Plastic Packages for Integrated Circuits Package Outline Drawing W4x4.16C (WLCSP 0.5mm PITCH) WAFER LEVEL CHIP SCALE PACKAGE Rev 1, 05/14 1.500 X Y 2.160 ±0.030 0.500 D C 16x 0.320 ±0.030 2.160 ±0.030 B A 0.330 (4X) 1 PIN 1 (A1 CORNER) 0.10 2 4 3 0.330 0.250 TOP VIEW BOTTOM VIEW Z SEATING PLANE 0.05 Z PACKAGE OUTLINE 0.280 0.330 0.500 0.320 ±0.030 Ø0.10 M Z X Y Ø0.05 M Z 3 NSMD 0.240 ±0.030 RECOMMENDED LAND PATTERN 0.600 ±0.06mm SIDE VIEW NOTES: 1. All dimensions are in millimeters. 2. Dimension and tolerance per ASMEY 14.5M-1994, and JESD 95-1 SPP-010. 3. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1