*R oH V SC AV ER OM AI SIO PL LA N IA BL S NT E TISP4015L1AJ, TISP4030L1AJ, TISP4040L1AJ TISP4015L1BJ, TISP4030L1BJ, TISP4040L1BJ VERY LOW VOLTAGE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS TISP40xxL1AJ/BJ VLV Overvoltage Protectors Low Capacitance ‘4015 ................................................................................... 28 pF ‘4030 ................................................................................... 27 pF ‘4040 ................................................................................... 23 pF SMA Package (Top View) Digital Line Signal Level Protection - ISDN - xDSL R (B) 1 2 T (A) Safety Extra Low Voltage, SELV, values Device VDRM V(BO) V V ‘4015 ±8 ± 15 ‘4030 ± 15 ± 30 ‘4040 ± 25 ± 40 MDXXCCE SMB Package (Top View) R(B) 1 2 T(A) MDXXBGF 30 A “L” Series specified for: - ITU-T recommendations K.20, K.45, K.21 - FCC Part 68 and GR-1089-CORE Wave Shape Standard 2/10 µs 8/20 µs 10/160 µs GR-1089-CORE IEC 61000-4-5 FCC Part 68 ITU-T K.20/45/21 FCC Part 68 FCC Part 68 GR-1089-CORE 10/700 µs 10/560 µs 10/1000 µs Device Symbol T ITSP A 150 120 65 SD4XAA 45 R 35 30 T erminals T and R correspond to the alternative line designators of A and B Available in SMA and SMB Packages SMA Saves 25 % Placement Area Over SMB ............................................ UL Recognized Components Description These devices are designed to limit overvoltages on digital telecommunication lines. Overvoltages are normally caused by a.c. power system or lightning flash disturbances which are induced or conducted on to the telephone line. A single device provides 2-point protection and is typically used for the protection of transformer windings and low voltage electronics. The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on-state condition. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The device switches off when the diverted current falls below the holding current value. How To Order Device TISP40xxL1 Package Carrier For Standard For Lead Free Termination Finish Termination Finish Order As Order As SMA/DO-214AC J-Bend (AJ) Embossed Tape Reeled TISP40xxL1AJR (R) SMB/DO-214AA J-Bend (BJ) TISP40xxL1BJR Insert xx value corresponding to protection voltages of 15 V, 30 V and 40 V. *RoHS Directive 2002/95/EC Jan 27 2003 including Annex AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJR-S TISP40xxL1BJR-S TISP40xxL1AJ/BJ VLV Overvoltage Protectors Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted) Rating ‘4015 ‘4030 ‘4040 Repetitive peak off-state voltage Symbol Value Unit VDRM ±8 ±15 ± 25 V Non-repetitive peak on-state pulse current (see Notes 1 and 2) 2/10 µs (Telcordia GR-1089-CORE, 2/10 µs voltage wave shape) 8/20 µs (IEC 61000-4-5, comb ination wave generator, 1.2/50 voltage, 8/20 current) 10/160 µs (FCC Part 68, 10/160 µs voltage wave shape) 5/310 µs (ITU-T K.20/45/21, 10/700 µs voltage wave shape) 5/320 µs (FCC Part 68, 9/720 µs voltage wave shape) 10/560 µs (FCC Part 68, 10/560 µs voltage wave shape) 10/1000 µs (Telcordia GR-1089-CORE, 10/1000 µs voltage wave shape) ± 150 ± 120 ± 65 ± 45 ± 45 ± 35 ± 30 ITSP A Non-repetitive peak on-state current (see Notes 1 and 2) 20 ms (50 Hz) full sine wave 16.7 ms (60 Hz) full sine wave 0.2 s 50 Hz/60 Hz a.c. 2 s 50 Hz/60 Hz a.c. 1000 s 50 Hz/60 Hz a.c. 20 22 13 5 1.8 ITSM A Initial rate of rise of current (2/10 waveshape) di/d t 130 A/µs Maximum junction temperature TJM 150 °C Storage temperature range Tstg -65 to +150 °C NOTES: 1. Initially, the device must be in thermal equilibrium with TJ = 25 °C. 2. The surge may be repeated after the device returns to its initial conditions. Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted) Parameter Test Conditions Min Typ Max Unit ±5 µA IDRM Repetitive peak offstate current VD = VDRM V(BO) Breakover voltage di/dt = ±0.8 A/ms ‘4015 ‘4030 ‘4040 ±15 ±30 ±40 V V(BO) Impulse breakover voltage dv/dt = ±1000 V/µs, Linear voltage ramp, Maximum ramp value = ±500 V di/dt = ±5 A/µs, Linear current ramp, Maximum ramp value = ±10 A ‘4015 ‘4030 ‘4040 ±34 ±50 ±63 V I(BO) Breakover current di/dt = ±0.8 A/ms ±0.8 A ID Off-state current VD = ± 6 V VD = ± 13 V VD = ± 22 V ±2 µA IH Holding current IT = ±5 A, di/dt = +/-30 mA/ms ‘4015 ‘4030 ‘4040 ±50 mA AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted) (Continued) Parameter Test Conditions f = 1 MHz, Vd = 1 V rms, VD = 0 f = 1 MHz, Vd = 1 V rms, VD = 1 V Coff Off-state capacitance f = 1 MHz, Vd = 1 V rms, VD = 2 V Min ‘4015 ‘4030 ‘4040 ‘4015 ‘4030 ‘4040 ‘4015 ‘4030 ‘4040 Typ Max Unit 28 27 23 25 24 20 23 22 18 36 35 29 33 31 26 30 29 24 pF Typ Max Unit Thermal Characteristics Parameter RθJA Junctio n to free air thermal resistance Min Test Conditions EIA/JESD51-3 PCB, IT = ITSM(1000) , TA = 25 °C, (see Note 3) SMA SMB 265 mm x 210 mm populated line card, SMA 4-layer PCB, IT = ITSM(1000), TA = 25 °C SMB 125 120 60 55 °C/W NOTE 3: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths. AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors Parameter Measurement Information +i Quadrant I ITSP Switching Characteristic ITSM V(BO) I(BO) IH IDRM VD V DRM -v ID ID VD V DRM +v IDRM IH I(BO) V(BO) ITSM I Quadrant III Switching Characteristic ITSP -i PM4AC Figure 1. Voltage-Current Characteristic for T and R Terminals All Measurements are Referenced to the R Terminal AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors Typical Characteristics OFF-STATE CURRENT vs JUNCTION TEMPERATURE 1.10 TC4LVC 10000 NORMALIZED BREAKOVER VOLTAGE vs JUNCTION TEMPERATURE TC4LVE Normalized Breakover Voltage '4040L1 ID – Off-State Current - nA 1000 100 10 '4030L1 '4040L1 1 1.05 '4030L1 '4015L1 1.00 '4015L1 0.1 0 50 100 TA – Ambient Temperature – °C 0.95 150 -25 Figure 2. TC4LVB 2.0 30 20 NORMALIZED HOLDING CURRENT vs JUNCTION TEMPERATURE TC4LVD 1.5 Normalized Holding Current IT – On-State Current – A 150 Figure 3. ON-STATE CURRENT vs ON-STATE VOLTAGE 70 50 0 25 50 75 100 125 TJ - Junction Temperature - °C 10 7 5 3 2 1 0.7 0.5 0.3 0.2 1.0 0.9 0.8 0.7 0.6 0.5 0.1 1 2 3 4 VT – On-State Voltage – V 5 6 Figure 4. AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 0.4 -25 0 25 50 75 100 TJ - Junction Temperature - °C Figure 5. 125 150 TISP40xxL1AJ/BJ VLV Overvoltage Protectors Typical Characteristics CAPACITANCE vs OFF-STATE VOLTAGE TC4L1AA 30 Coff – Capacitance – pF TJ = 25 °C Vd = 1 V '4015 20 '4030 15 '4040 10 0.01 0.02 0.05 0.1 0.2 0.5 1 2 3 5 10 20 30 VD - Off-state Voltage - V Figure 6. AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors Rating and Thermal Information ITSM(t) - Non-Repetitive Peak On-State Current - A NON-REPETITIVE PEAK ON-STATE CURRENT vs CURRENT DURATION TI4MAI 30 VGEN = 600 Vrms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 20 15 10 9 8 7 6 5 4 3 2 1.5 0.01 0.1 1 10 100 1000 t - Current Duration - s Figure 7. VDRM DERATING FACTOR vs MINIMUM AMBIENT TEMPERATURE TI4LVA 1.00 '4015L1 Derating Factor 0.99 0.98 '4030L1 '4040L1 0.97 0.96 0.95 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 TAMIN - Minimum Ambient Temperature - °C Figure 8. AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors APPLICATIONS INFORMATION Transformer Protection The inductance of a transformer winding reduces considerably when the magnetic core material saturates. Saturation occurs when the magnetizing current through the winding inductance exceeds a certain value. It should be noted that this is a different current to the transformed current component from primary to secondary. The standard inductance-current relationship is: (( di E = – L ----dt where: L = unsaturated inductance value in H di = current change in A dt = time period in s for current change di E = winding voltage in V Rearranging this equation and working large ∆ changes to saturation gives the useful circuit relationship of: E x ∆t = L x ∆i A transformer winding volt-second value for saturation gives the designer an idea of circuit operation under overvoltage conditions. The volt-second value is not normally quoted, but most manufacturers should provide it on request. A 50 Vµs winding will support rectangular voltage pulses of 50 V for 1 µs, 25 V for 2 µs, 1 V for 50 µs and so on. Once the transformer saturates, primary to secondary coupling will be lost and the winding resistance, RW, shunts the overvoltage protector, Th1 - see Figure 9. This saturated condition is a concern for long duration impulses and a.c. fault conditions because the current capability of the winding wire may be exceeded. For example, if the on-state voltage of the protector is 1 V and the winding resistance is 0.2 Ω, the winding would bypass a current of 1/0.2 = 5 A, even though the protector was in the low voltage condition. T1 UNSATURATED Th1 T1 L SATURATED Th1 RW AI4XAO Figure 9. Transformer Saturation Figure 10 shows a generic protection arrangement. Resistors R1 and R2, together with the overcurrent protection, prevent excessive winding current flow under a.c. conditions. Normally these resistors would only be needed for special cases, e.g. some T1/E1 designs. Alternatively, a split winding could be used with a single resistor connecting the windings. This resistor could be by-passed by a small capacitor to reduce signal attenuation. OVERAI4XAN CURRENT PROTECT ION R1 T1 LINE Th1 SIGNAL R2 Figure 10. Transformer Winding Protection Overcurrent protection upstream from the overvoltage protector can be fuse, PTC or thick film resistor based. For very high frequency circuits, fuse inductance due to spiral wound elements may need to be evaluated. TISP® Device Voltage Selection Normally, the working voltage value of the protector, VDRM, would be chosen to be just greater than the peak signal amplitude over the equipment temperature range. This would give the lowest possible protection voltage, V(BO). This would minimize the peak voltage applied to the transformer winding and increase the time to core saturation. In high frequency circuits, there are two further considerations. Low voltage protectors have a higher capacitance than high voltage protectors. AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors TISP® Device Voltage Selection (Continued) So a higher voltage protector might be chosen specifically to reduce the protector capacitive effects on the signal. Low energy short duration spikes will be clipped by the protector. This will extend the spike duration and the data loss time. A higher protector voltage will reduce the data loss time. Generally, this will not be a significant factor for inter-conductor protection. However, clipping is significant for protection to ground, where there is continuous low-level a.c. common mode induction. In some cases the induced a.c. voltage can be over 10 V. Repetitive clipping at the induced a.c. peaks by the protector would cause severe data corruption. The expected a.c. voltage induced should be added to the maximum signal level for setting the protector VDRM value. 2-Wire Digital Systems Typical systems using a single twisted pair connection are: Integrated Services Digital Network (ISDN) and Pair Gain. Signal level protection at the transformer winding is given by protectors Th3 and Th5. Typically these could be TISP4015L1 type devices with a 15 V voltage protection level. LINE SIGNAL T1 T2 SIGNAL Th1 OVERCURRENT PROTECTION C1 Th3 OVERCURRENT PROTECTION Th4 C2 Th5 Th2 TRANSFORMER COUPLED TWO-WIRE INTERFACE DC FEED DC SUPPLY AI4XAL Figure 11. 2-Wire System Two line protection circuits are given; one referenced to ground using Th1 and Th2 (left) and the other inter-wire using protector Th4 (right) - see Figure 11. For ISDN circuits compliant to ETSI ETR 080:1993, ranges 1 and 2 can be protected by the following device types: TISP4095M3, TISP4095H3, TISP3095H3 (combines Th1 and Th2) and TISP7095H3 (combines Th1, Th2 and Th4). Ranges 4 through 5 can be protected by: TISP4145M3, TISP4145H3, TISP3145H3 (combines Th1 and Th2) and TISP7145H3 (combines Th1, Th2 and Th4). Device surge requirement, H or M, will be set by the overcurrent protection components and the standards complied with. Protection of just the d.c. feed to ETSI ranges is covered in the TISP5xxxH3 data sheet. When loop test voltages exceed the normal d.c. feed levels, higher voltage protectors need to be selected. For two terminal protectors, for levels up to 190 V (135 V rms) the TISP4250, H3 or M3, can be used and for 210 V (150 V rms) the TISP4290, H3 or M3, can be used. In Pair Gain systems, the protector VDRM is normally set by the d.c. feed value. The following series of devices have a 160 V working voltage at 25 °C: TISP4220M3, TISP4220H3, TISP3210H3 (combines Th1 and Th2) and TISP7210H3 (combines Th1, Th2 and Th4). These devices can be used on 150 V d.c. feed voltages down to an ambient temperature of -25 °C. Where the subscriber equipment may be exposed to POTS (Plain Old Telephone Service) voltage levels, protector Th4 needs a higher working voltage of about 275 V. Suitable device types are: TISP4350M3, TISP4350H3, TISP3350H3 (combines Th1 and Th2) and TISP7350H3 (combines Th1, Th2 and Th4). The overcurrent protection for the overvoltage protector can be fuse, PTC or thick film resistor based. Its a.c. limiting capability should be less than the ratings of the intended overvoltage protector. Equipment complying with the year 2000 international K.20, K.21 and K.45 recommendations from the ITU-T, may be required to demonstrate protection coordination with the intended primary protector. Without adding series resistance, a simple series fuse overcurrent protection is likely to fail the equipment for this part of the recommendation. If the d.c. feed consists of equal magnitude positive and negative voltage supplies, appropriately connected TISP5xxxH3 unidirectional protectors could replace Th1 and Th2. 4-Wire Digital Systems A typical system using a two twisted pair connection is the High-bit-rate Digital Subscriber Line (HDSL) and the “S” interface of ISDN. Figure 12 shows a generic two line system. HDSL tends to have ground referenced protection at both ends of the lines (Th1, Th2, Th3 and Th4). The ISDN “S” interface is often inside the premises and simple inter-wire protection is used at the terminating adaptor (Th7 and Th8). In all cases, signal protection, Th5, Th6, Th9 and Th10, can be TISP4015L1 type devices with a 15 V voltage protection level. AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors 4-Wire Digital Systems (Continued) LINE 1 SIGNAL T3 T1 SIGNAL Th1 OVERCURRENT PROTECTION Th5 OVERCURRENT PROTECTION Th 9 Th7 Th2 DC SUPPLY DC FEED LINE 2 SIGNAL T4 T2 SIGNAL Th 3 OVERCURRENT PROTECTION Th 6 OVERCURRENT PROTECTION Th10 Th8 Th4 AI4XAM TRANSFORMER COUPLED FOUR-WIRE INTERFACE Figure 12. 4-Wire System For an HDSL d.c. feed voltage of 180 V or less and operation down to an ambient of -25 °C, the following Th1, Th2, Th3 and Th4 protectors are suitable: TISP4250M3 or TISP4250H3, TISP3250H3 (combines Th1 and Th2 or Th3 and Th4) and TISP7250H3 (combines Th1, Th2 and Th7 or Th3, Th4 and Th8). Possible overcurrent protection components are covered in the 2-wire digital systems clause. For ISDN interfaces powered with ±40 V (ETSI, ETS 300 012 1992) the following Th1, Th2, Th3 and Th4 protectors are suitable: TISP4070M3 or TISP4070H3 or TISP4070L3, TISP3070F3 or TISP3070H3 (combines Th1 and Th2 or Th3 and Th4) and TISP7070F3 or TISP7070H3 (combines Th1, Th2 and Th7 or Th3, Th4 and Th8). At the terminating adaptor, the Th7 and Th8 protectors do not “see” the d.c. feed voltage and should be selected to not clip the maximum signal level. Generally, the TISP40xxL1 series will be suitable. Internal ISDN lines are not exposed to high stress levels and the chances of a.c. power intrusion are low (ETSI EN 300 386-2 1997). Accordingly, the equipment port protection needs are at a lower level than ports connected to outside lines. Home Phone Networking Using the existing house telephone wiring, home phone networking systems place the local network traffic in a high band above the POTS and ADSL (Asymmetrical Digital Subscriber Line) spectrum. Local network rates are 1 Mbps or more. To reject noise and harmonics, an in-line protection and 5 MHz to 10 MHz bandpass filter module is used for the equipment. These modules are available from magnetic component manufacturers (e.g. Bel Fuse Inc.) A typical circuit for the telephone line magnetics module is shown in Figure 13. Transformer T1 isolates the equipment from the house wiring. The isolated winding output is voltage limited by a very low-voltage protector, Th1. With a differential voltage of about 12 V peak to peak, the TISP4015L1 could be used for Th1. After filtering, connection is made to the differential transceiver of the processing IC. TIP T1 FILTER HRTRX+ C1 Th1 HRTRXAI4XAP PROTECTION RING Figure 13. Home Phone Networking Isolation/filter/protection Circuit AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors MECHANICAL DATA Recommended Printed Wiring Land Pattern Dimensions 2.34 (. 092) SMA Land Pattern 1.90 (.075) 2.16 (.085) MILLIMETERS DIMENSIONS ARE: (INCHES) MDXX BIC 2.54 (.100) SMB Land Pattern 2.40 (.095) DIMENSIONS ARE: 2.16 (.085) MILLIMETERS (INCHES) MDXX BIB Device Symbolization Code Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified. Device TISP4015L1AJ TISP4030L1AJ TISP4040L1AJ Symbolization Code 4015L 4030L 4040L Device TISP4015L1BJ TISP4030L1BJ TISP4040L1BJ Symbolization Code 4015L1 4030L1 4040L1 Carrier Information For production quantities, the carrier will be embossed tape reel pack. Evaluation quantities may be shipped in bulk pack or embossed tape. Package Carrier Standard Quantity SMA SMB Embossed Tape Reel Pack 5000 3000 AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors MECHANICAL DATA SMA (DO-214AC) Plastic Surface Mount Diode Package This surface mount package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. SMA 4.06 - 4.57 (.160 - .180) 2.29 - 2.92 (.090 - .115) 2 Index Mark (if needed) 2.00 - 2.40 (.079 - .095) 0.76 - 1.52 (.030 - .060) 1.58 - 2.16 (.062 - .085) 0.10 - 0.20 (.004 - .008) 1.27 - 1.63 (.050 - .064) 4.83 - 5.59 (.190 - .220) DIMENSIONS ARE: MILLIMETERS (INCHES) MDXXCAA AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors MECHANICAL DATA Tape Dimensions SMA Package Single-Sprocket Tape 3.90 - 4.10 (.154 - .161) 1.55 - 1.65 (.061 - .065) 1.95 - 2.05 (.077 - .081) 0.40 MAX. (.016) 1.65 - 1.85 (.065 - .073) 5.45 - 5.55 (.215 - .219) 11.70 - 12.30 (.461 - .484) 3.90 - 4.10 (.154 - .161) 1.5 MIN. (.059) Direction of Feed 0 MIN. 8.20 MAX. (.323) Cover Tape 4.50 MAX. (.177) Carrier Tape Embossment 20° Maximum component rotation Index Mark (If needed) DIMENSIONS ARE: Typical component cavity center line Typical component center line MILLIMETERS (INCHES) NOTES: A. The clearance between the component and the cavity must be within 0.05 mm (.002 in) MIN. to 0.65 mm (.026 in) MAX. so that the component cannot rotate more than 20° within the determined cavity. B. Taped devices are supplied on a reel of the following dimensions: Reel diameter: 330 mm ± 3.0 mm (12.99 in ± .12 in) Reel hub diameter: 75 mm (2.95 in) MIN. Reel axial hole: 13.0 mm ± 0.5 mm (.51 in ± .02 in) C. 5000 devices per reel. AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MDXXCGA TISP40xxL1AJ/BJ VLV Overvoltage Protectors MECHANICAL DATA SMB (DO-214AA) Plastic Surface Mount Diode Package This surface mount package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. SMB 4.06 - 4.57 (.160 - .180) 3. 30 - 3. 94 (.130 - .155) 1 2 Index Mark (if needed) 2. 00 - 2.40 (.079 - .094) 1. 90 - 2.10 (.075 - .083) 0. 76 - 1.52 (.030 - .060) 0. 10 - 0. 20 (.004 - .008) 1. 96 - 2. 32 (.077 - .091) 5. 21 - 5.59 (.205 - .220) DIMENSIONS ARE: MILLIMETERS (INCHES) MDXXBHAB AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP40xxL1AJ/BJ VLV Overvoltage Protectors MECHANICAL DATA Tape Dimensions SMB Package Single-Sprocket Tape 1. 55 - 1.65 (.061 - .065 ) 3. 90 - 4.10 (.154 - .161 ) 1. 95 - 2.05 (.077 - .081) 0. 40 MAX . (.016) 1. 65 - 1.85 (.065 - .073 ) 5. 45 - 5.55 (.215 - .219 ) 11.70 - 12.30 (.461 - .484 ) 7. 90 - 8.10 (.311 - .319 ) 1. 5 MIN . (.059) 0 MIN . 20 ° Index Mark (if needed) Cover Tape 4. 5 MAX . (.177) Carrier Tape Embossment Direction of Feed Maximium component rotation Typical component cavity center line Typical component center line NOTES: A. The clearance between the component and the cavity must be within 0.05 mm (.002 in) MIN. to 0.65 mm (.026 in) MAX. so that the component cannot rotate more than 20° within the determined cavity. B. Taped devices are supplied on a reel of the following dimensions: Reel diameter: 330 mm ± 3.0 mm (12.99 in ± .118 in) Reel hub diameter: 75 mm (2.95 in) MIN. Reel axial hole: 13.0 mm ± 0.5 mm (.512 in ± .020 in) C. 3000 devices are on a reel. “TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office. “Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries. AUGUST 1999 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 8. 20 MAX . (.323) MDXXBJA