Plastic Packages for Integrated Circuits Package Outline Drawing L32.5x5H 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETABLE FLANK) Rev 2, 1/16 A 5.00 PIN 1 INDEX AREA SEE DETAIL “A” 3.3 4.75 4X 0.42 ±0.18 2X N 5 0.50 DIAMETER 2X 0.10 C A 0.10 C B 1 2 3 4X 0.42 ±0.18 4.75 0.10 M C A B PIN #1 ID R0.20 N 0.45 1 2 3 3.3 5.00 0.10 M C A B 0.10 C B 2X (0.45) 0.40 ±0.10 B 0.10 C A 2X 0.25 ±0.05 0.10 M C A B 0.05 M C 0.50 (0.45) TOP VIEW BOTTOM VIEW SEE DETAIL “X” 0.85 ±0.05 0.50 0.15 ±0.10 SIDE VIEW 0.15 ±0.05 0.40 ±0.10 0 - 12 0.25 ±0.05 0.10 M C A B C 0.10 ±0.05 SEATING PLANE 0.08 C 4 DETAIL “A” 0.00 MIN 0.05 MAX DETAIL “X” NOTES: (4.80)Sq 28X (0.50) (3.30)Sq 32X (0.25) 1. Dimensions are in millimeters. Dimensions in ( ) for reference only. 2. Dimensioning and tolerancing conform to ASMEY 14.5m-1994. 3. Unless otherwise specified, tolerance: Decimal ± 0.05 4. Dimension applies to the plated terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. 32X (0.60) TYPICAL RECOMMENDED LAND PATTERN 1 The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 6. Reference document: JEDEC MO220