Silicon Protection Arrays TM Low Capacitance ESD Protection Array Pb RoHS GREEN SP3003 Lead-Free/Green Series Description The SP3003 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, 8KV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features NC SP3003-04X/J I/O 1 GND I/O 2 VCC I/O 1 I/O 4 GND VCC I/O 2 I/O 3 t-PXDBQBDJUBODFPG 0.65pF (TYP) per I/O t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t&4%QSPUFDUJPOPGL7 contact discharge, L7BJSEJTDIBSHF (IEC61000-4-2) t4NBMMQBDLBHFTTBWF board space (SC70, SOT553, SOT563, MSOP10) t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50 ns) SP3003-04A I/O 1 NC I/O 2 NC Applications GND t $PNQVUFS1FSJQIFSBMT t/FUXPSL)BSEXBSF1PSUT I/O 3 NC t.PCJMF1IPOFT t5FTU&RVJQNFOU I/O 4 NC t1%"T t.FEJDBM&RVJQNFOU VCC t%JHJUBM$BNFSBT Functional Block Diagram SP3003-02 SP3003-04 VCC I/O1 I/O2 VCC I/O4 I/O2 GND I/O1 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. GND I/O3 35 SP3003 Lead-Free/Green Series Lead-Free/Green SP3003 SP3003-02X/J Silicon Protection Arrays TM Low Capacitance ESD Protection Array Absolute Maximum Ratings Symbol Parameter Value Units 2.5 A Operating Temperature -40 to 85 °C Storage Temperature -50 to 150 °C IP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 300 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Zener Breakdown Voltage VBR IR=10μA 6.0 Reverse Leakage Current ILEAK VR=5V Clamp Voltage1 VC ESD Withstand Voltage1 VESD Diode Capacitance1 C*0(/% Diode Capacitance CI/O-I/O 1 Typ Max Units 0.5 μA V IPP=1A, tp=8/20μs, Fwd 10.0 V IPP=2A, tp=8/20μs, Fwd 11.8 V IEC61000-4-2 (Contact) kV IEC61000-4-2 (Air) kV Reverse Bias=0V 0.80 pF Reverse Bias=1.65V 0.65 pF Reverse Bias=0V 0.35 pF /PUF1BSBNFUFSJTHVBSBOUFFECZEFWJDFDIBSBDUFSJ[BUJPO SP3003 Lead-Free/Green Series 36 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM Low Capacitance ESD Protection Array Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1.00 1 0 0.95 0.90 -2 I/O Capacitance (pF) Insertion Loss [dB] -1 -3 -4 -5 -6 -7 0.85 0.80 VCC = Float 0.75 0.70 VCC = 3.3V 0.65 VCC = 5V 0.60 -8 0.55 -9 0.50 -10 1.E+06 1.E+07 1.E+08 1.E+09 0.0 1.E+10 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) Frequency [Hz] Capacitance vs. Frequency 1.4E-12 Capacitance [F] 1.2E-12 1E-12 8E-13 6E-13 4E-13 Lead-Free/Green SP3003 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 37 SP3003 Lead-Free/Green Series Silicon Protection Arrays TM Low Capacitance ESD Protection Array Application Example +5V D2+ D2+ Gnd D2- D26 5 4 SP300x-04 1 2 3 D1+ D1+ Gnd D1HDMI or DVI Connector D1HDMI or DVI Interface IC D0+ D0+ Gnd D0- D06 5 4 SP300x-04 1 2 3 Clk+ Clk+ Gnd Clk- ClkGnd ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be nPBUFEPS/$ HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage Soldering Parameters Reflow Condition Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP3003 Lead-Free/Green Series 38 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM Low Capacitance ESD Protection Array Package Dimensions — SC70-5 e e 6 5 Package Solder Pad Layout 4 not used E HE SC70-5 Pins 5 JEDEC MO-203 Issue A Millimeters 3 2 1 Min B D A2 A A1 C Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e L Inches Max 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SC70-6 6 5 Solder Pad Layout 4 E 2 1 Package SC70-6 Pins 6 JEDEC HE MO-203 Issue A Millimeters B D A2 A A1 C Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e L Inches Min 3 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SOT553 A D 6 5 4 (not used) 2 3 e E Package L HE SOT 553 Pins Solder Pad Layout c B Min Max Min Max 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e ©2008 Littelfuse, Inc. 39 Inches 0.50 A Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 5 Millimeters 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 SP3003 Lead-Free/Green Series Lead-Free/Green SP3003 e e Silicon Protection Arrays TM Low Capacitance ESD Protection Array Package Dimensions — SOT563 A D Package L SOT 563 Pins 6 5 4 E 2 Solder Pad Layout HE 3 e 6 Millimeters Min c B Inches Max Min Max 0.024 A 0.50 0.60 0.020 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package Dimensions — MSOP10 Package MSOP10 Pins 10 Millimeters Solder Pad Layout Max Min Max A - 1.10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 e HE Part Numbering System Inches Min 0.50 BSC 0.40 0.80 0.020 BSC 0.016 0.032 Product Characteristics SP3003-04 X T G Silicon Protection Array G= Green T= Tape & Reel Series Package Number of Channels A = MSOP-10, 3000 quantity J = SC70-5 or SC70-6, 3000 quantity X = SOT553 or SOT563, 5000 quantity -02 = 2 channel (SC70-5, SOT553 packages) -04 = 4 channel (SC70-6, SOT563, MSOP-10 packages) Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 /PUFT 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. XXX XXX 4. All specifications comply to JEDEC SPEC MO-223 Issue A Product Series Number of Channels (varies) F, H or P = SP3003 series (varies) 2 or 4 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Assembly Site (varies) SP3003 Lead-Free/Green Series 40 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM Low Capacitance ESD Protection Array Ordering Information Part Number Package Marking Min. Order Qty. SP3003-02JTG SC70-5 FX2 3000 SP3003-02XTG SOT553 FX2 5000 SP3003-04ATG MSOP-10 FX4 3000 SP3003-04JTG SC70-6 FX4 3000 SP3003-04XTG SOT563 FX4 5000 Embossed Carrier Tape & Reel Specifications - SC70-5 and SC70-6 Millimetres Inches Max Min Max E 1.65 1.85 0.064 0.072 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.080 D 1.40 1.60 0.055 0.062 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.153 0.161 10P0 40.0+/- 0.20 1.574+/-0.007 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max Millimetres Inches Embossed Carrier Tape & Reel Specifications - SOT553 and SOT563 Min Max Min Max E 1.65 1.85 0.064 0.072 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.080 D 1.40 1.60 0.055 0.062 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.153 0.161 10P0 ©2008 Littelfuse, Inc. 41 1.574+/-0.007 W 7.70 8.10 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 0.303 0.318 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 40.0+/- 0.20 0.22 max 0.008 max SP3003 Lead-Free/Green Series Lead-Free/Green SP3003 Min Silicon Protection Arrays TM Low Capacitance ESD Protection Array Embossed Carrier Tape & Reel Specification - MSOP-10 Millimetres Min Max Min Max E 1.65 1.85 0.064 0.072 F 5.40 5.60 0.212 0.220 D 1.50 1.60 0.059 0.062 4.10 0.153 D1 P0 10P0 42 1.50 Min 3.90 0.059 Min 40.0+/- 0.20 0.161 1.574+/-0.007 W 11.90 12.10 0.468 0.476 P 7.90 8.10 0.311 0.318 A0 5.20 5.40 0.204 0.212 B0 3.20 3.40 0.125 0.133 K0 1.20 1.40 0.047 0.055 t SP3003 Lead-Free/Green Series Inches 0.30 +/- 0.05 0.011+/- 0.001 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.