TVS Diodes Transient Voltage Suppressor Diodes ESD3V3U1U Series Uni-directional Ultra-low Capacitance ESD / Transient Protection Diode ESD3V3U1U-02LS ESD3V3U1U-02LRH Data Sheet Revision 1.0, 2011-04-12 Final Industrial and Multi-Market Edition 2011-04-12 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. ESD3V3U1U Series Revision History Page or Item Subjects (major changes since previous revision) Revision 1.0, 2011-04-12 Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-06-09 Final Data Sheet 3 Revision 1.0, 2011-04-12 ESD3V3U1U Series Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 1.1 1.2 Uni-directional Ultra-low Capacitance ESD / Transient Protection Diode . . . . . . . . . . . . . . . . . . . 7 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 3.1 3.2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Typical Characteristics at TA=25°C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Ordering Information Scheme (Examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 6.1 6.2 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PG-TSSLP-2-1 (mm) [3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PG-TSLP-2-7 (mm)[3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Final Data Sheet 4 Revision 1.0, 2011-04-12 ESD3V3U1U Series List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 18 Pin Configuration and Schematic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Definitions of Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Line capacitance CL=f(VR) f = 1MHz, from pin 1 to pin 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Line capacitance CL=f(f), from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Line capacitance CL=f(TA), from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Reverse current IR=f(TA) , VR=3.3 V, from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Clamping voltage VTLP=f(ITLP), from pin 1 to pin 2[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Forward clamping voltage VTLP=f(ITLP) , from pin 2 to pin 1[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Single line, uni-directional ESD / Transient protection[2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PG-TSSLP-2-1: Package overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PG-TSSLP-2-1: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PG-TSSLP-2-1: Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PG-TSSLP-2-1: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PG-TSLP-2-7: Package overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PG-TSLP-2-7: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PG-TSLP-2-7: Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PG-TSLP-2-7: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Final Data Sheet 5 Revision 1.0, 2011-04-12 ESD3V3U1U Series List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum Rating at TA = 25 °C, unless otherwise specified. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD Characteristics at TA = 25 °C, unless otherwise specifie . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Final Data Sheet 6 7 8 8 9 9 Revision 1.0, 2011-04-12 ESD3V3U1U Series Uni-directional Ultra-low Capacitance ESD / Transient Protection Diode 1 Uni-directional Ultra-low Capacitance ESD / Transient Protection Diode 1.1 Features • • • • • ESD / Transient protection of high speed data lines exceeding – IEC61000-4-2 (ESD): ±20 kV (air / contact) – IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns) – IEC61000-4-5 (surge): 3 A (8/20 μs) Maximum working voltage: VRWM = 3.3 V Ultra low capacitance: CL = 0.4 pF (typical) Low clamping voltage, low dynamic resistance RDYN = 0.6 Ω (typical) Pb-free (RoHS compliant) and halogen free package, very small form factor down to 0.62 x 0.32 x 0.31 mm3 1.2 • • • Application Examples HDMI, USB 2.0/USB 3.0, DisplayPort, DVI 10/100/1000 Ethernet, Firewire, S-ATA Mobile HDMI Link, MDDI, MIPI, etc. 2 Product Description Pin 1 Pin 1 Pin 2 TSLP-2 Pin 1 marking (lasered) TSSLP -2 Pin 1 Pin 2 Pin 2 a) Pin configuration b) Schematic diagram P G-TS (S)LP -2-S ingle_Die_diode_P inConf_and_S chematicDiag.v st. vs d Figure 1 Pin Configuration and Schematic Diagram Table 1 Ordering Information Type Package Configuration ESD3V3U1U-02LS PG-TSSLP-2-1 1 line, uni-directional Z 1 line, uni-directional E3 ESD3V3U1U-02LRH PG-TSLP-2-7 Final Data Sheet 7 Marking code Revision 1.0, 2011-04-12 ESD3V3U1U Series Characteristics 3 Characteristics Table 2 Maximum Rating at TA = 25 °C, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. VESD – – 20 kV IPP – – 3 A Operating temperature range TOP -55 – 125 °C Storage temperature 1) VESD according to IEC61000-4-2 2) IPP according to IEC61000-4-5 Tstg -65 – 150 °C ESD (air / contact) discharge 1) Peak pulse current (tp = 8/20 μs) 2) Electrical Characteristics at TA = 25 °C, unless otherwise specified 3.1 R DYN: Dynamic resistance IF V BR: Breakdown voltage V RWM: Maximum working voltage IPP R DYN V CL: Clamping voltage V FC: Forward clamping voltage I PP: Peak pulse current IF VCL VBR VRWM VR VF IRWM VF VFC IR V F: Forward voltage I F: Forward current RDYN V R: Reverse voltage I PP I R: Reverse current IR Diode_Charac teris tic _Curv e_Uni-direc tional. vs d Figure 2 Definitions of Electrical Characteristics Table 3 DC Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Reverse working voltage VRWM – – 3.3 V Pin 1 to Pin 2 Breakdown voltage VBR 5 – – V IBR = 1 mA, from Pin 1 to Pin 2 Reverse current IR – <1 50 nA VR = 3.3 V, from Pin 1 to Pin 2 Final Data Sheet 8 Revision 1.0, 2011-04-12 ESD3V3U1U Series Characteristics Table 4 RF Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol 1) Values Min. Typ. Max. Unit Note / Test Condition Line capacitance CL – 0.4 0.6 pF VR = 0 V, f = 1 MHz Serie inductance LS – 0.2 – nH ESD3V3U1U-02LS – 0.4 – nH ESD3V3U1U-02LRH Unit Note / Test Condition V IPP = 16 A, 1) Total capacitance line to ground Table 5 ESD Characteristics at TA = 25 °C, unless otherwise specifie Parameter Symbol Clamping voltage VCL Values Min. Typ. Max. – 19 – from Pin 1 to Pin 2 – 28 – V IPP = 30 A, from Pin 1 to Pin 2 Forward clamping voltage VFC – 10 – V IPP = 16 A, from Pin 2 to Pin 1 – 17 – V IPP = 30 A, from Pin 2 to Pin 1 Dynamic resistance 1) RDYN – 0.6 – Ω Pin 1 to Pin 2 – 0.5 – Ω Pin 2 to Pin 1 1) Please refer to Application Note AN210. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window: t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP charactertistics between IPP1 = 10 A and IPP2 = 40 A. Final Data Sheet 9 Revision 1.0, 2011-04-12 ESD3V3U1U Series Characteristics Typical Characteristics at TA=25°C, unless otherwise specified 3.2 0.6 CL [pF] 0.5 0.4 0.3 0.2 Figure 3 0 0.5 1 1.5 VR [V] 2 2.5 3 2500 3000 Line capacitance CL=f(VR) f = 1MHz, from pin 1 to pin 2 0.6 CL [pF] 0.5 0.4 3.3V 0V 0.3 0.2 0 500 1000 1500 2000 f [MHz] Figure 4 Line capacitance CL=f(f), from pin 1 to pin 2 Final Data Sheet 10 Revision 1.0, 2011-04-12 ESD3V3U1U Series Characteristics 0.6 CL [pF] 0.5 3.3V 0.4 0V 0.3 0.2 -50 Figure 5 -25 0 25 TA [°C] 50 75 100 Line capacitance CL=f(TA), from pin 1 to pin 2 10 -6 IR [A] 10-7 10 -8 10 -9 10-10 Figure 6 10 -11 10 -12 25 50 75 TA [°C] 100 125 Reverse current IR=f(TA) , VR=3.3 V, from pin 1 to pin 2 Final Data Sheet 11 Revision 1.0, 2011-04-12 ESD3V3U1U Series Characteristics RDYN=0.6Ω 20 10 10 5 0 0 10 15 20 25 VTLP [V] 30 35 40 0 20 ESD3V3U1U-02xx RDYN RDYN=0.5Ω 30 ITLP [A] 5 Clamping voltage VTLP=f(ITLP), from pin 1 to pin 2[1] 40 Figure 8 15 15 20 10 10 5 0 0 0 5 10 15 20 25 VTLP [V] 30 35 40 Equivalent VIEC [kV] ITLP [A] 30 Figure 7 20 ESD3V3U1U-02xx RDYN Equivalent VIEC [kV] 40 Forward clamping voltage VTLP=f(ITLP) , from pin 2 to pin 1[1] Final Data Sheet 12 Revision 1.0, 2011-04-12 ESD3V3U1U Series Application Information 4 Application Information Application_ESD3V3U1U-02xxx.vsd Figure 9 Single line, uni-directional ESD / Transient protection[2] Final Data Sheet 13 Revision 1.0, 2011-04-12 ESD3V3U1U Series Ordering Information Scheme (Examples) 5 ESD Ordering Information Scheme (Examples) 0P1 RF - XX YY Package XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins) YY = Package family: LS = TSSLP LRH = TSLP For Radio Frequency Applications Line Capacitance CL in pF: (i.e.: 0P1 = 0.1pF) ESD 5V3 U n U - XX YY Package or Application XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins) YY = Package family: LS = TSSLP LRH = TSLP S = SOT363 U = SC74 XX = Application family: LC = Low Clamp HDMI Uni- / Bi-directional or Rail to Rail protection Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines) Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF) Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V) Figure 10 Ordering information scheme Final Data Sheet 14 Revision 1.0, 2011-04-12 ESD3V3U1U Series Package Information 6 Package Information 6.1 PG-TSSLP-2-1 (mm) [3] Top view Bottom view 0.31 +0.01 -0.02 0.62 ±0.035 2 1 0.2 ±0.025 1) 0.355 ±0.025 0.32 ±0.035 0.26 ±0.025 1) Cathode marking 1) Dimension applies to plated terminal TSSLP-2-1,-2-PO V05 PG-TSSLP-2-1: Package overview 0.19 0.24 Solder mask 0.19 0.57 0.62 Copper 0.19 0.27 0.14 0.32 0.24 Figure 11 Stencil apertures TSSLP-2-1,-2-FP V02 Figure 12 PG-TSSLP-2-1: Footprint 0.35 Cathode marking Figure 13 PG-TSSLP-2-1: Packing Figure 14 PG-TSSLP-2-1: Marking (example) Final Data Sheet 8 0.73 4 0.43 TSSLP-2-1,-2-TP V03 15 Revision 1.0, 2011-04-12 ESD3V3U1U Series Package Information 6.2 PG-TSLP-2-7 (mm)[3] Top view Bottom view 0.39 +0.01 -0.03 0.6 ±0.05 0.05 MAX. 1±0.05 0.65 ±0.05 2 0.25 ±0.035 1) 1 0.5 ±0.035 1) Cathode marking 1) Dimension applies to plated terminal TSLP 2 7 PO V02 0.45 Copper Solder mask 0.375 0.35 0.275 1 0.925 0.3 0.6 0.275 PG-TSLP-2-7: Package overview 0.35 Figure 15 Stencil apertures TSLP-2-7-FP V01 Figure 16 PG-TSLP-2-7: Footprint 0.5 1.16 Orientation marking Figure 17 PG-TSLP-2-7: Packing Figure 18 PG-TSLP-2-7: Marking (example) Final Data Sheet 8 4 0.76 TSLP-2-7-TP V03 16 Revision 1.0, 2011-04-12 ESD3V3U1U Series Terminology Terminology CL Line capacitance EFT Electrical Fast Transient ESD Electrostatic Discharge HDMI High Definition Multimedia Interface IEC International Electrotechnical Commission IPP Peak pulse current IR Reverse current IRWM Maximum Reverse working Current LCD Liquid Crystal Display LS Serial inductance MDDI Mobile Display Digital Interface MIPI Mobile Industrial Processor Interface RoHS Restriction of Hazardous Substances Directive S-ATA Serial Advanced Technology Attachment TA Ambient temperature TOP Operation temperature tp Pulse duration Tstg Storage temperature USB Universal Serial Bus VBR Breakdown Voltage VCL Reverse Clamping Voltage VESD Electrostatic Discharge Voltage VFC Forward Clamping Voltage VR Reverse Voltage VRWM Maximum Reverse Working Voltage Final Data Sheet 17 Revision 1.0, 2011-04-12 ESD3V3U1U Series References References [1] Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP Characterization Methodology [2] Infineon AG - Application Note AN140: ESD Protection for Digital High-Speed Interfaces (HDMI, FireWire, ...) using ESD5V3U1U) [3] Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Package Final Data Sheet 18 Revision 1.0, 2011-04-12 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG