEREF SOURCE CH2 217:33 HRS STACK REF REF Figure 8. Current−Voltage Waveforms NOTE 1 — AMBIENT MOUNTING DATA Data shown for thermal resistance junction−to−ambient (RqJA) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. TYPICAL VALUES FOR RqJA IN STILL AIR Mounting Method 1 2 RqJA Lead Length, L (IN) 1/8 1/4 1/2 3/4 50 51 53 55 58 59 61 63 Units °C/W °C/W 28 °C/W 3 MOUNTING METHOD 1 MOUNTING METHOD 2 P.C. Board Where Available Copper Surface area is small. L Vector Push−In Terminals T−28 L ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ L MOUNTING METHOD 3 É É É É É É É P.C. Board with 1−1/2 ″ x 1−1/2 ″ Copper Surface L = 1/2 ″ Board Ground Plane http://onsemi.com 4 L MUR490E, MUR4100E PACKAGE DIMENSIONS AXIAL LEAD CASE 267−05 ISSUE G K D A 1 B 2 K NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 267−04 OBSOLETE, NEW STANDARD 267−05. DIM A B D K INCHES MIN MAX 0.287 0.374 0.189 0.209 0.047 0.051 1.000 −−− MILLIMETERS MIN MAX 7.30 9.50 4.80 5.30 1.20 1.30 25.40 −−− STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE SWITCHMODE registered trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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