REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline Y, which is a 16 lead flat pack. Make changes to 1.2.4, 1.3, and figure 1. - ro 99-02-10 R. MONNIN B Make change to dropout voltage test as specified in table I. - ro 99-08-13 R. MONNIN C Make change to short circuit current test as specified in table I. - ro 01-02-05 R. MONNIN D Add device class V devices and table IIB. - ro 01-05-01 R. MONNIN E Drawing updated to reflect current requirements. -rrp 06-12-04 R. MONNIN F Add device type 02 tested at low dose rate. Add paragraphs 1.5, 3.2.3, and 4.4.4.1. Add one footnote to Table IIB. Make changes to 1.2, 1.2.2, Table I, and figure 2. Add paragraph 3.1.1 and microcircuit die appendix A. - ro 09-04-21 J. RODENBECK G Add device type 03 and 04. Add footnote to paragraph 1.2.4. Make changes to paragraphs 1.3, 1.5, A.1.2, A.1.2.2, Table I, and Figure 2. Make change to table IIB footnote and title. 11-12-13 C. SAFFLE REV SHEET REV G G G G G G G SHEET 15 16 17 18 19 20 21 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY RAJESH PITHADIA APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A RAYMOND MONNIN DRAWING APPROVAL DATE 97-04-25 REVISION LEVEL G MICROCIRCUIT, LINEAR, ADJUSTABLE, 1 A, POSITIVE VOLTAGE REGULATOR, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-91667 1 OF 21 5962-E097-12 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 R 91667 Federal stock class designator \ RHA designator (see 1.2.1) 04 V Y A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 LM2941 LM2941 03 04 LM2941 LM2941 Circuit function Adjustable, 1 amp, positive voltage regulator Radiation hardened adjustable, 1 amp, positive voltage regulator Adjustable, 1 amp, positive voltage regulator Radiation hardened adjustable, 1 amp, positive voltage regulator 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter E X Y 1/ Descriptive designator GDIP1-T16 or CDIP2-T16 See figure 1 GDFP1-G16 Terminals 16 4 16 Package style Dual-in-line Flange mount Flat pack with gull wing leads _____ 1/ For case outline letter Y, device types 01 and 02 package material is aluminum nitride and the device types 03 and 04 package material is aluminum oxide. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 2 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/ Input voltage (VIN) (survival voltage 100 ms) ........................................... 60 V Internal power dissipation ............................................................................ Internally limited 3/ Maximum junction temperature (TJ) ............................................................ 150C Storage temperature range ......................................................................... Lead temperature (soldering, 10 seconds) .................................................. Thermal resistance, junction-to-case (JC): Device types 01 and 02: Case E ................................................................................................. Cases X and Y ..................................................................................... Device types 03 and 04: Case Y 1/ ............................................................................................ Thermal resistance, junction-to-ambient (JA): Device types 01 and 02: Case E ................................................................................................. Case X ................................................................................................. Case Y ................................................................................................. Device types 03 and 04: Case Y 1/ ........................................................................................... -65C TJ +150C 300C 3C/W 5C/W 13C/W 73C/W 40C/W 122C/W 136C/W (still air) 87C/W (linear feet per minute air flow) 1.4 Recommended operating conditions. Maximum input voltage (VIN) ....................................................................... 26 V Ambient operating temperature range (TA) ................................................. -55C TA +125C 1.5 Radiation features. Device types 02 and 04: Maximum total dose available (dose rate = 10 mrads (Si)/s) ................... 100 krads (Si) 4/ The manufacturer supplying RHA parts on this drawing has completed Lot Acceptance testing at Low Dose Rate (LDR) (10 mrad/s) on these RHA marked parts. The Low Does Rate testing that was performed demonstrates that these parts from the lot tested do not have an Enhanced Low Dose rate Sensitivity as defined by Method 1019, condition D. Lot Acceptance Testing at LDR will continue to be performed on each wafer or wafer lot until characterization testing has been performed in accordance with Method 1019 of MIL-STD-883. Since the redesigned part did not demonstrate ELDRS per Method 1019 and the previously tested device was ELDRS, the part number will be changed to 02 and 04 devices to distinguish the 4 parts. _____ 1/ For case outline letter Y, device types 01 and 02 package material is aluminum nitride and the device types 03 and 04 package material is aluminum oxide. 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ The maximum power dissipation must be derated at elevated temperatures and is dictated by maximum junction temperature, package junction to ambient thermal resistance, and ambient temperature. The maximum allowable power dissipation at any temperature is PD maximum = (TJ maximum - TA) / JA or the number given in the absolute maximum ratings, whichever is lower. 4/ For device types 02 and 04, these parts have been tested and do not demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guaranteed for the conditions specified in MIL-STD-883, test method 1019, conditions A and D. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 4 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 52 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 5 TABLE I. Electrical performance characteristics. Test Reference voltage Symbol VREF Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups IOUT = 5 mA to 1 A VIN = VOUT + 2 V to 26 V, Line regulation VLN Load regulation VLD IOUT = 50 mA to 1 A Quiescent current IQ VIN = VOUT + 2 V to 26 V, VDO ISC Maximum operational input voltage VIN Reverse polarity dc input voltage VIN Min Max 01, 02, 1.237 1.313 2,3 03, 04 1.211 1.339 1,2,3 01, 02, 03, 04 10 mV/V 1,2,3 01, 02, 03, 04 10 mV/V 1 01, 02, 15 mA 2,3 03, 04 20 45 IOUT = 1 A 2,3 60 IOUT = 1 A 1 01, 02, 0.8 2,3 03, 04 1.0 IOUT = 100 mA Short circuit current Unit 1 VIN = VOUT + 5 V, Dropout voltage Limits 1 IOUT = 5 mA IOUT = 5 mA Device type VIN max = 26 V VOUT -0.6 V, 4/ 1 200 2,3 300 1 01, 02, 1.6 3.5 2,3 03, 04 1.3 3.7 1,2,3 01, 02, 03, 04 1,2,3 01, 02, ROUT = 100 26 -15 V V mV A V dc V 03, 04 ON / OFF threshold voltage on V(TO) IOUT 1 A 4/ 1,2,3 01, 02, 03, 04 ON / OFF threshold voltage off V(TO) IOUT 1 A 4/ 1,2,3 01, 02, 03, 04 ON / OFF threshold current IT VON / OFF = 2.0 V, 1 01, 02, 100 2,3 03, 04 300 IOUT 1 A 0.8 2.0 V V A See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Min Maximum line transient VLT VOUT max 1 V above nominal VOUT, Unit Max 4,5,6 01, 02, 03, 04 60 V 4,5,6 01, 02, 03, 04 -50 V 4 01, 02, 0.02 5,6 03, 04 0.04 ROUT = 100 , T 100 ms Reverse polarity transient input voltage VRT Ripple rejection 5/ RR ROUT = 100 , T 100 ms fOUT = 1 kHz, 1 VRMS, IL = 100 mA %/V 1/ For device types 02 and 04, RHA devices supplied to this drawing are tested through all levels M, D, P, L, and R of irradiation. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25C. 2/ For device types 02 and 04, radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, conditions A and D. Device types 02 and 04, have been tested at low dose rate and does not demonstrate low dose rate sensitivity (see 1.5 herein). 3/ VOUT = 5 V to 20 V, VIN = VOUT + 5 V, and COUT = 22 F. 4/ Functional test, go no go only. 5/ % / V = % of VIN per volt of VOUT. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 7 Case X FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 8 Case X – continued. Symbol Dimensions Notes Inches Millimeters Min Max Min Max A .285 .305 7.24 7.75 A1 --- .085 --- 2.16 a .460 .480 11.68 12.19 b .038 .043 .97 1.09 3,5 D .880 .915 22.35 23.24 D1 .760 .775 19.30 19.69 e .460 .480 11.68 12.19 F .060 .070 1.52 1.78 G1 .490 .510 12.45 12.95 L .420 .500 10.67 12.70 L1 --- .025 --- .64 5 p .151 .161 3.84 4.09 3 q 1.177 1.197 29.90 30.40 2 R .490 .510 12.45 12.95 3 R1 .168 .178 4.27 4.52 3 18 18 72 72 N 4 4 Notes 1,4 NOTES: 1. 2. 3. 4. 5. The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. These dimensions should be measured at points .050 inch (1.27 mm) + .005 inch (0.13 mm) - .00 inch (0.00 mm) below seating plane. When a gauge is not used, measurement will be made at the seating plane. Two places. The seating plane of the header shall be flat within .001 inch (0.03 mm) concave to .004 inch (0.10 mm) convex inside a .930 inch (23.62 mm) diameter circle on the center on the header and flat within .001 inch (0.03 mm) concave to .006 inch (0.15 mm) convex overall. Lead diameter and glass menicus shall not exceed twice b within L1. FIGURE 1. Case outline – Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 9 Device types 01 , 02, 03, and 04 Case outlines E Terminal number X Y Terminal symbol 1 NC OUTPUT NC 2 NC ADJ NC 3 OUTPUT ON / OFF OUTPUT 4 ADJ VIN ADJ 5 GND --- GND 6 NC --- NC 7 NC --- NC 8 NC --- NC 9 ON / OFF --- ON / OFF 10 NC --- NC 11 GND --- GND 12 GND --- GND 13 GND --- NC 14 GND --- NC 15 NC --- NC 16 VIN --- VIN NC = No connection. For case outline X, case is ground. FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 10 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 11 TABLE IIA. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) 1/ 2/ Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 1 1 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1,2,3,4,5,6 1,2,3, 1/ 4,5,6 1,2,3,4,5,6 1,2,3 1,2,3 1,2,3 2/ 1,2,3 1,2,3 1,2,3 1,4 1,4 Device class Q --- Device class V PDA applies to subgroup 1. Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed with reference to the previous endpoint electrical parameters. Table IIB. Delta electrical parameters. TA = +25C 1/ Parameter VREF Conditions Delta limit 5 mA IO 1 A Min Max -25 mV +25 mV 1/ Deltas performed on QMLV devices at Group B, subgroup 5, only. Deltas are performed at room temperature. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 12 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019, conditions A and D for device types 02, 04, and as specified herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 13 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime -VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 14 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-91667 A.1 SCOPE A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device class V) are reflected in the Part or Identification Number (PIN). When available, a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. A.1.2 PIN. The PIN is as shown in the following example: 5962 R Federal stock class designator \ RHA designator (see A.1.2.1) 02 V 9 A Device type (see A.1.2.2) Device class designator (see A.1.2.3) Die code Die details (see A.1.2.4) 91667 / \/ Drawing number A.1.2.1 RHA designator. Device classes Q and V RHA identified die meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. A.1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 02 LM2941 Circuit function Radiation hardened adjustable, 1 amp, positive voltage regulator A.1.2.3 Device class designator. Device class Q or V STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535 SIZE 5962-91667 A REVISION LEVEL G SHEET 15 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-91667 A.1.2.4 Die details. The die details designation is a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. A.1.2.4.1 Die physical dimensions. Die type Figure number 02 A-1 A.1.2.4.2 Die bonding pad locations and electrical functions. Die type Figure number 02 A-1 A.1.2.4.3 Interface materials. Die type Figure number 02 A-1 A.1.2.4.4 Assembly related information. Die type Figure number 02 A-1 A.1.3 Absolute maximum ratings. See paragraph 1.3 herein for details. A.1.4 Recommended operating conditions. See paragraph 1.4 herein for details. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 16 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-91667 A.2 APPLICABLE DOCUMENTS. A.2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARD MIL-STD-883 - Test Method Standard Microcircuits. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. A.3 REQUIREMENTS A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. A.3.2 Design, construction and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein and the manufacturer’s QM plan for device classes Q and V. A.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in A.1.2.4.1 and on figure A-1. A.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in A.1.2.4.2 and on figure A-1. A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.4.3 and on figure A-1. A.3.2.4 Assembly related information. The assembly related information shall be as specified in A.1.2.4.4 and on figure A-1. A.3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as defined in paragraph 3.2.3 herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 17 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-91667 A.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. A.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. A.3.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in A.1.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535. A.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see A.6.4 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. A.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. A.4 VERIFICATION A.4.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM plan shall not affect the form, fit, or function as described herein. A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer’s QM plan. As a minimum, it shall consist of: a. Wafer lot acceptance for class V product using the criteria defined in MIL-STD-883, method 5007. b. 100% wafer probe (see paragraph A.3.4 herein). c. 100% internal visual inspection to the applicable class Q or V criteria defined in MIL-STD-883, method 2010 or the alternate procedures allowed in MIL-STD-883, method 5004. A.4.3 Conformance inspection. A.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see A.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified in paragraphs 4.4.4 and 4.4.4.1 herein. A.5 DIE CARRIER A.5.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 18 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-91667 A.6 NOTES A.6.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications, and logistics purposes. A.6.2 Comments. Comments on this appendix should be directed to DLA Land and Maritime -VA, Columbus, Ohio, 43218-3990 or telephone (614)-692-0540. A.6.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. A.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see A.3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 19 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-91667 FIGURE A-1. Die bonding pad locations and electrical functions. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 20 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-91667 Die bond pad coordinate locations (F-step) (Referenced to die center, coordinates in m) NC = no connection, NU = not used Signal name Pad number X / Y coordinates Pad size X Y X Y VIN 1 741 427 135 x 140 OUTPUT 2 -652 1007 130 x 140 OUTPUT 3 -652 717 130 x 140 GND 4 -739 -422 139 x 140 NC 5 -763 -636 90 x 90 NC 6 -763 -760 90 x 78 NC 7 -763 -878 90 x 78 NC 8 -763 -997 90 x 78 NC 9 -763 -1120 90 x 78 ADJ 10 -583 -1064 139 x 139 NC 11 7 -601 153 x 109 NC 12 148 -957 88 x 78 ON / OFF 13 555 -1094 140 x 140 GND 14 637 -133 140 x 140 VIN 15 741 137 135 x 140 Die bonding pad locations and electrical functions Die physical dimensions. Die size: 1752.6 mils x 2463.8 mils Die thickness: 304.8 mils Minimum pitch: 290.00 mils Interface materials. Top metallization: Al 0.5% CU Backside metallization: Bare back Glassivation. Type: Vapox over metal (VOM only) Thickness: 8K – 12K Substrate: Silicon Assembly related information. Substrate potential: GND Special assembly instructions: None FIGURE A-1. Die bonding pad locations and electrical functions – continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-91667 A REVISION LEVEL G SHEET 21 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 11-12-13 Approved sources of supply for SMD 5962-91667 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9166701QEA 3/ LM2941J/883 5962-9166701QXA 3/ LM2941K/883 5962-9166701QYA 3/ LM2941WG/883 5962-9166701VEA 3/ LM2941J-QMLV 5962-9166701VYA 3/ LM2941WG-QMLV 5962R9166702VYA 3/ LM2941WGRLQMLV 5962R9166702V9A 27014 LM2941 MDE 5962-9166703QYA 27014 LM2941GW/883 5962-9166703VYA 27014 LM2941GW-QMLV 5962R9166704VYA 27014 LM2941GWRLQMLV 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number 27014 Vendor name and address National Semiconductor 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.