Plastic Packages for Integrated Circuits Package Outline Drawing W4x4.16 4X4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) Rev 0, 6/10 X 1.965±0.02 Y 1.20 16X 0.270 ± 0.025 LOGO ID 4 3 1.20 1.815±0.02 PIN 1 2 0.40 1 0.10 D (4X) TOP VIEW A C B BOTTOM VIEW 0.305 ± 0.025 0.535 mm MAX 0.10 Z 0.27 ± 0.025 Z SEATING PLANE Ø0.10 M Z X Y Ø0.05 M Z 0.19 ± 0.015 0.05 Z SIDE VIEW 0.275 PACKAGE OUTLINE NOTES: 1. All dimensions are in millimeters. 2. Dimension and tolerance per ASMEY 14.5M-1994, and JESD 95-1 SPP-010. 3. NSMD refers to Non-solder Mask Defined pad design per Intersil Tech Brief TB451 located at: http://www.intersil.com/data/tb/tb451.pdf. 0.225 0.40 3 NSMD TYPICAL RECOMMENDED LAND PATTERN 1