74HC2G125-Q100; 74HCT2G125-Q100 Dual buffer/line driver; 3-state Rev. 1 — 3 April 2013 Product data sheet 1. General description The 74HC2G125-Q100; 74HC2G125-Q100 are dual buffer/line drivers with 3-state outputs controlled by the output enable inputs (nOE). Inputs include clamp diodes which enable the use of current limiting resistors to interface inputs to voltages in excess of VCC. This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications. 2. Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 1) Specified from 40 C to +85 C and from 40 C to +125 C Input levels: For 74HC2G125-Q100: CMOS level For 74HCT2G125-Q100: TTL level Wide supply voltage range from 2.0 V to 6.0 V Symmetrical output impedance High noise immunity Low power consumption Balanced propagation delays ESD protection: MIL-STD-883, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) Multiple package options NXP Semiconductors 74HC2G125-Q100; 74HCT2G125-Q100 Dual buffer/line driver; 3-state 3. Ordering information Table 1. Ordering information Type number Package 74HC2G125DP-Q100 Temperature range Name 40 C to +125 C TSSOP8 plastic thin shrink small outline package; 8 leads; SOT505-2 body width 3 mm; lead length 0.5 mm 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm 74HCT2G125DP-Q100 74HC2G125DC-Q100 74HCT2G125DC-Q100 Description Version SOT765-1 4. Marking Table 2. Marking Type number Marking code[1] 74HC2G125DP-Q100 H25 74HCT2G125DP-Q100 T25 74HC2G125DC-Q100 H25 74HCT2G125DC-Q100 T25 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 2 1A 1 1OE 1Y 6 2 1 5 2A 2Y 1 6 EN1 3 A 5 7 7 2OE Logic symbol 74HC_HCT2G125_Q100 Product data sheet EN2 OE mce186 mce185 Fig 1. 2 Fig 2. Y 3 IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 mna120 Fig 3. Logic diagram (one driver) © NXP B.V. 2013. All rights reserved. 2 of 15 74HC2G125-Q100; 74HCT2G125-Q100 NXP Semiconductors Dual buffer/line driver; 3-state 6. Pinning information 6.1 Pinning 74HC2G125-Q100 74HCT2G125-Q100 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A aaa-006894 Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 6.2 Pin description Table 3. Pin description Symbol Pin Description 1OE, 2OE 1, 7 output enable input (active LOW) 1A, 2A 2, 5 data input GND 4 ground (0 V) 1Y, 2Y 6, 3 data output VCC 8 supply voltage 7. Functional description Table 4. Function table[1] Control Input Output nOE nA nY L L L L H H H X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V [1] output clamping current IO output current ICC supply current IOK 74HC_HCT2G125_Q100 Product data sheet Conditions Max Unit 0.5 +7.0 V - 20 mA VO < 0.5 V or VO > VCC + 0.5 V [1] - 20 mA VO = 0.5 V to (VCC + 0.5 V) [1] - 35 mA - 70 mA All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 Min © NXP B.V. 2013. All rights reserved. 3 of 15 74HC2G125-Q100; 74HCT2G125-Q100 NXP Semiconductors Dual buffer/line driver; 3-state Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter IGND ground current Tstg storage temperature [2] Tamb = 40 C to +125 C total power dissipation Ptot [1] Conditions [2] Min Max Unit 70 - mA 65 +150 C - 300 mW The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74HC2G125-Q100 74HCT2G125-Q100 Unit Min Typ Max Min Typ Max 2.0 5.0 6.0 4.5 5.0 5.5 V input voltage 0 - VCC 0 - VCC V output voltage 0 - VCC 0 - VCC V C VCC supply voltage VI VO Tamb ambient temperature 40 +25 +125 40 +25 +125 t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 C. Symbol Parameter Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit Conditions Min Typ Max Min Max VCC = 2.0 V 1.5 1.2 - 1.5 - V 74HC2G125-Q100 VIH VIL VOH HIGH-level input voltage VCC = 4.5 V 3.15 2.4 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - V LOW-level input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 V HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - V 74HC_HCT2G125_Q100 Product data sheet IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - V IO = 6.0 mA; VCC = 4.5 V 3.84 4.32 - 3.7 - V IO = 7.8 mA; VCC = 6.0 V 5.34 5.81 - 5.2 - V All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 4 of 15 74HC2G125-Q100; 74HCT2G125-Q100 NXP Semiconductors Dual buffer/line driver; 3-state Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 C. Symbol VOL Parameter Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit Conditions Min Typ Max Min Max LOW-level output VI = VIH or VIL voltage IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 V IO = 6.0 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V IO = 7.8 mA; VCC = 6.0 V - 0.16 0.33 - 0.4 V VI = VCC or GND; VCC = 6.0 V - - 1.0 - 1.0 A II input leakage current IOZ OFF-state output VI = VIH or VIL; current VO = VCC or GND; VCC = 6.0 V - - 5.0 - 10 A ICC supply current - - 10 - 20 A CI input capacitance - 1.0 - - - pF CO output capacitance - 1.5 - - - pF VI = VCC or GND; IO = 0 A; VCC = 6.0 V 74HCT2G125-Q100 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V VOL IO = 20 A 4.4 4.5 - 4.4 - V IO = 6.0 mA 3.84 4.32 - 3.7 - V - 0 0.1 - 0.1 V - 0.16 0.33 - 0.4 V - - 1.0 - 1.0 A LOW-level output VI = VIH or VIL; VCC = 4.5 V voltage IO = 20 A IO = 6.0 mA II input leakage current IOZ OFF-state output VI = VIH or VIL; VO = current VCC or GND; VCC = 5.5 V - - 5.0 - 10 ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 10 - 20 A ICC additional supply current per input; VCC = 4.5 V to 5.5 V; VI = VCC 2.1 V; IO = 0 A - - 375 - 410 A CI input capacitance - 1.0 - - - pF CO output capacitance - 1.5 - - - pF 74HC_HCT2G125_Q100 Product data sheet VI = VCC or GND; VCC = 5.5 V All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 5 of 15 NXP Semiconductors 74HC2G125-Q100; 74HCT2G125-Q100 Dual buffer/line driver; 3-state 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 7. Symbol Parameter Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit Conditions Min Typ[1] Max Min Max VCC = 2.0 V - 35 115 - 135 ns VCC = 4.5 V - 11 23 - 27 ns VCC = 5.0 V; CL = 15 pF - 10 - - - ns VCC = 6.0 V - 8 20 - 23 ns VCC = 2.0 V - 40 115 - 135 ns VCC = 4.5 V - 11 23 - 27 ns VCC = 6.0 V - 8 20 - 23 ns VCC = 2.0 V - 24 125 - 150 ns VCC = 4.5 V - 12 25 - 30 ns VCC = 6.0 V - 10 21 - 26 ns VCC = 2.0 V - 18 75 - 90 ns VCC = 4.5 V - 6 15 - 18 ns VCC = 6.0 V - 5 13 - 15 ns output enabled - 11 - - - pF output disabled - 1 - - - pF - 15 31 - 38 ns 74HC2G125-Q100 tpd ten tdis tt CPD propagation delay enable time disable time transition time power dissipation capacitance [2] nA to nY; see Figure 5 [2] nOE to nY; see Figure 6 [2] nOE to nY; see Figure 6 [2] see Figure 5 per buffer; VI = GND to VCC [3] 74HCT2G125-Q100 [2] propagation delay nA to nY; see Figure 5 - 12 - - - ns ten enable time nOE to nY; see Figure 6; VCC = 4.5 V [2] - 15 35 - 42 ns tdis disable time nOE to nY; see Figure 6; VCC = 4.5 V [2] - 15 31 - 38 ns tt transition time see Figure 5; VCC = 4.5 V [2] - 6 15 - 18 ns tpd VCC = 4.5 V VCC = 5.0 V; CL = 15 pF 74HC_HCT2G125_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 6 of 15 74HC2G125-Q100; 74HCT2G125-Q100 NXP Semiconductors Dual buffer/line driver; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 7. Symbol Parameter CPD power dissipation capacitance Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit Conditions Min Typ[1] Max Min Max output enabled - 11 - - - pF output disabled - 1 - - - pF [3] per buffer; VI = GND to VCC 1.5 V [1] All typical values are measured at Tamb = 25 C. [2] tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 12. Waveforms VI input nA VM VM GND t PHL t PLH VOH output nY 90 % VM VM 10 % VOL t THL t TLH 001aad982 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 5. Propagation delays data input (nA) to output (nY) 74HC_HCT2G125_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 7 of 15 74HC2G125-Q100; 74HCT2G125-Q100 NXP Semiconductors Dual buffer/line driver; 3-state VI nOE input VM GND tPLZ tPZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL tPHZ VOH tPZH VY output HIGH-to-OFF OFF-to-HIGH GND VM outputs enabled outputs enabled outputs disabled mna362 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 6. Table 9. Enable and disable times Measurement points Type Input Output VM VM VX VY 74HC2G125-Q100 0.5VCC 0.5VCC VOL + 0.3 V VOH 0.3 V 74HCT2G125-Q100 1.3 V 1.3 V VOL + 0.3 V VOH 0.3 V 74HC_HCT2G125_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 8 of 15 74HC2G125-Q100; 74HCT2G125-Q100 NXP Semiconductors Dual buffer/line driver; 3-state VI tW 90 % negative pulse VM 0V VI tf tr tr tf 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC VI G VO RL S1 open DUT CL RT 001aad983 Test data is given in Table 10. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 7. Table 10. Test circuit for measuring switching times Test data Type Input VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC2G125-Q100 VCC 6 ns 15 pF, 50 pF 1 k open GND VCC 74HCT2G125-Q100 3V 6 ns 15 pF, 50 pF 1 k open GND VCC 74HC_HCT2G125_Q100 Product data sheet Load S1 position All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 9 of 15 74HC2G125-Q100; 74HCT2G125-Q100 NXP Semiconductors Dual buffer/line driver; 3-state 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 Fig 8. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Package outline SOT505-2 (TSSOP8) 74HC_HCT2G125_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 10 of 15 74HC2G125-Q100; 74HCT2G125-Q100 NXP Semiconductors Dual buffer/line driver; 3-state VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 Fig 9. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Package outline SOT765-1 (VSSOP8) 74HC_HCT2G125_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 11 of 15 74HC2G125-Q100; 74HCT2G125-Q100 NXP Semiconductors Dual buffer/line driver; 3-state 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MIL Military MM Machine Model 15. Revision history Table 12. Revision history Document ID Release date 74HC_HCT2G125_Q100 v.1 20130403 74HC_HCT2G125_Q100 Product data sheet Data sheet status Change notice Supersedes Product data sheet - - All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 12 of 15 NXP Semiconductors 74HC2G125-Q100; 74HCT2G125-Q100 Dual buffer/line driver; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74HC_HCT2G125_Q100 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 13 of 15 NXP Semiconductors 74HC2G125-Q100; 74HCT2G125-Q100 Dual buffer/line driver; 3-state No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74HC_HCT2G125_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2013 © NXP B.V. 2013. All rights reserved. 14 of 15 NXP Semiconductors 74HC2G125-Q100; 74HCT2G125-Q100 Dual buffer/line driver; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 3 April 2013 Document identifier: 74HC_HCT2G125_Q100