74AHC245-Q100; 74AHCT245-Q100 Octal bus transceiver; 3-state Rev. 1 — 21 March 2013 Product data sheet 1. General description The 74AHC245-Q100; 74AHCT245-Q100 is a high-speed Si-gate CMOS device. The 74AHC245-Q100; 74AHCT245-Q100 is an octal transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The 74AHC245-Q100; 74AHCT245-Q100 features an output enable input (OE), for easy cascading, and a send and receive direction control input (DIR). OE controls the outputs so that the buses are effectively isolated. This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications. 2. Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 1) Specified from 40 C to +85 C and from 40 C to +125 C Balanced propagation delays All inputs have Schmitt-trigger actions Inputs accept voltages higher than VCC Input levels: For 74AHC245-Q100: CMOS level For 74AHCT245-Q100: TTL level ESD protection: MIL-STD-883, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) Multiple package options NXP Semiconductors 74AHC245-Q100; 74AHCT245-Q100 Octal bus transceiver; 3-state 3. Ordering information Table 1. Ordering information Type number Package 74AHC245D-Q100 Temperature range Name Description Version 40 C to +125 C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 40 C to +125 C TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 40 C to +125 C DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 4.5 0.85 mm SOT764-1 74AHCT245D-Q100 74AHC245PW-Q100 74AHCT245PW-Q100 74AHC245BQ-Q100 74AHCT245BQ-Q100 4. Functional diagram 1 DIR OE 2 B0 3 19 3EN1 3EN2 1 14 18 3 17 13 4 16 5 15 6 14 7 13 8 12 A6 12 A7 B7 11 9 Logic symbol 74AHC_AHCT245_Q100 Product data sheet 11 mna175 mna174 Fig 1. 2 A5 B6 9 G3 2 B5 8 15 A4 B4 7 1 16 A3 B3 6 17 A2 B2 5 18 A1 B1 4 19 A0 Fig 2. IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 2 of 17 74AHC245-Q100; 74AHCT245-Q100 NXP Semiconductors Octal bus transceiver; 3-state 5. Pinning information 5.1 Pinning $+&4 $+&74 ',5 WHUPLQDO LQGH[DUHD 9&& $+&4 $+&74 $ 2( $ % $ % ',5 9&& $ 2( $ % $ % % % $ % $ $ % $ % $ % $ % *1' % $ % % *1' $ % *1' % $ $ DDD 7UDQVSDUHQWWRSYLHZ DDD (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 3. Pin configuration SO20, TSSOP20 Fig 4. Pin configuration DHVQFN20 5.2 Pin description Table 2. Pin description Symbol Pin Description DIR 1 direction control input A0, A1, A2, A3, A4, A5, A6, A7 2, 3, 4, 5, 6, 7, 8, 9 data input/output GND 10 ground (0 V) B7, B6, B5, B4, B3, B2, B1, B0 11, 12, 13, 14, 15, 16, 17, 18 data input/output OE 19 output enable input (active LOW) VCC 20 supply voltage 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 3 of 17 NXP Semiconductors 74AHC245-Q100; 74AHCT245-Q100 Octal bus transceiver; 3-state 6. Functional description Table 3. Function table[1] Control Input/output OE DIR An Bn L L A=B inputs L H inputs B=A H X Z Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions VCC supply voltage VI input voltage IIK input clamping current VI < 0.5 V [1] IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V [1] IO output current VO = 0.5 V to (VCC + 0.5 V) Min Max Unit 0.5 +7.0 V 0.5 +7.0 V 20 - mA 20 +20 mA 25 +25 mA ICC supply current - +75 mA IGND ground current 75 - mA Tstg storage temperature 65 +150 C - 500 mW total power dissipation Ptot Tamb = 40 C to +125 C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SO20 packages: above 70 C the value of Ptot derates linearly at 8 mW/K. For TSSOP20 packages: above 60 C the value of Ptot derates linearly at 5.5 mW/K. For DHVQFN20 packages: above 60 C the value of Ptot derates linearly at 4.5 mW/K. 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 4 of 17 NXP Semiconductors 74AHC245-Q100; 74AHCT245-Q100 Octal bus transceiver; 3-state 8. Recommended operating conditions Table 5. Operating conditions Symbol Parameter Conditions Min Typ Max Unit 2.0 5.0 5.5 V 74AHC245-Q100 VCC supply voltage VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature 40 +25 +125 C t/V input transition rise and fall rate VCC = 3.0 V to 3.6 V - - 100 ns/V VCC = 4.5 V to 5.5 V - - 20 ns/V 74AHCT245-Q100 VCC supply voltage 4.5 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature 40 +25 +125 C t/V input transition rise and fall rate - - 20 ns/V VCC = 4.5 V to 5.5 V 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max VCC = 2.0 V 1.5 - - 1.5 - 1.5 - V VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V HIGH-level VI = VIH or VIL output voltage IO = 50 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 50 A; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = 50 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = 8.0 mA; VCC = 4.5 V 3.94 - - 3.80 - 3.70 - V LOW-level VI = VIH or VIL output voltage IO = 50 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 A; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V 74AHC245-Q100 VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 5 of 17 NXP Semiconductors 74AHC245-Q100; 74AHCT245-Q100 Octal bus transceiver; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 A IOZ OFF-state VI = VIH or VIL; output current VO = VCC or GND; VCC = 5.5 V - - 0.25 - 2.5 - 10.0 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 4.0 - 40 - 80 A CI input capacitance - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF VI = VCC or GND 74AHCT245-Q100 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA VOL LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA 4.5 - 4.4 - 4.4 - V - - 3.80 - 3.70 - V - 0 0.1 - 0.1 - 0.1 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 A II input leakage current IOZ OFF-state VI = VIH or VIL; output current VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - 0.25 - 2.5 - 10.0 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 4.0 - 40 - 80 A ICC additional per input pin; supply current VI = VCC 2.1 V; other pins at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF 74AHC_AHCT245_Q100 Product data sheet VI = 5.5 V or GND; VCC = 0 V to 5.5 V 4.4 3.94 VI = VCC or GND All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 6 of 17 NXP Semiconductors 74AHC245-Q100; 74AHCT245-Q100 Octal bus transceiver; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7. Symbol Parameter 25 C Conditions Min Typ[1] 40 C to +85 C 40 C to +125 C Unit Max Min Max Min Max 74AHC245-Q100 tpd propagation delay An to Bn; Bn to An; see Figure 5 [2] VCC = 3.0 V to 3.6 V CL = 15 pF - 5.0 8.4 1.0 10.0 1.0 10.5 ns CL = 50 pF - 6.5 11.9 1.0 13.5 1.0 15.0 ns - 3.5 5.5 1.0 6.5 1.0 7.0 ns 5.0 7.5 1.0 8.5 1.0 9.5 ns VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF ten enable time OE to An; OE to Bn; signal name DIR; see Figure 6 [3] VCC = 3.0 V to 3.6 V CL = 15 pF - 6.5 13.2 1.0 15.5 1.0 16.5 ns CL = 50 pF - 9.0 16.7 1.0 19.0 1.0 21.0 ns VCC = 4.5 V to 5.5 V tdis CL = 15 pF - 4.0 8.5 1.0 10.0 1.0 11.0 ns CL = 50 pF - 5.0 10.6 1.0 12.0 1.0 13.5 ns CL = 15 pF - 7.5 12.5 1.0 15.5 1.0 16.0 ns CL = 50 pF - 10.0 15.8 1.0 18.0 1.0 20.0 ns - 4.5 7.8 1.0 9.2 1.0 10.0 ns - 6.0 9.7 1.0 11.0 1.0 12.5 ns - 12 - - - - - pF - 3.5 7.7 1.0 8.5 1.0 10.0 ns - 4.5 8.7 1.0 9.5 1.0 11.0 ns CL = 15 pF - 5.0 13.8 1.0 15.0 1.0 17.5 ns CL = 50 pF - 6.0 14.8 1.0 16.0 1.0 18.5 ns disable time OE to An; OE to Bn; signal name DIR; see Figure 6 [4] VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF CPD power dissipation capacitance [5] fi = 1 MHz; VI = GND to VCC 74AHCT245-Q100; VCC = 4.5 V to 5.5 V tpd propagation delay An to Bn; Bn to An; see Figure 5 [2] CL = 15 pF CL = 50 pF ten enable time 74AHC_AHCT245_Q100 Product data sheet OE to An; OE to Bn; signal name DIR; see Figure 6 [3] All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 7 of 17 74AHC245-Q100; 74AHCT245-Q100 NXP Semiconductors Octal bus transceiver; 3-state Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7. Symbol Parameter tdis 25 C Conditions CL = 15 pF CL = 50 pF power dissipation capacitance Min Max Min Max Min Max - 5.0 14.4 1.0 15.5 1.0 18.0 ns - 6.0 15.4 1.0 16.5 1.0 19.5 ns - 15 - - - - - pF [4] disable time OE to An; OE to Bn; signal name DIR; see Figure 6 CPD 40 C to +85 C 40 C to +125 C Unit Typ[1] [5] fi = 1 MHz; VI = GND to VCC [1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V). [2] tpd is the same as tPLH and tPHL. [3] ten is the same as tPZL and tPZH. [4] tdis is the same as tPLZ and tPHZ. [5] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of the outputs. 10.1 Waveforms VI An, Bn input VM VM GND tPLH tPHL VOH Bn, An output VM VM VOL mna176 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 5. Input to output propagation delays 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 8 of 17 74AHC245-Q100; 74AHCT245-Q100 NXP Semiconductors Octal bus transceiver; 3-state VI OE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PHZ VOH t PZH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled mna367 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Table 8. Enable and disable times Measurement points Type Input Output VM VM VX VY 74AHC245-Q100 0.5 VCC 0.5 VCC VOL + 0.3 V VOH 0.3 V 74AHCT245-Q100 1.5 V 0.5 VCC VOL + 0.3 V VOH 0.3 V 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 9 of 17 74AHC245-Q100; 74AHCT245-Q100 NXP Semiconductors Octal bus transceiver; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT CL RT 001aad983 Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 7. Table 9. Load circuitry for measuring switching times Test data Type 74AHC245-Q100 Input Product data sheet S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ VCC 3.0 ns 15 pF, 50 pF 1 k open GND VCC 3.0 ns 15 pF, 50 pF 1 k open GND VCC 74AHCT245-Q100 3.0 V 74AHC_AHCT245_Q100 Load All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 10 of 17 74AHC245-Q100; 74AHCT245-Q100 NXP Semiconductors Octal bus transceiver; 3-state 11. Package outline SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 8. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT163-1 (SO20) 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 11 of 17 74AHC245-Q100; 74AHCT245-Q100 NXP Semiconductors Octal bus transceiver; 3-state TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 Fig 9. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Package outline SOT360-1 (TSSOP20) 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 12 of 17 74AHC245-Q100; 74AHCT245-Q100 NXP Semiconductors Octal bus transceiver; 3-state DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 10. Package outline SOT764-1 (DHVQFN20) 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 13 of 17 74AHC245-Q100; 74AHCT245-Q100 NXP Semiconductors Octal bus transceiver; 3-state 12. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model MIL Military TTL Transistor-Transistor Logic 13. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHC_AHCT245_Q100 v.1 20130321 Product data sheet - - 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 14 of 17 NXP Semiconductors 74AHC245-Q100; 74AHCT245-Q100 Octal bus transceiver; 3-state 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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This document supersedes and replaces all information supplied prior to the publication hereof. 74AHC_AHCT245_Q100 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 15 of 17 NXP Semiconductors 74AHC245-Q100; 74AHCT245-Q100 Octal bus transceiver; 3-state No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AHC_AHCT245_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 16 of 17 NXP Semiconductors 74AHC245-Q100; 74AHCT245-Q100 Octal bus transceiver; 3-state 16. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 10.1 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 21 March 2013 Document identifier: 74AHC_AHCT245_Q100