LGA Package 71-Lead (15mm × 9mm × 2.82mm) (Reference LTC DWG # 05-08-1823 Rev A) SEE NOTES 7 2.670 – 2.970 7 aaa Z 6 5 4 3 2 1 PAD 1 Ø (0.635) A PAD 1 CORNER B 4 C D E 15.00 BSC 12.700 BSC F G H MOLD CAP SUBSTRATE J 0.27 – 0.37 DETAIL A PADS SEE NOTES X 9.00 BSC Y DETAIL A PACKAGE SIDE VIEW PACKAGE TOP VIEW aaa Z K 1.270 BSC Z bbb Z 2.40 – 2.60 3 L 1.27 BSC 7.620 BSC DETAIL A PACKAGE BOTTOM VIEW 0.635 ±0.025 SQ. 71x 3.810 2.540 1.270 0.000 1.270 2.540 3.810 eee S X Y 6.350 5.080 3.810 DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 2.540 3 LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 1.270 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 0.000 1.270 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 71 2.540 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 LTMXXXXXX µModule COMPONENT PIN 1 TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 71 1212 REV A