Plastic Packages for Integrated Circuits Package Outline Drawing W5x6.30A 5X6 ARRAY 30 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) BSC Rev 0, 6/13 1.600 X Y 2.330±0.030 0.400 F E 30x 0.265±0.035 D 2.000 2.610±0.030 C B A 0.305 (4X) 0.10 1 2 3 4 5 0.400 PIN 1 (A1 CORNER) TOP VIEW 0.365 BOTTOM VIEW Z 0.05 Z PACKAGE OUTLINE 0.240 SEATING PLANE 3 0.040 BSC (BACK SIDE COATING) 0.290 0.400 0.265±0.035 30x 0.10 M Z X Y 0.05 M Z 0.200±0.030 TYPICAL RECOMMENDED LAND PATTERN 0.540±0.050 SIDE VIEW NOTES: 1. Dimensions and tolerance per ASME Y 14.5M - 1994. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. There shall be a minimum clearance of 0.10mm between the edge of the bump and the body edge. 1