TISP® THYRISTOR SURGE PROTECTORS March, 2013 Models TISP8201MDR-S and TISP8211MDR-S Changes to Die and Package Materials Description of Changes This Product Change Notification describes changes to the die materials in Bourns® Models TISP8201MDR-S and TISP8211MDR-S 8-Lead SOIC (150 mil) package to improve the parts’ robustness and optimize the manufacturing process. Recent continuous improvement activities have demonstrated that an improvement in long term moisture resistance may be achieved by the addition of a Nickel/Gold (NiAu) metal overcoat to selective parts of the Aluminium (Al) chip metallization. NiAu is currently present on the backside of the die as a contact metallization. The Bourns® Models TISP8201MDR-S and TISP8211MDR-S devices utilize similar silicon die for protection functionality. The change above will not affect form, fit or functionality of parts in application circuits since all active elements remain unchanged. There are no changes to the Bourns® Model TISP8201MDR-S and TISP8211MDR-S data sheet ratings or electrical characteristics and the improvements in robustness are achieved by modification to a single metal mask layer. The wafer fab process flow and process settings are not changed for these products. Qualification Requirements Assessment of the appropriate qualification stress test for each of the changes is made in agreement with Bourns Major Change Control Specification 14-0503. The identified change requiring qualification: Design Front Metal Design Change Material Qualification by Similarity Similar chip designs have recently been qualified as one of a pair of die within Model TISP9110LDMR-S in an 8-Lead SOIC (210 mil) package. The Bourns® Models TISP8201MDR-S and TISP8211MDR-S are qualified by similarity to Model TISP9110LDMR-S. Wafers are manufactured in Bourns’ facility in Bedford, UK using similar wafer fab processing and assembled in packages using the same mold compound. Qualification results for the addition of Nickel/Gold (NiAu) strap are attached. Product Labeling The product marking and labels are unchanged. TSP1303 Models TISP8201MDR-S and TISP8211MDR-S Changes to Die and Package Materials March, 2013 Page 2 of 3 Identification of the Changed Product Bourns maintains traceability back to source wafer lots and assembly sites for all TISP® products. Impact on Form, Fit, Function and Reliability Product ratings and electrical characteristics are unaffected by the change. There is no impact on form, fit, function or reliability. Samples Evaluation samples are available from April 2013 onward. Implementation Date First date code using above changes: 1337 Deliveries of such products may occur from September 2013 onward. If you have any questions or need additional information, please contact Customer Service/ Inside Sales. Product Qualification Report TISP9110LDMR-S Description of product range: Qualification of changes to the design and material content of TISP9110LDMR-S Qualification sample information is as follows: Die Technology: Die Name: Top Metal : Back Metal: Wafer Fab: Bipolar SCR Protector 5TY800TQ/5TY900TQ Al & AlNiAu AlNiAu Bourns, Bedford, UK Assembly Site: Mold Compound: Die Attach: Bond Wire: L/F Material: Lead Finish: AIC Penang, Malaysia Sumitomo G600 Ablestik 84-1LMISR4 2.0 mil Copper Copper 100% Matte Tin Description: Changes to Chip Metal Protection, Copper Wire Bonding, Die Design and Leadframe Design as described in the issued PCN. Lot 1 Stress Test/Conditions Moisture Induced Stress Sensitivity HTRB, 150oC, 1000h (Note 1) THB, 85oC/85%RH, 1000h (Note 1) HAST, 110oC/85%RH,264h (Note 1) Temperature Cycle, -65/+150oC, 200cs (Note 1) ESD HBM, 1.0kV, Class 1C Die Shear Strength, >5 kg Bond Pull Strength, >12 g Wire Bond Shear, >100 g Electrical Parameter Assessment Notes: 1. Standard Method SS/Accept EIA / JESD22 JESD22 JESD22 JESD22 JESD22 JESD22 MIL STD 883 MIL STD 883 JESD22 JESD86 A113 A108 A101 A110 A104 A114 2019.7 2011.7 B116 Level 1 76/0 76/0 45/0 76/0 3/0 32/0 32/0 32/0 32/0 Lot 2 Lot 3 MSL1 Precondition @ 260C Prior to Critical Stress Tests 76/0 76/0 76/0 76/0 76/0 76/0 45/0 45/0 45/0 76/0 76/0 76/0 3/0 3/0 3/0 32/0 32/0 32/0 32/0 32/0 32/0 32/0 32/0 32/0 32/0 32/0 32/0 Preconditioned according to JESD22 A113 Level 1 at 260 °C peak reflow temperature prior to Qualification Reliability Testing Bourns Ltd., Bedford,UK Oct 2012