Radiation Hardened 8 Channel CMOS Analog Multiplexers with Overvoltage Protection HS-508BRH, HS-508BEH Features The HS-508BRH, HS-508BEH are dielectrically isolated, radiation hardened, CMOS analog multiplexers incorporating an important feature; they withstand analog input voltages much greater than the supplies. This is essential in any system where the analog inputs originate outside the equipment. They can withstand a continuous input up to 10V greater than either supply, which eliminates the possibility of damage when supplies are off, but input signals are present. Equally important, they can withstand brief input transient spikes of several hundred volts; which otherwise would require complex external protection networks. Necessarily, ON resistance is somewhat higher than similar unprotected devices, but very low leakage current combine to produce low errors. Reference Application Notes 520 and 521 for further information on the HS-508BRH, HS-508BEH multiplexers in general. • Electrically Screened to SMD # 5962-96742 The HS-508BRH, HS-508BEH have been specifically designed to meet exposure to radiation environments. Operation from -55°C to +125°C is guaranteed. • QML Qualified per MIL-PRF-38535 Requirements • Radiation Environment - Gamma Dose (γ) . . . . . . . . . . . . . . . . . . . . . 3 x 105 Rad (Si) - Dielectrically Isolated Device Islands - SEP >100 Mev-mg/cm2 • Analog/Digital Overvoltage Protection • ESD Rated to 3kV • Fail Safe with Power Loss (No Latchup) • Break-Before-Make Switching • (Typ) DTL/TTL and CMOS Compatible Threshold • Analog Signal Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15V • Fast Access Time • Supply Current at 1MHz Address Toggle . . . . . . . . . 4mA (Typ) • Standby Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.5mW (Typ) • Pb-Free (RoHS Compliant) Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-96742. A “hot-link” is provided on our homepage for downloading. http://www.landandmaritime.dla.mil/Downloads/MilSpec/S md/96742.pdf Ordering Information ORDERING NUMBER (Note) INTERNAL MKT. NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. 5962F9674202QEC HS1-508BRH-8 Q 5962F96 74202QEC -55 to +125 16 Ld SBDIP D16.3 5962F9674202QXC HS9-508BRH-8 Q 5962F96 74202QXC -55 to +125 16 Ld Flatpack K16.A 5962F9674202VEC HS1-508BRH-Q Q 5962F96 74202VEC -55 to +125 16 Ld SBDIP D16.3 5962F9674202VXC HS9-508BRH-Q Q 5962F96 74202VXC -55 to +125 16 Ld Flatpack K16.A HS1-508BRH/PROTO HS1-508BRH/PROTO HS1- 508BRH /PROTO -55 to +125 16 Ld SBDIP D16.3 HS9-508BRH/PROTO HS9-508BRH/PROTO HS9- 508BRH /PROTO -55 to +125 16 Ld Flatpack K16.A 5962F9674203VXC HS9-508BEH-Q Q 5962F96 74203VXC -55 to +125 16 Ld Flatpack K16.A NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. November 17, 2011 FN4824.3 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2001, 2009, 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. HS-508BRH, HS-508BEH Pin Configurations HS9-508BRH, HS9-508BEH (16 LD FLATPACK) MIL-STD-1835, CDFP4-F16 TOP VIEW HS-508BRH (16 LD SIDEBRAZE DIP) MIL-STD-1835, CDIP2-T16 TOP VIEW A0 1 16 A1 EN 2 15 A2 -VSUP 3 14 GND IN1 4 13 +VSUP 16 A1 AO 1 15 A2 EN 2 14 GND -VSUP 3 IN 1 4 13 +VSUP IN2 5 12 IN5 IN 2 5 12 IN 5 IN3 6 11 IN6 IN 3 6 11 IN 6 IN4 7 10 IN7 OUT 8 9 IN8 IN 4 7 10 IN 7 OUT 8 9 IN 8 Functional Diagram P A0 DIGITAL ADDRESS N IN 1 1 A1 OUT A2 8 EN P ADDRESS INPUT BUFFER AND LEVEL SHIFTER DECODERS N IN 8 MULTIPLEX SWITCHES TABLE 1. TRUTH TABLE A2 A1 A0 EN “ON” CHANNEL X X X L NONE L L L H 1 L L H H 2 L H L H 3 L H H H 4 H L L H 5 H L H H 6 H H L H 7 H H H H 8 2 FN4824.3 November 17, 2011 HS-508BRH, HS-508BEH Die Characteristics DIE DIMENSIONS Backside Finish 120 mils x 93 mils x 19 mils Silicon INTERFACE MATERIALS ASSEMBLY RELATED INFORMATION Glassivation Substrate Potential Type: Phosphorus Silicon Glass (PSG) Thickness: 8kÅ ±1kÅ Unbiased (DI) ADDITIONAL INFORMATION Top Metallization Worst Case Current Density Type: AlSiCu Thickness: 16kÅ ±2kÅ 6.68e04 A/cm2 Substrate Transistor Count Rad Hard Silicon Gate Dielectric Isolation 506 Metallization Mask Layout HS-508BRH, HS-508BEH IN2 (5) IN1 (4) -V (3) IN3 (6) EN (2) IN4 (7) OUT (8) A0 (1) IN8 (9) A1 (16) A2 (15) IN7 (10) IN6 (11) IN5 (12) 3 +V (13) GND (14) FN4824.3 November 17, 2011 HS-508BRH, HS-508BEH TABLE 2. HS-508BRH, HS-508BEH PAD COORDINATES RELATIVE TO PIN 1 PIN NUMBER PAD NAME X COORDINATES Y COORDINATES 1 A0 0 0 2 EN -342 0 3 V- -818 -653 4 IN1 -818 -879 5 IN2 -818 -1221 6 IN3 -598 -2579 7 IN4 -224 -2579 8 OUT -38 -2579 9 IN8 314 -2579 10 IN7 724 -2579 11 IN6 1066 -2579 12 -IN5 1066 -761 13 V+ 1100 -287 14 GND 1038 0 15 A2 684 0 16 A1 342 0 NOTE: Dimensions in microns For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 4 FN4824.3 November 17, 2011