74HC2GU04-Q100 Dual unbuffered inverter Rev. 2 — 17 September 2014 Product data sheet 1. General description The 74HC2GU04-Q100 is a high-speed Si-gate CMOS device. The 74HC2GU04-Q100 provides two unbuffered inverters. This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications. 2. Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 1) Specified from 40 C to +85 C and from 40 C to +125 C Wide supply voltage range from 2.0 V to 6.0 V Complies with JEDEC standard no. 7A High noise immunity ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Low power dissipation Balanced propagation delays Multiple package options ESD protection: MIL-STD-883, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC2GU04GW-Q100 40 C to +125 C SC-88 plastic surface-mounted package; 6 leads SOT363 74HC2GU04GV-Q100 40 C to +125 C SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter 4. Marking Table 2. Marking Type number Marking code 74HC2GU04GW-Q100 PD 74HC2GU04GV-Q100 HU4 5. Functional diagram $ < $ < $ PQE PQE Fig 1. Logic symbol Fig 2. < PQD IEC logic symbol Fig 3. Logic diagram (one gate) 6. Pinning information 6.1 Pinning +&*84 $ < *1' 9&& $ < DDD Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin Description 1A 1 data input GND 2 ground (0 V) 2A 3 data input 2Y 4 data output VCC 5 supply voltage 1Y 6 data output 74HC2GU04-Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 2 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter 7. Functional description Table 4. Function table[1] Input Output nA nY L H H L [1] H = HIGH voltage level; L = LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit 0.5 +7.0 V input clamping current VI < 0.5 V or VI > VCC + 0.5 V [1] - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V [1] - 20 mA IO output current VO = 0.5 V to VCC + 0.5 V [1] - 25 mA supply current [1] - +50 mA IGND ground current [1] - 50 mA Tstg storage temperature 65 +150 C Ptot total power dissipation - 250 mW IIK ICC [2] [1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SC-88 and SC-74 packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage 2.0 5.0 6.0 V VI input voltage 0 - VCC V VO output voltage 0 - VCC V Tamb ambient temperature 40 +25 +125 C tr rise time VCC = 2.0 V - - 1000 ns VCC = 4.5 V - - 500 ns VCC = 6.0 V - - 400 ns VCC = 2.0 V - - 1000 ns VCC = 4.5 V - - 500 ns VCC = 6.0 V - - 400 ns tf fall time 74HC2GU04-Q100 Product data sheet except for Schmitt trigger inputs except for Schmitt trigger inputs All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 3 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit HIGH-level input voltage VCC = 2.0 V 1.7 1.1 - V VCC = 4.5 V 3.6 2.4 - V VCC = 6.0 V 4.8 3.1 - V VCC = 2.0 V - 0.9 0.3 V VCC = 4.5 V - 2.1 0.9 V VCC = 6.0 V - 2.9 1.2 V IO = 20 A; VCC = 2.0 V 1.9 2.0 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - V IO = 4.0 mA; VCC = 4.5 V 4.13 4.32 - V IO = 5.2 mA; VCC = 6.0 V 5.63 5.81 - V IO = 20 A; VCC = 2.0 V - 0 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 V Tamb = 25 C VIH VIL VOH VOL LOW-level input voltage HIGH-level output voltage LOW-level output voltage VI = VIH or VIL VI = VIH or VIL II input leakage current VI = GND or VCC; VCC = 6.0 V - - 0.1 A ICC supply current VI = GND or VCC; IO = 0 A; - - 1.0 A - 3.0 - pF VCC = 2.0 V 1.7 1.1 - V VCC = 4.5 V 3.6 2.4 - V VCC = 6.0 V 4.8 3.1 - V VCC = 2.0 V - 0.9 0.3 V VCC = 4.5 V - 2.1 0.9 V VCC = 6.0 V - 2.9 1.2 V IO = 20 A; VCC = 2.0 V 1.9 2.0 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - V IO = 4.0 mA; VCC = 4.5 V 4.13 4.32 - V IO = 5.2 mA; VCC = 6.0 V 5.63 5.81 - V VCC = 6.0 V CI input capacitance Tamb = 40 C to +85 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage 74HC2GU04-Q100 Product data sheet VI = VIH or VIL All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 4 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V - 0 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.33 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.33 V II input leakage current VI = GND or VCC; VCC = 6.0 V - - 1.0 A ICC supply current VI = GND or VCC; IO = 0 A; - - 10.0 A VCC = 2.0 V 1.7 - - V VCC = 4.5 V 3.6 - - V VCC = 6.0 V 4.8 - - V VCC = 2.0 V - - 0.3 V VCC = 4.5 V - - 0.9 V VCC = 6.0 V - - 1.2 V IO = 20 A; VCC = 2.0 V 1.9 - - V IO = 20 A; VCC = 4.5 V 4.4 - - V IO = 20 A; VCC = 6.0 V 5.9 - - V IO = 4.0 mA; VCC = 4.5 V 3.7 - - V IO = 5.2 mA; VCC = 6.0 V 5.2 - - V IO = 20 A; VCC = 2.0 V - - 0.1 V IO = 20 A; VCC = 4.5 V - - 0.1 V IO = 20 A; VCC = 6.0 V - - 0.1 V IO = 4.0 mA; VCC = 4.5 V - - 0.4 V IO = 5.2 mA; VCC = 6.0 V - - 0.4 V VCC = 6.0 V Tamb = 40 C to +125 C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage VI = VIH or VIL VI = VIH or VIL II input leakage current VI = GND or VCC; VCC = 6.0 V - - 1.0 A ICC supply current VI = GND or VCC; IO = 0 A; - - 20.0 A VCC = 6.0 V 74HC2GU04-Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 5 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 6. Symbol Parameter 25 C Conditions 40 C to +125 C Min Typ Max Min propagation delay tpd nA to nY; see Figure 5 VCC = 2.0 V; CL = 50 pF - 13 60 - 75 90 ns VCC = 4.5 V; CL = 50 pF - 6 12 - 15 18 ns - 5 10 - 13 15 ns VCC = 2.0 V; CL = 50 pF - 18 75 - 95 125 ns VCC = 4.5 V; CL = 50 pF - 6 15 - 19 25 ns - 5 13 - 16 20 ns - 5 - - - - pF [2] nY; see Figure 5 VCC = 6.0 V; CL = 50 pF power dissipation capacitance VI = GND to VCC CPD [1] tpd is the same as tPLH and tPHL [2] tt is the same as tTLH and tTHL [3] Max (125 C) [1] VCC = 6.0 V; CL = 50 pF transition time tt Max (85 C) Unit [3] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of the outputs. 12. Waveforms 9, Q$LQSXW 90 90 *1' W 3+/ W 3/+ 92+ Q<RXWSXW 90 90 92/ W 7+/ W 7/+ PQD Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 5. The data input (nA) to output (nY) propagation delays and output transition times 74HC2GU04-Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 6 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter Table 9. Measurement points Input Output VM VI tr = tf VM 0.5VCC GND to VCC 6.0 ns 0.5VCC 9&& 9&& 9, 38/6( *(1(5$725 92 5/ Nȍ RSHQ '87 57 &/ S) PJN Test data is given in Table 10. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 6. Test circuit for measuring switching times Table 10. Test data Input Test VI tr, tf tPHL, tPLH GND to VCC 6 ns open 13. Additional characteristics 5ELDV Nȍ 9&& ) LQSXW RXWSXW ) 9, I N+] $ ,2 *1' PQD I g fs = --------o V i VO is constant. Fig 7. Test set-up for measuring forward transconductance 74HC2GU04-Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 7 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter PQE JIV P$9 9&&9 Tamb = 25 C. Fig 8. Typical forward transconductance as a function of supply voltage 14. Typical transfer characteristics PQE ,&& $ 92 9 9,9 VCC = 2.0 V; IO = 0 A. Fig 9. PQE , && P$ Product data sheet 9 9 , VCC = 4.5 V; IO = 0 A. Typical transfer characteristics VCC = 2.0 V 74HC2GU04-Q100 92 9 Fig 10. Typical transfer characteristics VCC = 4.5 V All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 8 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter PQE , && P$ 9 2 9 9,9 VCC = 6.0 V; IO = 0 A. Fig 11. Typical transfer characteristics VCC = 6.0 V 15. Application information Some applications for the 74HC2GU04-Q100 are: • Linear amplifier (see Figure 12) • Crystal oscillator (see Figure 13). Remark: All values given are typical values unless otherwise specified. 5 9&& ) 5 8 =/ PQD ZL > 10 k. R1 3 k. R2 1 M. Open loop amplification: AOL = 20. A OL Voltage amplification: A V = – ----------------------------------------- . R1 1 + ------- 1 + AOL R2 Vo(p-p) = VCC 1.5 V centered at 0.5 VCC. Unity gain bandwidth product is 5 MHz. Fig 12. Linear amplifier application 74HC2GU04-Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 9 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter 5 5 8 & & RXW PQD Test data is given in Table 11 and Table 12. C1 = 47 pF. C2 = 22 pF. R1 = 1 M to 10 M. R2 optimum value depends on the frequency and required stability against changes in VCC or average minimum ICC (ICC = 2 mA at VCC = 3.0 V and f = 1 MHz). Fig 13. Crystal oscillator application Table 11. External components for resonator (f < 1 MHz) Frequency R1 R2 C1 C2 10 kHz to 15.9 kHz 2.2 M 220 k 56 pF 20 pF 16 kHz to 24.9 kHz 2.2 M 220 k 56 pF 10 pF 25 kHz to 54.9 kHz 2.2 M 100 k 56 pF 10 pF 55 kHz to 129.9 kHz 2.2 M 100 k 47 pF 5 pF 130 kHz to 199.9 kHz 2.2 M 47 k 47 pF 5 pF 200 kHz to 349.9 kHz 2.2 M 47 k 47 pF 5 pF 350 kHz to 600 kHz 2.2 M 47 k 47 pF 5 pF Table 12. Optimum value for R2 Frequency 3 kHz 6 kHz 10 kHz 14 kHz > 14 kHz 74HC2GU04-Q100 Product data sheet R2 Optimum 2.0 k for minimum required ICC 8.0 k for minimum influence due to change in VCC 1.0 k or minimum required ICC 4.7 k or minimum influence by VCC 0.5 k or minimum required ICC 2.0 k or minimum influence by VCC 0.5 k or minimum required ICC 2.0 k or minimum influence by VCC replace R2 by C3 = 35 pF (typical) All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 10 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter 16. Package outline 3ODVWLFVXUIDFHPRXQWHGSDFNDJHOHDGV 627 ' % $ ( \ ; +( Y 0 $ 4 SLQ LQGH[ $ $ H ES F /S Z 0 % H GHWDLO; PP VFDOH ',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ $ PD[ ES F ' ( H H +( /S 4 Y Z \ PP 287/,1( 9(56,21 5()(5(1&(6 ,(& -('(& -(,7$ 6& 627 (8523($1 352-(&7,21 ,668('$7( Fig 14. Package outline SOT363 (SC-88) 74HC2GU04-Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 11 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter 3ODVWLFVXUIDFHPRXQWHGSDFNDJH7623OHDGV ' 627 % $ ( \ +( ; Y 0 $ 4 SLQ LQGH[ $ $ F /S H ES Z 0 % GHWDLO; PP VFDOH ',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ $ ES F ' ( H +( /S 4 Y Z \ PP 287/,1( 9(56,21 5()(5(1&(6 ,(& -('(& -(,7$ 6& 627 (8523($1 352-(&7,21 ,668('$7( Fig 15. Package outline SOT457 (SC-74) 74HC2GU04-Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 12 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter 17. Abbreviations Table 13. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor ESD ElectroStatic Discharge HBM Human Body Model MIL Military MM Machine Model DUT Device Under Test 18. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC2GU04_Q100 v.2 20140917 Product data sheet - 74HC2GU04_Q100 v.1 Modifications: 74HC2GU04_Q100 v.1 74HC2GU04-Q100 Product data sheet • Section 1: Q100 automotive statement added in the general description. 20140825 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 - © NXP Semiconductors N.V. 2014. All rights reserved. 13 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 19.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74HC2GU04-Q100 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 14 of 16 74HC2GU04-Q100 NXP Semiconductors Dual unbuffered inverter No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74HC2GU04-Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 September 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 15 of 16 NXP Semiconductors 74HC2GU04-Q100 Dual unbuffered inverter 21. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 17 18 19 19.1 19.2 19.3 19.4 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Additional characteristics . . . . . . . . . . . . . . . . . 7 Typical transfer characteristics . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 September 2014 Document identifier: 74HC2GU04-Q100