Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces RoHS Pb GREEN SP03-6 (SO-8) Series Description This new broadband protection device from Littelfuse provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information. Agency Approvals - Pending Features Agency Agency File Number t 3P)4DPNQMJBOU E128662 t .4TVSGBDFNPVOU package (JEDEC SO-8) Pinout 1 8 2 7 3 6 4 5 t $MBNQJOHTQFFEPG nanoseconds t 6-7FQPYZNPMEJOH t -PXJOTFSUJPOMPTTMPH linear capacitance t 1FOEJOH6-SFDPHOJ[FE component t $PNCJOFEMPOHJUVEJOBM and metallic protection t -PXDMBNQJOHWPMUBHF t 5&-JOFDBSET t 5&BOE%4*OUFSGBDFT t #BTF5 Ethernet t 454*OUFSGBDFT SO-8 (Top View) Functional Block Diagram Line in Pin 1 and 8 Line out Pin 2, 3, 6, and 7 Ground Line out Line in Pin 4 and 5 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 93 SP03-6 (SO-8) Series SP03-6 (S0-8) Applications Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Absolute Maximum Ratings Parameter Rating Units Peak Pulse Current (8/20μs) 150 A Peak Pulse Power (8/20μs) 2800 W IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV IEC 61000-4-2, Air Discharge, (Level 4) 30 kV IEC 61000-4-5 (8/20μs) 100 A Telcordia GR 1089 (Intra-Building) (2/10μs) 100 A ITU K.20 (5/310μs) 40 A CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units 170 °C/W Operating Temperature Range -55 to 125 °C Storage Temperature Range SOIC Package -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) (SOIC - Lead Tips Only) 300 °C Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VRWM - - - 6 V VBR IT= 1mA 6.8 - - V Reverse Leakage Current IR VRWM= 6V, T= 25°C - - 25 μA Clamping Voltage, Line-Ground VC IPP= 50A, tp=8/20 μs - - 15 V Clamping Voltage, Line-Ground VC IPP= 100A, tp=8/20 μs - - 20 V - 16 25 pF Cj Between I/O Pins and Ground VR=0V, f= 1MHz Between I/O Pins VR=0V, f= 1MHz - 8 12 pF Reverse Stand-Off Voltage Reverse Breakdown Voltage Junction Capacitance SP03-6 (SO-8) Series 94 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time Figure 2: Current Derating Curve 120 Percentage of Rated Current (%IP) Peak Pulse Current (A) 1000 100 10 100 1 80 60 40 20 0 1 10 100 1000 0 20 40 60 80 100 120 140 160 Ambient Temperature (C) Pulse decay time (μs) Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 25 100 VC Clamping Voltage (V) 80 60 40 15 Line-to-Ground 10 5 20 0 0 0 5 10 15 20 25 30 35 40 0 20 40 Time, μs Figure 5: Capacitance vs. Reverse Voltage 80 100 Figure 6: Forward Voltage vs. Forward Current 7 20 18 Line-to-Ground 6 Ground-to-Line Forward Voltage (V) 16 Capacitance (pF) 60 IP Peak Impulse Current (A) 14 12 10 8 Line-to-Line 6 4 5 4 3 2 1 2 0 0 0 1 2 3 4 5 6 7 0 Reverse Voltage (V) ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 10 20 30 40 50 60 70 80 90 100 Forward Current (A) 95 SP03-6 (SO-8) Series SP03-6 (S0-8) Percentage of IPP (%) Line-to-Line 20 Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Application Example Recommendations of ITU K.20 and .21. This device protects against both positive and negative induced surge events. The TeleLink fuse provides overcurrent protection for the long term 50/60 Hz power fault events. The following schematic shows a high-speed data interface protection solution. The SP03-6 provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events. Its surge rating is compatible with the intra-building surge requirements of Telcordia’s GR-1089-CORE, and the Basic Level TIP 1 8 2 7 3 6 4 5 to chipset (Ethernet PHY, T3/E3 PHY, etc.) RING TeleLink (0461 1.25) SP03-6 Soldering Parameters Reflow Condition Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 217°C 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP03-6 (SO-8) Series 96 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Package Dimensions - Mechanical Drawings and Recommended Solder Pad Outline Package MS-012 (SO-8) Pins 8 JEDEC MO-223 Issue A Millimetres Inches LF A 1.35 1.75 0.053 0.069 o A1 0.10 0.25 0.004 0.010 Min Recommended Soldering Pad Outline (Reference Only) 1.25 1.65 0.043 0.065 0.31 0.51 0.012 0.020 c 0.017 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 1.27 BSC 0.050 BSC 1.27 0.40 0.050 0.016 G = GREEN T = Tape & Reel PACKAGE B = SOIC, 2500 quantity Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. Part Marking System 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. LF SP03-6 XXXXXXXX 6. Package surface matte finish VDI 11-13. First Line: Part number Second Line: Date code Ordering Information Part Number Package Marking Min. Order Qty. SP03-6BTG SOIC Tape & Reel SP03-6 2500 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 97 SP03-6 (SO-8) Series SP03-6 (S0-8) Product Characteristics SP03-6BTG Series Max B L Silicon Protection Array Min A2 e Part Numbering System Max Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Embossed Carrier Tape & Reel Specification - SOIC Package Dimensions Millimetres Max Min Max E 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.95 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 4.1 0.154 D1 P0 10P0 98 1.50 Min 3.9 0.059 Min 40.0 +/- 0.20 0.161 1.574 +/- 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t SP03-6 (SO-8) Series Inches Min 0.30 +/- 0.05 0.012 +/- 0.002 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.