Varistor Products Surface Mount Multilayer Varistors (MLVs) > MHS Series RoHS MHS Varistor Series Description The Multilayer High–Speed MHS Series is a very-low capacitance extension to the Littelfuse ML family of transient voltage surge suppression devices available in an 0402 and 0603–size surface mount chip. Their small size is ideal for high–density printed circuit boards, being typically applied to protect intergrated circuits and other sensitive components. They are particularly well suited to suppress ESD events including those specified in IEC 61000-4-2 or other standards used for Electromagnetic Compliance (EMC) testing. Size Table Metric EIA 0402 1608 0603 The MHS Series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. The MHS Series is also compatible with modern reflow and wave soldering prcesses. Littelfuse Inc. manufactures other multilayer varistor series products, see the ML, MLE, MLN and AUML Series data sheets. Applications Features t %BUB%JBHOPTUJD *01PSUT t .PCJMF Communications t 6OJWFSTBM4FSJBM #VT64# t $PNQVUFS%41 1SPEVDUT t 7JEFP"VEJP1PSUT t *OEVTUSJBM*OTUSVNFOUT Including Medical t 1PSUBCMF)BOE )FME1SPEVDUT t 3P)4DPNQMJBOU t Q'Q'BOEQ' capacitance versions suitable for high–speed data rate lines t &4%SBUFEUP*&$ 61000-4-2 (Level 4) t &'5#SBUFEUP*&$ 61000-4-4 (Level 4) t -PXMFBLBHFDVSSFOUT t $UP$ operating temp. range t *OIFSFOUMZCJEJSFDUJPOBM Absolute Maximum Ratings t'PSSBUJOHTPGJOEJWJEVBMNFNCFSTPGBTFSJFTTFFEFWJDFSBUJOHTBOETQFDJmDBUJPOTUBCMF Continuous MHS Series Units ≤ 42 7 7.)4 ≤ 18 7 7.)4 ≤ 09 Steady State Applied Voltage: %$7PMUBHF3BOHF7M(DC)) : 7.)4 0QFSBUJOH"NCJFOU5FNQFSBUVSF3BOHF5A) 4UPSBHF5FNQFSBUVSF3BOHF5STG) ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. 7 UP 0 C UP 0 C MHS Varistor Series Revision: November 29, 2011 MHS Series The MHS Series provides protection from ESD and EFT in high–speed data line and other high frequency applications. The low capacitance of the MHS Series permits usage in analog or digital circuits where it will not attenuate or distort the desired signal or data. Varistor Products Surface Mount Multilayer Varistors (MLVs) > MHS Series Device Ratings and Specifications Performance Specifications (25 ºC) Maximum Clamping Voltage At 1A (8X20μs) Part Number Typical Typical Leakage Typical Inductance Current at Specified Capacitance at (from Impedance DC Voltage 1MHz (1V p-p) Analysis) 3.5V 5.5V C (Note 4) L P IL MIN MAX Maximum ESD Clamp Voltage (Note 1) 8kV Contact (Note 2) Clamp 15kV AIR (Note 3) Clamp (Vc) (V) (V) (μA) (μA) (pF) (pF) 7.)4//PUF <300 <400 1.00 2 <1.0 7.)4/ <300 <400 1.00 1 6 <1.0 7.)4//PUF <160 1.00 8 16 <1.0 7.)4/ <160 1.00 8 16 <1.0 7.)4/ 30 <160 1.00 29 <1.0 7.)4/ 30 <100 1.00 29 <1.0 /PUF (nH) /05&4 5FTUFEUP*&$)VNBO#PEZ.PEFM)#. EJTDIBSHFUFTUDJSDVJU 2. Direct discharge to device terminals (IEC preferred test method). 3. Corona discharge through air (represents actual ESD event). $BQBDJUBODFNBZCFDVTUPNJ[FEDPOUBDUZPVS-JUUFMGVTF4BMFT3FQSFTFOUBUJWF 7.)4YYYTJ[FEFWJDFT BWBJMBCMFBT3QBDLBHJOHPQUJPOPOMZ&YBNQMF7.)4/34FF1BDLBHJOHBOE5BQFBOE3FFMTFDUJPOTMBTUQBHF GPSBEEJUJPOBMJOGPSNBUJPO Standby Current at Normalized Varistor Voltage and Temperature 'PSBQQMJDBUJPOTFYDFFEJOH$BNCJFOUUFNQFSBUVSFUIF peak surge current and energy ratings must be reduced as shown below. PERCENT OF RATED VALUE 100 80 60 40 1.2 NORMALIZED VARISTOR VOLTAGE (V) Peak Current and Energy Derating Curve 1.0 0.8 25O 0.6 85O 0.4 125O 0.2 0.0 20 0.0001 0.001 0.01 50 60 70 80 90 100 110 120 0.1 1 CURRENT (mA) Figure 2 0 -55 130 140 150 AMBIENT TEMPERATURE ( oC) Figure 1 Insertion Loss (S21) Characteristics Nominal Voltage Stability to Multiple ESD Impulses (8kV Contact Discharges per IEC 61000-4-2) 0 INSERTION LOSS (dB) NOMINAL VOLTAGE AT 1mADC 60 V0402MHS03 V0603MHS03 50 40 30 -20 V0402MHS22 V0603MHS22 -30 V0402MHS22 V0603MHS22 10 Figure 3 V0402MHS03 V0603MHS03 V0402MHS12 V0603MHS12 20 0 V0402MHS12 V0603MHS12 -10 10 Figure 4 1 10 100 1000 100 1000 10000 FREQUENCY (MHz) 10000 Number of Pulses ©2011 Littelfuse, Inc. MHS Varistor Series Revision: November 29, 2011 Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. Varistor Products Surface Mount Multilayer Varistors (MLVs) > MHS Series Device Characteristics Speed of Response "UMPXDVSSFOUMFWFMTUIF7*DVSWFPGUIFNVMUJMBZFS transient voltage suppressor approaches a linear (ohmic) relationship and shows a temperature dependent effect. At or below the maximum working voltage, the suppressor is in a high resistance model (approaching 106Ω at its maximum rated working voltage). Leakage currents at maximum rated voltage are below 100μ"UZQJDBMMZμA; for 0402 size below 20μ"UZQJDBMMZμA. The Multilayer Suppressor is a leadless device. Its response time is not limited by the parasitic lead inductances found in other surface mount packages. The response time of the ZN0EJFMFDUSJDNBUFSJBMJTMFTT UIBOOTBOEUIF.-&DBODMBNQWFSZGBTUE7E5FWFOUT such as ESD. Additionally, in “real world” applications, the associated circuit wiring is often the greatest factor effecting speed of response. Therefore, transient suppressor placement within a circuit can be considered important in certain instances. Typical Temperature Dependance of the Characteristic $VSWFJOUIF-FBLBHF3FHJPO Multilayer Internal Construction METAL ELECTRODES METAL END TERMINATION DEPLETION 25 10% 1E -9 Figure 5 1E -8 o REGION 50o 75o 1E -7 100o 125 oC 1E -6 1E -5 1E -4 1E -3 DEPLETION 1E -2 Figure 6 SUPPRESSOR CURRENT (ADC) REGION GRAINS Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of DPNQPOFOUTJOTVSGBDFNPVOUUFDIOPMPHZBSF*33FnPX and Wave soldering. Typical profiles are shown on the right. Reflow Solder Profile The recommended solder for the MHS suppressor is B4O1C"H 4O1C PS4O1C -JUUFMGVTFBMTPSFDPNNFOETBO3."TPMEFSnVY 230 Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. When using a reflow process, care should be taken to ensure that the MHS chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. Figure 7 Wave Solder Profile 0ODFUIFTPMEFSJOHQSPDFTTIBTCFFODPNQMFUFEJUJT still necessary to ensure that any further thermal shocks BSFBWPJEFE0OFQPTTJCMFDBVTFPGUIFSNBMTIPDLJTIPU printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually UPMFTTUIBO$CFGPSFDMFBOJOH Figure 8 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. MHS Varistor Series Revision: November 29, 2011 MHS Series FIRED CERAMIC DIELECTRIC VNOM VALUE AT 25 oC (%) SUPPRESSOR VOLTAGE IN PERCENT OF 100% Varistor Products Surface Mount Multilayer Varistors (MLVs) > MHS Series Lead–free (Pb-free) Soldering Recommendations -JUUFMGVTFPGGFSTUIF/JDLFM#BSSJFS5FSNJOBUJPOmOJTIGPSUIF optimum Lead–free solder performance. Lead–free Re-flow Profile 5IFQSFGFSSFETPMEFSJT4O"H$V XJUIBO3." flux, but there is a wide selection of pastes and fluxes BWBJMBCMFXJUIXIJDIUIF/JDLFM#BSSJFSQBSUTTIPVMECF compatible. MAXIMUM TEMPERATURE 260˚C 20 - 40 SECONDS WITHIN 5˚C RAMP RATE <3˚C/s The reflow profile must be constrained by the maximums JOUIF-FBEoGSFF3FnPX1SPmMF'PS-FBEoGSFFXBWF TPMEFSJOHUIF8BWF4PMEFS1SPmMFTUJMMBQQMJFT 60 - 150 SEC > 217˚C PREHEAT ZONE Note: the Lead–free paste, flux and profile were used for evaluation purposes by Littelfuse, based upon industry standards and practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. 5.0 6.0 7.0 Figure 10 Product Dimensions (mm) 1"%-":065%&.&/4*0/4 $)*1-":065%*.&/4*0/4 E D L W Note: Avoid metal runs in this area, parts are not recommended for use in applications using Silver (Ag) epoxy paste. Dimension 0402 Size IN 0603 Size MM IN MM A 0.100 B 0.020 0.030 C 0.024 0.610 0.890 D (max.) 0.024 0.600 0.040 1.000 E L W ©2011 Littelfuse, Inc. MHS Varistor Series Revision: November 29, 2011 Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. Varistor Products Surface Mount Multilayer Varistors (MLVs) > MHS Series Part Numbering System V 0402 MHS 03 N R PACKING OPTIONS (See quantities in Packaging section) T = (0603 device only)13in (330mm) Diameter Reel, Plastic Carrier Tape H = (0603 device only) 7in (178mm) Diameter Reel, Plastic Carrier Tape R = (available for 0402 and 0603 devices) 7in (178mm) Diameter Reel, Paper Carrier Tape DEVICE FAMILY Littelfuse TVSS Device DEVICE SIZE 0402 = .04 inch x .02 inch (1.0 mm x 0.5 mm) 0603 = .063 inch x .031 inch (1.6 mm x 0.8 mm) END TERMINATION OPTION N = Nickel Barrier (Ni/Sn) CAPACITANCE DESIGNATION 03 = 3pF 12 = 12pF 22 = 22pF SERIES DESIGNATOR MHS = Multilayer Hi-Speed Packaging* Device Size 7 Inch Reel ("H" Option) MHS Series Quantity 13 Inch Reel ("T" Option) 7 Inch Reel ("R" Option) 0603 10,000 4,000 0402 not available not available 10,000 1BDLBHJOH *UJTSFDPNNFOEFEUIBUQBSUTCFLFQUJOUIFTFBMFECBHQSPWJEFEBOEUIBUQBSUTCFVTFEBTTPPOBTQPTTJCMFXIFOSFNPWFEGSPNCBHT Tape and Reel Specifications D0 T P0 P2 E F K0 W B0 T1 D1 P1 Symbol A0 Dimensions in Millimeters Description 0402 Size 0603 Size A0 Width of Cavity %FQFOEFOUPO$IJQ4J[FUP.JOJNJ[F3PUBUJPO B0 Length of Cavity %FQFOEFOUPO$IJQ4J[FUP.JOJNJ[F3PUBUJPO K0 Depth of Cavity %FQFOEFOUPO$IJQ4J[FUP.JOJNJ[F3PUBUJPO W Width of Tape F %JTUBODF#FUXFFO%SJWF)PMF$FOUFSTBOE$BWJUZ$FOUFST E %JTUBODF#FUXFFO%SJWF)PMF$FOUFSTBOE5BQF&EHF P1 %JTUBODF#FUXFFO$BWJUZ$FOUFST P2 "YJBM%SJWF%JTUBODF#FUXFFO%SJWF)PMF$FOUFST$BWJUZ$FOUFST P0 "YJBM%SJWF%JTUBODF#FUXFFO%SJWF)PMF$FOUFST D0 Drive Hole Diameter D1 %JBNFUFSPG$BWJUZ1JFSDJOH /" T1 Top Tape Thickness 0.1 Max 0.1 Max T Nominal Carrier Tape Thickness 1.1 1.1 Notes: t$POGPSNTUP&*"3FWJTJPO" t$BOCFTVQQMJFEUP*&$QVCMJDBUJPO ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. MHS Varistor Series Revision: November 29, 2011