SiZ342DT Datasheet

SiZ342DT
www.vishay.com
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
Channel-1
and
Channel-2
30
RDS(on) (Ω) MAX.
ID (A)
0.0115 at VGS = 10 V
30 a
0.0153 at VGS = 4.5 V
27.5
Qg (Typ.)
4.5 nC
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
G2
S2 8
S2 7
S2 6
5
S1/D2
APPLICATIONS
(Pin 9)
D1
m
m
1
m
3m
Top View
• TrenchFET® Gen IV power MOSFETs
• 100 % Rg and UIS tested
PowerPAIR® 3 x 3
3
• PowerPAIR® optimizes high-side and low-side
MOSFETs for synchronous buck converters
1
2 G1
3 D1
4 D1
D1
Bottom View
D1
• Synchronous buck
- Battery charging
- Computer system power
- Graphic cards
• POL
G1
N-Channel 1
MOSFET
S1/D2
G2
Ordering Information:
SiZ342DT-T1-GE3 (lead (Pb)-free and halogen-free)
N-Channel 2
MOSFET
S2
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
CHANNEL-1 AND CHANNEL-2
PARAMETER
SYMBOL
LIMIT
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
+20 / -16
TC = 70 °C
TA = 25 °C
ID
Continuous Source Drain Diode Current
Avalanche Current
Single Pulse Avalanche Energy
IDM
TC = 25 °C
TA = 25 °C
L = 0.1 mH
IS
IAS
EAS
TC = 25 °C
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
Soldering Recommendations (Peak Temperature) d, e
100
A
13.9
3.1 b, c
10
5
mJ
16.7
PD
10.7
3.7 b, c
W
2.4 b, c
TA = 70 °C
Operating Junction and Storage Temperature Range
26.5
15.6 b, c
12.4 b, c
TA = 70 °C
Pulsed Drain Current (t = 100 μs)
V
30 a
TC = 25 °C
Continuous Drain Current (TJ = 150 °C)
UNIT
TJ, Tstg
-55 to 150
260
°C
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR 3 x 3 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S15-0031-Rev. B, 19-Jan-15
Document Number: 62949
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ342DT
www.vishay.com
Vishay Siliconix
THERMAL RESISTANCE RATINGS
CHANNEL-1 AND CHANNEL-2
PARAMETER
Maximum
Junction-to-Ambient a, b
Maximum Junction-to-Case (Drain)
SYMBOL
TYP.
MAX.
t ≤ 10 s
RthJA
27
34
Steady State
RthJC
6
7.5
UNIT
°C/W
Notes
a. Surface mounted on 1" x 1" FR4 board.
b. Maximum under steady state conditions is 69 °C/W.
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
CHANNEL-1 AND CHANNEL-2
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate Threshold Voltage
VDS
VGS = 0 V, ID = 250 μA
30
-
-
ΔVDS/TJ
ID = 250 μA
-
20
-
ΔVGS(th)/TJ
ID = 250 μA
-
-5.6
-
mV/°C
VGS(th)
VDS = VGS, ID = 250 μA
1.2
-
2.4
V
Gate Source Leakage
IGSS
VDS =0 V, VGS = +20 V/ -16 V
-
-
± 100
nA
Zero Gate Voltage Drain Current
IDSS
On-State Drain Current b
ID(on)
Drain-Source On-State Resistance b
Forward Transconductance b
RDS(on)
gfs
VDS = 30 V, VGS = 0 V
-
-
1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
-
-
5
VDS ≤ 5 V,VGS = 10 V
10
-
-
VGS = 10 V, ID = 14.4 A
-
0.0084
0.0115
VGS = 4.5 V, ID = 13 A
-
0.0111
0.0153
VDS = 15 V, ID = 14.4 A
-
37
-
-
650
-
VDS = 15 V, VGS = 0 V, f = 1 MHz
-
236
-
-
20
-
0.03
-
0.06
-
10
20
μA
A
Ω
S
Dynamic a
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Crss / Ciss Ratio
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Output Charge
Qoss
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
S15-0031-Rev. B, 19-Jan-15
VDS = 15 V, VGS = 10 V, ID = 14.4 A
VDS = 15 V,VGS = 4.5 V, ID = 14.4 A
-
4.5
9
-
2.1
-
-
0.7
-
-
6.6
-
0.3
1.4
2.8
-
15
23
-
50
75
-
16
24
tf
-
10
20
td(on)
-
8
16
-
15
23
-
17
26
-
7
14
Rg
f = 1 MHz
td(on)
tr
td(off)
tr
td(off)
tf
VDD = 15 V, RL = 1.5 Ω
ID ≅ 10 A, VGEN = 4.5 V, Rg = 1 Ω
VDD = 15 V, RL = 1.5 Ω
ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω
pF
-
nC
Ω
ns
Document Number: 62949
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ342DT
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
CHANNEL-1 AND CHANNEL-2
SYMBOL
TEST CONDITIONS
TC = 25 °C
MIN.
TYP.
MAX.
UNIT
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Current (t = 100 μs)
ISM
Body Diode Voltage
VSD
IS = 10 A, VGS = 0 V
-
-
13.9
-
-
100
-
0.8
1.2
A
V
Body Diode Reverse Recovery Time
trr
-
20
35
ns
Body Diode Reverse Recovery Charge
Qrr
-
10
20
nC
Reverse Recovery Fall Time
ta
-
12.5
-
Reverse Recovery Rise Time
tb
-
7.5
-
IF = 10 A, dI/dt = 100 A/μs, TJ = 25 °C
ns
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S15-0031-Rev. B, 19-Jan-15
Document Number: 62949
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ342DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 AND CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
10
50
VGS = 10 V thru 4 V
8
ID - Drain Current (A)
ID - Drain Current (A)
40
30
20
6
TC = 25 °C
4
VGS = 3 V
10
2
0
0
TC = 125 °C
TC = - 55 °C
0
0.5
1
1.5
2
0
0.75
VDS - Drain-to-Source Voltage (V)
1.5
2.25
3
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
840
0.0215
RDS(on) - On-Resistance (Ω)
Ciss
C - Capacitance (pF)
630
0.0165
VGS = 4.5 V
0.0115
VGS = 10 V
420
210
0.0065
Coss
Crss
0.0015
0
0
10
20
30
40
50
0
12
18
On-Resistance vs. Drain Current
Capacitance
1.65
ID = 14.4 A
RDS(on) - On-Resistance (Normalized)
VDS = 8 V
8
6
VDS = 15 V, 24 V
4
2
0
0
24
VDS - Drain-to-Source Voltage (V)
10
VGS - Gate-to-Source Voltage (V)
6
ID - Drain Current (A)
2
4
6
Qg - Total Gate Charge (nC)
Gate Charge
S15-0031-Rev. B, 19-Jan-15
8
10
30
VGS = 10 V, 14.4 A
VGS = 4.5 V, 13 A
1.4
1.15
0.9
0.65
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 62949
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ342DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 AND CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.030
100
ID =14.4 A
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
0.024
TJ = 150 °C
10
TJ = 25 °C
1
0.018
TJ = 125 °C
0.012
TJ = 25 °C
0.006
0.000
0.1
0.0
0.3
0.6
0.9
2
1.2
4
VSD - Source-to-Drain Voltage (V)
50
ID = 250 μA
40
1.35
30
Power (W)
VGS(th) (V)
10
On-Resistance vs. Gate-to-Source Voltage
1.6
1.1
0.85
0.6
- 50
8
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
1.85
6
20
10
- 25
0
25
50
75
100
125
150
0
TJ - Temperature (°C)
0.001
0.01
0.1
1
Time (s)
10
100
1000
Threshold Voltage
Single Pulse Power (Junction-to-Ambient)
100
Limited by IDM
Limited by RDS(on)*
ID - Drain Current (A)
10
100 μs
1 ms
1
10 ms
100 ms
10 s, 1 s
0.1
DC
TA = 25 °C
BVDSS Limited
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
S15-0031-Rev. B, 19-Jan-15
Document Number: 62949
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ342DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 AND CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
35
Package
Limited
ID - Drain Current (A)
28
21
14
7
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
20
2.2
15
1.7
Power (W)
Power (W)
Current Derating*
10
1.1
0.6
5
0.0
0
0
25
50
75
100
TC - Case Temperature (°C)
Power, Junction-to-Case
125
150
0
25
50
75
100
TA - Ambient Temperature (°C)
125
150
Power, Junction-to-Ambient
* The power dissipation PD is based on TJ (max.) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit.
S15-0031-Rev. B, 19-Jan-15
Document Number: 62949
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ342DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 AND CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 69 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
0.0001
0.001
0.01
0.1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
0.1
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?62949.
S15-0031-Rev. B, 19-Jan-15
Document Number: 62949
7
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
PowerPAIR® 3 x 3 Case Outline
D
8
7
6
A
A1
5
K2
D2
5
6
K2
7
8
E1
K
L
d 0.10 C
2X
*
1
2
3
d 0.10 C
2X
0.10
4
0.15
4
3
2
1
e
b
b1
0.10 C
A
f
E2
K1
E
9
Note
* Indicates pin #1 orientation (optional)
c
C
d
0.08 C
MILLIMETERS
INCHES
DIM.
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.70
0.75
0.80
0.028
0.030
0.031
A1
0.00
0.05
0.000
b
0.35
0.40
0.45
0.014
0.016
0.018
b1
0.20
0.25
0.38
0.008
0.010
0.015
C
0.18
0.20
0.23
0.007
0.008
0.009
D
2.90
3.00
3.10
0.114
0.118
0.122
D2
2.35
2.40
2.45
0.093
0.094
0.096
E
2.90
3.00
3.10
0.114
0.118
0.122
E1
0.94
0.99
1.04
0.037
0.039
0.041
E2
0.47
0.52
0.57
0.019
0.020
0.022
e
0.002
0.65 BSC
0.026 BSC
K
0.25 typ.
0.010 typ.
K1
0.35 typ.
0.014 typ.
K2
0.30 typ.
L
0.27
0.32
0.012 typ.
0.37
0.011
0.013
0.015
ECN: T12-0347-Rev. C, 18-Jun-12
DWG: 5998
Revison: 18-Jun-12
1
Document Number: 67698
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PAD Pattern
Vishay Siliconix
RECOMMENDED MINIMUM PAD FOR PowerPAIR® 3 x 3
0.450
0.650
(0.018)
(0.026)
0.450
(0.018)
1.036
2.450
(0.096)
0.084
(0.003)
(0.041)
0.209
(0.008)
0.306
(0.012)
0.562
(0.022)
(0.063)
1.611
0.390
(0.015)
1.200
(0.047)
Recommended PAD for PowerPAIR 3 x 3
Dimensions in millimeters (inches)
Keep-Out 3.5 mm x 3.5 mm for non terminating traces
Document Number: 63294
Revision: 25-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
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Revision: 02-Oct-12
1
Document Number: 91000