Si4914DY Datasheet

Si4914DY
Vishay Siliconix
New Product
Dual N-Channel 30-V (D-S) MOSFET with Schottky Diode
FEATURES
PRODUCT SUMMARY
VDS (V)
rDS(on) (Ω)
Channel-1
30
Channel-2
• LITTLE FOOT® Plus Integrated Schottky
• 100 % Rg Tested
ID (A)
0.023 at VGS = 10 V
7.0
0.032 at VGS = 4.5 V
5.6
0.020 at VGS = 10 V
7.4
0.027 at VGS = 4.5 V
6.4
RoHS
APPLICATIONS
COMPLIANT
• Logic DC/DC
- Notebook PC
SCHOTTKY PRODUCT SUMMARY
VDS (V)
VSD (V)
Diode Forward Voltage
IF (A)
30
0.40 V at 1.0 A
2.0
D1
SO-8
D1
G1
8
G1
2
7
S1/D2
G2
3
6
S1/D2
S2
4
5
S1/D2
D1
1
N-Channel 1
MOSFET
S1/D2
Schottky Diode
G2
N-Channel 2
MOSFET
Top View
Ordering Information: Si4914DY-T1-E3 (Lead (Pb)-free)
S2
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Channel-1
10 sec
Channel-2
Steady State
10 sec
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
20
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 70 °C
7.0
5.6
IDM
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
Single Pulse Avalanche Current
L = 0.1 mH
Avalanche Energy
Maximum Power Dissipationa
ID
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
IS
5.5
7.4
4.3
6
5.7
4.5
1.8
0.95
IAS
13
15
EAS
8.45
11
PD
A
40
1.0
mJ
1.9
1.1
2.0
1.16
1.2
0.71
1.3
0.74
TJ, Tstg
Unit
V
40
1.7
Steady State
- 55 to 150
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Symbol
t ≤ 10 sec
Steady State
Steady State
RthJA
RthJF
Channel-1
Typ
Channel-2
Max
Typ
Max
52
65
47
60
90
112
85
107
30
38
28
35
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 Board.
Document Number: 72938
S-61959-Rev. C, 09-Oct-06
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Si4914DY
Vishay Siliconix
MOSFET SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Typa
Max
Unit
Static
VGS(th)
VDS = VGS, ID = 250 µA
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = 20 V
Zero Gate Voltage Drain Current
IDSS
Gate Threshold Voltage
VDS = 30 V, VGS = 0 V
VDS = 30 V, VGS = 0 V, TJ = 85 °C
On-State Drain Currentb
Drain-Source On-State Resistanceb
VDS = 5 V, VGS = 10 V
ID(on)
VGS = 10 V, ID = 7.0 A
VGS = 10 V, ID = 7.4 A
VGS = 4.5 V, ID = 5.6 A
VGS = 4.5 V, ID = 6.4 A
VDS = 15 V, ID = 7.0 A
VDS = 15 V, ID = 7.4 A
IS = 1.7 A, VGS = 0 V
IS = 1 A, VGS = 0 V
rDS(on)
Forward Transconductanceb
gfs
Diode Forward Voltageb
VSD
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
1.0
1.0
2.5
2.5
100
100
1
500
0.015
20
20
20
V
nA
µA
mA
A
0.019
0.016
0.026
0.022
19
22
0.75
0.36
0.023
0.020
0.032
0.027
5.6
7.3
2.3
2.8
1.7
2.2
2.3
1.6
6
7
13
13
27
35
9
10
30
30
8.5
11
Ω
S
1.1
0.40
V
Dynamica
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
td(on)
tr
Rise Time
Turn-Off Delay Time
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
Channel-1
VDS = 15 V, VGS = 4.5 V, ID = 7.0 A
Channel-2
VDS = 15 V, VGS = 4.5 V, ID = 7.4 A
Channel-1
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω
Channel-2
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω
IF = 1.3 A, di/dt = 100 A/µs
IF = 2.2 A, di/dt = 100 µA/µs
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
0.5
0.5
nC
3.6
2.5
10
11
20
20
40
53
15
15
50
50
Ω
ns
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
SCHOTTKY SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Forward Voltage Drop
VF
Maximum Reverse Leakage Current
Irm
Junction Capacitance
CT
Test Conditions
IF = 1.0 A
IF = 1.0 A, TJ = 150 °C
Vr = 30 V
Vr = 30 V, TJ = 100 °C
Vr = - 30 V, TJ = 125 °C
Vr = 10 V
Min
Typ
0.36
0.27
0.008
3.5
10
58
Max
0.40
0.31
0.50
10
100
Unit
V
mA
pF
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72938
S-61959-Rev. C, 09-Oct-06
Si4914DY
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS
25 °C, unless noted
40
40
VGS = 10 thru 4 V
32
30
I D – Drain Current (A)
I D – Drain Current (A)
35
25
20
15
3V
10
24
16
TC = 125 °C
8
5
25 °C
0
0
1
2
3
4
0
0.0
5
0.5
1.0
VDS – Drain-to-Source Voltage (V)
0.05
1000
0.04
800
C – Capacitance (pF)
DS(on) – On-Resistance (Ω)
2.5
3.0
3.5
4.0
4.5
Transfer Characteristics
0.03
VGS = 4.5 V
VGS = 10 V
0.02
Ciss
600
400
Coss
200
0.01
Crss
0
0.00
0
5
10
15
20
25
30
35
0
40
5
10
On-Resistance vs. Drain Current
25
30
1.8
VDS = 15 V
ID = 7 A
rDS(on) – On-Resistance
(Normalized)
1.6
4
3
2
1
0
0.0
20
Capacitance
6
5
15
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
V GS – Gate-to-Source Voltage (V)
2.0
VGS – Gate-to-Source Voltage (V)
Output Characteristics
r
1.5
- 55 °C
VGS = 10 V
ID = 7 A
1.4
1.2
1.0
0.8
1.5
3.0
4.5
6.0
7.5
0.6
- 50
- 25
0
25
50
75
100
125
Qg – Total Gate Charge (nC)
TJ – Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 72938
S-61959-Rev. C, 09-Oct-06
150
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Si4914DY
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS 25 °C, unless noted
0.10
DS(on) – On-Resistance (Ω)
TJ = 150 °C
10
TJ = 25 °C
r
I S – Source Current (A)
40
1
0.0
0.08
0.06
0.04
ID = 7 A
0.02
0.00
0.2
0.4
0.6
0.8
1.0
1.2
0
1.4
2
6
8
10
VGS – Gate-to-Source Voltage (V)
VSD – Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.4
200
0.2
160
ID = 250 µA
0.0
Power (W)
V GS(th) Variance (V)
4
- 0.2
120
80
- 0.4
40
- 0.6
- 0.8
- 50
0
- 25
0
25
50
75
100
125
150
0.001
0.01
TJ – Temperature (°C)
0.1
1
10
Time (sec)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
100
rDS(on) Limited
IDM Limited
I D – Drain Current (A)
10
1 ms
1
ID(on)
Limited
10 ms
100 ms
0.1
TC = 25 °C
Single Pulse
1s
BVDSS Limited
10 s
dc
0.01
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
Safe Operating Area
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Document Number: 72938
S-61959-Rev. C, 09-Oct-06
Si4914DY
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS 25 °C, unless noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 90 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10- 4
10- 3
10- 2
10- 1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
Square Wave Pulse Duration (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Document Number: 72938
S-61959-Rev. C, 09-Oct-06
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Si4914DY
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS 25 °C, unless noted
40
40
VGS = 10 thru 4 V
35
35
30
I D – Drain Current (A)
I D – Drain Current (A)
30
25
3V
20
15
10
25
20
15
TC = 125 °C
10
25 °C
5
5
0
0
0.0
- 55 °C
0
1
2
3
4
5
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VGS – Gate-to-Source Voltage (V)
VDS – Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
1400
0.040
1120
0.030
0.025
C – Capacitance (pF)
r DS(on) – On-Resistance (Ω)
0.035
VGS = 4.5 V
0.020
0.015
VGS = 10 V
Ciss
840
560
Coss
0.010
280
Crss
0.005
0.000
0
0
5
10
15
20
25
30
35
40
0
5
ID – Drain Current (A)
10
20
25
30
VDS – Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
1.8
6
VDS = 15 V
ID = 7.4 A
5
1.6
rDS(on) – On-Resistance
(Normalized)
V GS – Gate-to-Source Voltage (V)
15
4
3
2
VGS = 10 V
ID = 7.4 A
1.4
1.2
1.0
0.8
1
0
0
2
4
6
Qg – Total Gate Charge (nC)
Gate Charge
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6
8
10
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ – Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 72938
S-61959-Rev. C, 09-Oct-06
Si4914DY
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS 25 °C, unless noted
DS(on) – On-Resistance (Ω)
0.10
TJ = 150 °C
10
TJ = 25 °C
r
I S – Source Current (A)
40
1
0.0
0.08
0.06
0.04
ID = 7.4 A
0.02
0.00
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
2
VSD – Source-to-Drain Voltage (V)
6
8
10
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
100
200
160
10
Power (W)
I R – Reverse Current (mA)
4
1
0.1
120
80
40
0.01
0.001
0
0
25
50
75
100
125
150
0.001
0.01
TJ – Temperature (°C)
0.1
1
10
Time (sec)
Reverse Current vs. Junction Temperature
Single Pulse Power, Junction-to-Ambient
100
rDS(on) Limited
IDM Limited
I D – Drain Current (A)
10
1 ms
1
10 ms
ID(on)
Limited
100 ms
0.1
1s
TC = 25 °C
Single Pulse
10 s
dc
BVDSS Limited
0.01
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
Safe Operating Area
Document Number: 72938
S-61959-Rev. C, 09-Oct-06
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Si4914DY
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS 25 °C, unless noted
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 85 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
1
10
100
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
Square Wave Pulse Duration (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
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data, see http://www.vishay.com/ppg?72938.
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Document Number: 72938
S-61959-Rev. C, 09-Oct-06
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Document Number: 91000
Revision: 18-Jul-08
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