LGA Package 84-Lead (15mm × 9mm × 4.32mm) (Reference LTC DWG # 05-08-1842 Rev B) SEE NOTES DETAIL A 4.22 – 4.42 7 aaa Z 6 5 4 3 2 7 1 A PAD “A1” CORNER DIA (0.630) PAD 1 B 4 C D E 15.00 BSC MOLD CAP F 13.97 BSC SUBSTRATE G H 0.27 – 0.37 3.95 – 4.05 J K Z bbb Z DETAIL B L M aaa Z 0.630 ±0.025 SQ. 83x X 9.00 BSC 3× CHAMFER 0.22 × 45° eee S X Y Y DETAIL B 1.27 BSC PADS SEE NOTES 3 PACKAGE BOTTOM VIEW 3.810 2.540 1.270 0.000 1.270 2.540 3.810 0.315 0.315 PACKAGE TOP VIEW 7.620 BSC DETAIL A 6.985 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 5.715 2. ALL DIMENSIONS ARE IN MILLIMETERS 4.445 3 LAND DESIGNATION PER JESD MO-222 3.175 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 1.905 0.635 0.000 0.635 1.905 3.175 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 84 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 4.445 5.715 6.985 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 COMPONENT PIN “A1” TRAY PIN 1 BEVEL LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 84 1212 REV B