BGA Package 44-Lead (15mm × 15mm × 5.02mm) (Reference LTC DWG # 05-08-1881 Rev A) A DETAIL A Z 11 A2 aaa Z SEE NOTES 10 9 8 7 6 5 4 3 2 7 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.37 – 0.47 // bbb Z 3.95 – 4.05 H DETAIL B J K e L Øb (44 PLACES) ddd M Z X Y eee M Z X Y aaa Z E 3 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 6.350 0.630 ±0.025 Ø 44x 5.080 0.000 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW 2. ALL DIMENSIONS ARE IN MILLIMETERS DETAIL A 6.350 5.080 3.810 2.540 1.270 0.000 0.3175 1.270 0.3175 2.540 3.810 5.080 6.350 SEE NOTES G DETAIL B PACKAGE SIDE VIEW PACKAGE TOP VIEW e b DIMENSIONS SYMBOL A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee MIN 4.82 0.50 4.32 0.71 0.60 NOM 5.02 0.60 4.42 0.78 0.63 15.0 15.0 1.27 12.70 12.70 MAX 5.22 0.70 4.52 0.85 0.66 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 44 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu OR Sn Pb EUTECTIC 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX COMPONENT PIN “A1” TRAY PIN 1 BEVEL µModule PACKAGE IN TRAY LOADING ORIENTATION BGA 44 1212 REV A