Plastic Packages for Integrated Circuits Package Outline Drawing W3x5.15 15 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch) Rev 1, 6/14 X 1.51±0.030 0.800 Y 0.400 E 15X 0.265±0.035 2.15±0.030 D 1.600 C B (4X) 0.275 A 0.10 1 2 3 PIN 1 (A1 CORNER) 0.355 TOP VIEW BOTTOM VIEW Z PACKAGE OUTLINE 0.05 Z SEATING PLANE 3 0.240 0.290 0.400 0.265±0.035 15X 0.10 M Z X Y 0.05 M Z 0.200±0.030 0.500±0.050 RECOMMENDED LAND PATTERN SIDE VIEW NOTES: 1. Dimensions and tolerance per ASME Y 14.5M - 1994. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z . 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. There shall be a minimum clearance of 0.10mm between the edge of the bump and the body edge. 1