lm358f e

Datasheet
Operational Amplifiers
Ground Sense Operational Amplifiers
LM358xxx
LM324F
LM2904xxx
General Description
Key Specifications
 Operating Supply Voltage (Single Supply):
3.0V to 32.0V
 Temperature Range:
LM358xxx:
-40°C to +85°C
LM324F:
-40°C to +85°C
LM2904xxx:
-40°C to +125°C
 Input Offset Voltage:
4.5mV (Max)
 Input Bias Current:
20nA (Typ)
LM358xxx and LM2904xxx series are dual ground
sense operational amplifiers. LM324F is a quad. These
have features of low current consumption and wide
operating voltage range from 3V to 32V (single power
supply).
Features
 Operable with a Single Power Supply
 Wide Operating Supply Voltage Range
 Input/output Ground Sense
 High Large Signal Voltage Gain
W(Typ) x D(Typ) x H(Max)
Packages
SOP8
SOP-J8
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
SOP14
Applications
 Current Sense Application
 Buffer Application Amplifier
 Active Filter
 Consumer Electronics
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
3.00mm x 6.40mm x 1.35mm
3.00mm x 6.40mm x 1.20mm
3.00mm x 4.90mm x 1.10mm
2.90mm x 4.00mm x 0.90mm
8.70mm x 6.20mm x 1.71mm
Pin Configuration
LM358F, LM2904F
LM358FJ, LM2904FJ
LM358FV, LM2904FV
LM358FVT, LM2904FVT
LM358FVJ, LM2904FVJ
LM358FVM, LM2904FVM
OUT1
-IN1
: SOP8
: SOP-J8
: SSOP-B8
: TSSOP-B8
: TSSOP-B8J
: MSOP8
8
1
2
+IN1
3
VEE
4
CH1
-
7
+
+
CH2
+
-
VCC
OUT2
6
-IN2
5
+IN2
○Product structure:Silicon monolithic integrated circuit
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
○This product has no designed protection against radioactive rays.
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LM358xxx
LM324F
LM324F
Datasheet
LM2904xxx
: SOP14
OUT1 1
-IN1 2
14 OUT4
CH1
- +
CH4
+ -
13 -IN4
+IN1 3
12 +IN4
VCC 4
11 VEE
+IN2 5
10 +IN3
-IN2 6
- +
CH2
+ CH3
OUT2 7
9 -IN3
8 OUT3
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VCC
5
+IN2
6
-IN2
7
OUT2
8
OUT3
9
-IN3
10
+IN3
11
VEE
12
+IN4
13
-IN4
14
OUT4
Absolute Maximum Ratings (TA=25°C)
Supply Voltage
Power Dissipation
LM358xxx
Rating
LM324F
36
LM2904xxx
SOP8
0.68(Note 1,6)
-
0.68(Note 1,6)
SOP-J8
0.67(Note 2,6)
-
0.67(Note 2,6)
SSOP-B8
0.62(Note 3,6)
-
0.62(Note 3,6)
TSSOP-B8
0.62(Note 3,6)
-
0.62(Note 3,6)
(Note 4,6)
-
0.58(Note 4,6)
-
0.58(Note 4,6)
Symbol
Parameter
VCC-VEE
PD
TSSOP-B8J
0.58
MSOP8
0.58
SOP14
(Note 4,6)
(Note 5,6)
-
0.56
Unit
V
W
-
Differential Input Voltage (Note 7)
VID
36
V
Input Common-mode Voltage Range
VICM
(VEE-0.3) to (VEE+36)
±10
V
mA
Input Current(Note 8)
II
Operating Supply Voltage
Vopr
Operating Temperature Range
Topr
3.0 to 32.0
-40 to +85
-40 to +85
V
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Maximum Junction Temperature
Tjmax
150
°C
(Note 1)
(Note 2)
(Note 3)
(Note 4)
(Note 5)
(Note 6)
(Note 7)
Reduce by 5.5mW per 1°C above 25C.
Reduce by 5.4mW per 1°C above 25°C.
Reduce by 5.0mW per 1°C above 25°C.
Reduce by 4.7mW per 1°C above 25°C.
Reduce by 4.5mW per 1°C above 25°C.
Mounted on an FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs.
The input pin voltage is set to more than VEE.
(Note 8) An excessive input current will flow when input voltages of less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Electrical Characteristics
○LM358xxx, LM2904xxx (Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Temperature
Range
Min
Typ
Max
25°C
-
1
4.5
Full Range
-
-
5
-
-
6
-
25°C
-
2
50
Full Range
-
-
200
25°C
-
20
250
Full Range
-
-
300
25°C
-
0.6
1.2
Full Range
-
-
1.5
25°C
3.5
-
-
Full Range
27
28
-
VOL
Full Range
-
5
20
AV
25°C
25
100
-
88
100
-
Input Common-mode Voltage Range
VICM
25°C
0
-
3.5
V
Input Common-mode Voltage Range
(VEE side) (Note 11)
VICM=VEE to (VCC-1.5V)
VOUT=1.4V
VICM
Full Range
Common-mode Rejection Ratio
CMRR
25°C
70
80
-
dB
VOUT=1.4V
Power Supply Rejection Ratio
PSRR
25°C
65
100
-
dB
VCC=5 to 30V
Output Source Current(Note 10,12)
ISOURCE
25°C
20
30
-
Full Range
10
-
-
mA
V+IN=1V, V-IN=0V
VOUT=0V, Short Current
25°C
20
27
-
Full Range
5
-
-
mA
V+IN=0V, V-IN=1V
VOUT=5V, Short Current
25°C
20
50
-
μA
V+IN=0V, V-IN=1V
VOUT=200mV
dB
f=1kHz, Input Referred
Parameter
Symbol
Input Offset Voltage(Note 9,10)
VIO
Input Offset Voltage Drift(Note 9)
∆VIO/∆T
Input Offset Current(Note 9,10)
IIO
Input Bias Current(Note 9,10)
IB
Supply Current(Note 10)
ICC
Maximum Output Voltage (High)(Note 10)
VOH
Maximum Output Voltage (Low)
(Note 10)
Large Signal Voltage Gain
Output Sink Current
(Note 10,12)
ISINK
Unit
mV
VOUT=1.4V
VCC=5 to 30V, VOUT=1.4V
μV/°C VOUT=1.4V
nA
VOUT=1.4V
nA
VOUT=1.4V
mA
RL=∞, All Op-Amps
V
mV
RL=2kΩ
VCC=30V, RL=10kΩ
RL=∞
V/mV R ≧2kΩ, V =15V
L
CC
dB VOUT=1.4 to 11.4V
Channel Separation
CS
25°C
-
120
-
Slew Rate
SR
25°C
-
0.3
-
GBW
25°C
-
0.8
-
Phase Margin
θ
25°C
-
80
-
deg
Input Referred Noise Voltage
VN
25°C
-
40
-
nV/ Hz
Gain Bandwidth
Condition
VCC=15V, Av=0dB
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
MHz
CL=100pF
V/μs
Av=40dB
VCC=15V, VEE=-15V
RS=100Ω, VIN=0V, f=1kHz
(Note 9)
Absolute value
(Note 10) LM358xxx Full Range: TA=-40C to +85C, LM2904xxx Full Range: TA=-40C to +125C
(Note 11) LM2904xxx only.
(Note 12) Consider the power dissipation of the IC under high temperature when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Electrical Characteristics - continued
○LM324F (Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Temperature
Range
Min
Typ
Max
25°C
-
1
4.5
Full Range
-
-
5
-
-
6
-
25°C
-
2
50
Full Range
-
-
200
25°C
-
20
250
Full Range
-
-
300
25°C
-
1
2
Full Range
-
-
1.5
25°C
3.5
-
-
Full Range
27
28
-
VOL
Full Range
-
5
20
AV
25°C
25
100
-
88
100
-
VICM
25°C
0
-
3.5
V
VICM=VEE to (VCC-1.5V)
VOUT=1.4V
Common-mode Rejection Ratio
CMRR
25°C
70
80
-
dB
VOUT=1.4V
Power Supply Rejection Ratio
PSRR
25°C
65
100
-
dB
VCC=5 to 30V
Output Source Current(Note 14,15)
ISOURCE
25°C
20
30
-
Full Range
10
-
-
mA
V+IN=1V, V-IN=0V
VOUT=0V, Short Current
25°C
20
27
-
Full Range
5
-
-
mA
V+IN=0V, V-IN=1V
VOUT=5V, Short Current
25°C
20
50
-
μA
V+IN=0V, V-IN=1V
VOUT=200mV
dB
f=1kHz, Input Referred
Parameter
Symbol
Input Offset Voltage(Note 13,14)
VIO
Input Offset Voltage Drift(Note 14)
∆VIO/∆T
Input Offset Current(Note 13,14)
IIO
Input Bias Current(Note 13,14)
IB
Supply Current(Note 14)
ICC
Maximum Output Voltage (High)(Note 14)
VOH
Maximum Output Voltage (Low)
(Note 14)
Large Signal Voltage Gain
Input Common-mode Voltage Range
Output Sink Current
(Note 14,15)
ISINK
Unit
mV
VOUT=1.4V
VCC=5 to 30V, VOUT=1.4V
μV/°C VOUT=1.4V
nA
VOUT=1.4V
nA
VOUT=1.4V
mA
RL=∞, All Op-Amps
V
mV
RL=2kΩ
VCC=30V, RL=10kΩ
RL=∞
V/mV R ≧2kΩ, V =15V
L
CC
dB VOUT=1.4 to 11.4V
Channel Separation
CS
25°C
-
120
-
Slew Rate
SR
25°C
-
0.3
-
GBW
25°C
-
0.8
-
Phase Margin
θ
25°C
-
80
-
deg
Input Referred Noise Voltage
VN
25°C
-
40
-
nV/ Hz
Gain Bandwidth
Condition
VCC=15V, Av=0dB
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
MHz
CL=100pF
V/μs
Av=40dB
VCC=15V, VEE=-15V
RS=100Ω, VIN=0V, f=1kHz
(Note 13) Absolute value
(Note 14) Full Range: TA=-40C to +85C
(Note 15) Consider the power dissipation of the IC under high temperature when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Description of Electrical Characteristics
Below are the descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown.
Note that item names, symbols, and their meanings may differ from those of another manufacturer’s document or general
document.
1. Absolute Maximum Ratings
Absolute maximum rating items indicate the conditions which must not be exceeded. Application of voltage in excess of the
absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of
electrical characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the VCC pin and VEE pin without deterioration of
characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between the non-inverting and inverting pins without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or
destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical Characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting pin and inverting pin. It can be translated to the input voltage
difference required for setting the output voltage to 0V.
(2) Input Offset Voltage Drift (∆VIO/∆T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
(3) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting pins.
(4) Input Bias Current (IB)
Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the
non-inverting and inverting pins.
(5) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(6) Maximum Output Voltage (High) / Maximum Output Voltage (Low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
(7) Large Signal Voltage Gain (AV)
Indicates the amplification rate (gain) of output voltage against the voltage difference between non-inverting pin and
inverting pin. It is normally the amplification rate (gain) with reference to DC voltage.
Av = (Output Voltage) / (Differential Input Voltage)
(8) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range at which IC normally operates.
(9) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is normally
the fluctuation of DC.
CMRR = (Change of Input Common-mode Voltage)/(Input Offset Fluctuation)
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LM358xxx
LM324F
Datasheet
LM2904xxx
(10) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of Power Supply Voltage)/( Input Offset Fluctuation)
(11) Output Source Current/ Output Sink Current (ISOURCE / ISINK)
The maximum current that the IC can output under specific output conditions. The output source current indicates the
current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(12) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
(13) Slew Rate (SR)
Indicates the rate of the change of the output voltage with time when a step input signal is applied.
(14) Gain Bandwidth (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
(15) Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
(16) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input pin.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves
1.6
1.6
1.2
1.2
85°C
Supply Current [mA]
Supply Current [mA]
○LM358xxx, LM2904xxx
25°C
0.8
-40°C
125°C
0.4
0.8
5V
3V
0.4
0.0
0.0
0
10
20
30
-50
40
-25
0
25
50
75
100
125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient
Temperature
150
5
Maximum Output Voltage High [V]
40
Maximum Output Voltage High [V]
36V
125°C
30
85°C
25°C
20
-40°C
10
4
3
2
1
0
0
0
10
20
30
40
-50
-25
Supply Voltage [V]
0
25
50
75
100 125 150
Ambient Temperature [°C]
Figure 3. Maximum Output Voltage (High) vs
Supply Voltage (RL=10kΩ)
Figure 4. Maximum Output Voltage (High) vs
Ambient Temperature (VCC=5V, RL=10kΩ)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
5
50
4
40
Output Source Current [mA]
Maximum Output Voltage High [V]
○LM358xxx, LM2904xxx
3
2
1
-40°C
25°C
30
20
85°C
125°C
10
0
-50
-25
0
25
50
75
100
125
0
150
0
1
4
5
Figure 6. Output Source Current vs
Output Voltage (VCC=5V)
50
50
40
40
Output Sink Current [mA]
Output Source Current [mA]
Figure 5. Maximum Output Voltage (High) vs
Ambient Temperature (VCC=5V, RL=2kΩ)
30
5V
36V
3
Output Voltage [V]
Ambient Temperature [°C]
3V
20
2
10
25°C
30
85°C
125°C
20
-40°C
10
0
-50
-25
0
25
50
75
100
125
0
150
0
Ambient Temperature [°C]
1
2
3
4
5
Output Voltage [V]
Figure 7. Output Source Current vs
Ambient Temperature (VOUT=0V)
Figure 8. Output Sink Current vs
Output Voltage (VCC=5V)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM358xxx, LM2904xxx
102
100
50
36V
30
Low Level Sink Current [mA]
Output Sink Current [mA]
40
5V
20
3V
10
0
-50
1
10
10
125°C
1010
85°C
100-1
25°C
-40°C
100-2
100-3
-25
0
25
50
75
100
125
150
0
0.5
Ambient Temperature [°C]
1.5
2
Output Voltage [V]
Figure 9. Output Sink Current vs Ambient
Temperature (VOUT=VCC)
Figure 10. Low Level Sink Current vs
Output Voltage (VCC=5V)
1010
80
Low Level Sink Current [µA]
Low Level Sink Current [mA]
1
125°C
25°C
85°C
-1
100
-40°C
100-2
36V
60
5V
3V
40
20
0
0
0.25
0.5
0.75
1
-50
-25
Output Voltage [V]
0
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 12. Low Level Sink Current vs Ambient
Temperature (VOUT=200mV)
Figure 11. Low Level Sink Current vs
Output Voltage (Enlarged view)
(VCC=5V)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
4
4
3
3
2
2
Input Offset Voltage [V]
Input Offset Voltage [mV]
○LM358xxx, LM2904xxx
1
85°C
125°C
0
-1
25°C
-40°C
-2
1
36V
0
-1
5V
3V
-2
-3
-3
-4
-4
0
10
20
30
-50
40
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 13. Input Offset Voltage vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
Figure 14. Input Offset Voltage vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
100
50
90
80
-40°C
Input Bias Current [nA]
Input Bias Current [nA]
40
30
25°C
20
85°C
70
60
50
40
3V
30
5V
20
10
125°C
36V
10
0
0
0
10
20
30
40
-50
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 16. Input Bias Current vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
Figure 15. Input Bias Current vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM358xxx, LM2904xxx
100
4
90
3
2
Input Offset Voltage [mV]
Input Bias Current [nA]
80
70
60
50
40
30
1
0
-1
25°C
-40°C
-2
20
-3
10
0
-50
-25
0
25
50
75
100
125
-4
150
-1
1
2
3
4
Common-mode Input Voltage [V]
Figure 17. Input Bias Current vs Ambient
Temperature (VCC=30V, VICM=28V, EK=-1.4V)
Figure 18. Input Offset Voltage vs
Common-mode Input Voltage (VCC=5V)
10
10
8
8
6
6
4
0
Ambient Temperature [°C]
-40°C
85°C
Input Offset Current [nA]
Input Offset Current [nA]
125°C
85°C
125°C
2
0
-2
25°C
-4
4
2
5V
36V
0
3V
-2
-4
-6
-6
-8
-8
-10
5
-10
0
10
20
30
40
-50
-25
Supply Voltage [V]
0
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 20. Input Offset Current vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
Figure 19. Input Offset Current vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
0.6
0.6
0.5
0.5
125°C
85°C
0.4
Slew Rate Fall [V/us]
0.3
-40°C
0.2
25°C
85°C
0.3
25°C
0.1
0.0
0.0
10
20
30
0
40
10
20
30
40
Supply Voltage [V]
Supply Voltage [V]
Figure 21. Slew Rate Rise vs Supply Voltage
(RL=2kΩ, Low to High)
Figure 22. Slew Rate Fall vs Supply Voltage
(RL=2kΩ, High to Low)
100
80
80
240
Phase
60
Voltage Gain [dB]
Input Referred Noise Voltage [nV/√Hz]
-40°C
0.2
0.1
0
125°C
0.4
60
40
180
Gain
40
120
20
20
0
101
102
103
104
60
0
0
2
10
Frequency [Hz]
Figure 23. Input Referred Noise Voltage vs
Frequency (VCC=5V)
Phase [deg]
Slew Rate Rise [V/us]
○LM358xxx, LM2904xxx
3
10
4
5
6
10
10
10
Frequency [Hz]
10
7
10
8
Figure 24. Voltage Gain, Phase vs Frequency
(VCC=30V, RL=2kΩ, CL=100pF)
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM358xxx, LM2904xxx
140
Large Signal Voltage Gain [dB]
Large Signal Voltage Gain [dB]
140
85°C
120
25°C
125°C
100
-40°C
80
36V
120
5V
100
3V
80
60
60
0
10
20
30
40
-50
-25
25
50
75
100
125
150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 25. Large Signal Voltage Gain vs
Supply Voltage (RL=2kΩ)
Figure 26. Large Signal Voltage Gain vs
Ambient Temperature (RL=2kΩ)
120
100
Common-mode Rejection Ratio [dB]
120
Common-mode Rejection Ratio [dB]
0
-40°C
25°C
80
85°C
125°C
60
100
36V
80
5V
3V
60
40
40
0
10
20
30
-50
40
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 27. Common-mode Rejection Ratio vs
Supply Voltage
Figure 28. Common-mode Rejection Ratio vs
Ambient Temperature
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM358xxx, LM2904xxx
Power Supply Rejection Ratio [dB]
140
120
100
80
60
-50
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Figure 29. Power Supply Rejection Ratio vs
Ambient Temperature
(*) The above data are measurement value of typical sample, they are not guaranteed.
LM358xxx: -40°C to +85°C
LM2904xxx: -40°C to 125°C
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM324F
2.0
2.0
25°C
1.6
36V
1.6
Supply Current [mA]
Supply Current [mA]
85°C
1.2
-40°C
0.8
3V
0.8
0.4
0.4
0.0
0.0
0
10
20
30
5V
1.2
-50
40
-25
25
50
75
100
Ambient Temperature [°C]
Supply Voltage [V]
Figure 30. Supply Current vs Supply Voltage
Figure 31. Supply Current vs Ambient
Temperature
5
30
Maximum Output Voltage High [V]
40
Maximum Output Voltage High [V]
0
85°C
25°C
20
-40°C
10
0
4
3
2
1
0
0
10
20
30
40
-50
-25
0
25
50
75
100 125 150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 33. Maximum Output Voltage (High) vs
Ambient Temperature (VCC=5V, RL=10kΩ)
Figure 32. Maximum Output Voltage (High) vs
Supply Voltage (RL=10kΩ)
(*) The above data are measurement value of typical sample, they are not guaranteed.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
5.0
50
4.0
40
Output Source Current [mA]
Maximum Output Voltage High [V]
○LM324F
3.0
2.0
1.0
-40°C
25°C
30
20
10
0.0
-50
-25
0
25
50
75
85°C
0
100
0
1
Ambient Temperature [°C]
4
5
Figure 35. Output Source Current vs Output
Voltage (VCC=5V)
50
50
40
40
Output Sink Current [mA]
Output Source Current [mA]
3
Output Voltage [V]
Figure 34. Maximum Output Voltage (High) vs
Ambient Temperature (VCC=5V, RL=2kΩ)
30
5V
36
2
3V
20
10
25°C
30
85°C
20
-40°C
10
0
0
-50
-25
0
25
50
75
100
0
1
2
3
4
5
Output Voltage [V]
Ambient Temperature [°C]
Figure 36. Output Source Current vs Ambient
Temperature (VOUT=0V)
Figure 37. Output Sink Current vs Output
Voltage (VCC=5V)
(*) The above data are measurement value of typical sample, they are not guaranteed.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM324F
102
50
36V
30
101
Low Level Sink Current [mA]
Output Sink Current [mA]
40
5V
20
3V
10
85°C
100
25°C
10-1
-40°C
10-2
10-3
0
-50
-25
0
25
50
75
100
0
0.5
1.5
2
Output Voltage [V]
Ambient Temperature [°C]
Figure 39. Low Level Sink Current vs
Output Voltage (VCC=5V)
Figure 38. Output Sink Current vs Ambient
Temperature (VOUT=VCC)
100
80
Low Level Sink Current [µA]
Low Level Sink Current [mA]
1
25°C
85°C
-1
10
-40°C
60
36V
40
5V
20
3V
10-2
0
0.25
0.5
0.75
0
-50
1
-25
Output Voltage [V]
0
25
50
75
100
Ambient Temperature [°C]
Figure 41. Low Level Sink Current vs Ambient
Temperature (VOUT=200mV)
Figure 40. Low Level Sink Current vs
Output Voltage (Enlarged view)
(VCC=5V)
(*) The above data are measurement value of typical sample, they are not guaranteed.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM324F
4
4
3
3
2
2
Input Offset Voltage [mV]
Input Offset Voltage [mV]
1
85°C
0
-1
25°C
-40°C
-2
-3
1
36V
0
-1
3V
5V
-2
-3
-4
-4
0
10
20
30
40
-50
-25
Supply Voltage [V]
0
25
50
75
100
Ambient Temperature [°C]
Figure 42. Input Offset Voltage vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
Figure 43. Input Offset Voltage vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
50
100
90
80
-40°C
Input Bias Current [nA]
Input Bias Current [nA]
40
30
25°C
20
85°C
10
70
60
50
40
3V
5V
30
20
36V
10
0
0
10
20
30
40
0
-50
-25
0
25
50
75
Supply Voltage [V]
Ambient Temperature [°C]
Figure 44. Input Bias Current vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
Figure 45. Input Bias Current vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
100
(*) The above data are measurement value of typical sample, they are not guaranteed.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM324F
100
4
90
3
Input Offset Voltage [mV]
Input Bias Current [nA]
80
70
60
50
40
30
20
1
85°C
0
-1
25°C
-40°C
-2
-3
10
-4
0
-50
-25
0
25
50
75
-1
100
1
2
3
4
5
Common-mode Input Voltage [V]
Figure 46. Input Bias Current vs Ambient
Temperature (VCC=30V, VICM=28V, EK=-1.4V)
Figure 47. Input Offset Voltage vs
Common-mode Input Voltage (VCC=5V)
10
10
8
8
6
6
4
0
Ambient Temperature [°C]
-40°C
Input Offset Current [nA]
Input Offset Current [nA]
2
85°C
2
0
-2
25°C
-4
4
2
5V
36V
0
3V
-2
-4
-6
-6
-8
-8
-10
-10
0
10
20
30
-50
40
-25
Supply Voltage [V]
0
25
50
75
100
Ambient Temperature [°C]
Figure 49. Input Offset Current vs Ambient
Temperature (VICM=VCC/2, EK=-VCC/2)
Figure 48. Input Offset Current vs Supply
Voltage (VICM=VCC/2, EK=-VCC/2)
(*) The above data are measurement value of typical sample, they are not guaranteed.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
0.6
0.6
0.5
0.5
Slew Rate Fall [V/us]
Slew Rate Rise [V/us]
○LM324F
85°C
0.4
0.3
-40°C
0.2
25°C
0.1
0.4
85°C
0.3
25°C
-40°C
0.2
0.1
0.0
0.0
0
10
20
30
40
0
10
20
30
40
Supply Voltage [V]
Supply Voltage [V]
Figure 50. Slew Rate Rise vs Supply Voltage
(RL=2kΩ, Low to High)
Figure 51. Slew Rate Fall vs Supply Voltage
(RL=2kΩ, High to Low)
80
80
240
Phase
60
40
180
Gain
40
120
20
20
0
60
0
101
102
103
104
0
2
10
Frequency [Hz]
Figure 52. Input Referred Noise Voltage vs
Frequency (VCC=5V)
Phase [deg]
60
Voltage Gain [dB]
Input Referred Noise Voltage [nV/√Hz]
100
3
10
4
5
6
10
10
10
Frequency [Hz]
10
7
10
8
Figure 53. Voltage Gain, Phase vs Frequency
(VCC=30V, RL=2kΩ, CL=100pF)
(*) The above data are measurement value of typical sample, they are not guaranteed.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM324F
140
Large Signal Voltage Gain [dB]
Large Signal Voltage Gain [dB]
140
85°C
120
25°C
125°C
100
-40°C
80
60
36V
120
5V
100
3V
80
60
0
10
20
30
40
-50
-25
0
Supply Voltage [V]
50
75
100
125
150
Ambient Temperature [°C]
Figure 54. Large Signal Voltage Gain vs
Supply Voltage (RL=2kΩ)
Figure 55. Large Signal Voltage Gain vs
Ambient Temperature (RL=2kΩ)
120
100
Common-mode Rejection Ratio [dB]
120
Common-mode Rejection Ratio [dB]
25
-40°C
25°C
80
85°C
125°C
60
100
36V
80
5V
3V
60
40
40
0
10
20
30
-50
40
-25
0
25
50
75
100
125
150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 57. Common-mode Rejection Ratio vs
Ambient Temperature
Figure 56. Common-mode Rejection Ratio vs
Supply Voltage
(*) The above data are measurement value of typical sample, they are not guaranteed.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Typical Performance Curves - continued
○LM324F
Power Supply Rejection Ratio [dB]
140
120
100
80
60
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
Figure 58. Power Supply Rejection Ratio vs
Ambient Temperature
(*) The above data are measurement value of typical sample, they are not guaranteed.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Application Information
NULL method condition for Test Circuit 1
VCC, VEE, EK, VICM Unit: V
Parameter
VF
SW1
SW2
SW3
VCC
VEE
EK
VICM
Calculation
Input Offset Voltage
VF1
ON
ON
OFF
5 to 30
0
-1.4
0
1
Input Offset Current
VF2
OFF
OFF
OFF
5
0
-1.4
0
2
VF3
OFF
ON
OFF
5
0
-1.4
0
3
VF4
ON
OFF
ON
ON
ON
15
0
0
4
Input Bias Current
-1.4
VF5
Large Signal Voltage Gain
VF6
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
-11.4
0
VF7
ON
ON
OFF
5
0
-1.4
VF8
5
3.5
VF9
5
Power Supply Rejection Ratio
ON
ON
OFF
0
VF10
-1.4
0
6
30
- Calculation 1. Input Offset Voltage (VIO)
VIO =
|VF1|
|VF2 - VF1|
2. Input Offset Current (IIO)
IIO =
3. Input Bias Current (IB)
IB =
4. Large Signal Voltage Gain (AV)
Av = 20Log
5. Common-mode Rejection Ratio (CMRR)
RI x (1 + RF/RS)
[A]
|VF4 - VF3|
[A]
2 x RI x (1 + RF/RS)
EK × (1+RF/RS)
|VF6 - VF5|
CMRR = 20Log
6. Power Supply Rejection Ratio (PSRR)
[V]
1 + RF/RS
PSRR = 20Log
[dB]
VICM × (1+RF/RS)
|VF8 - VF7|
VCC × (1+ RF/RS)
|VF10 - VF9|
[dB]
[dB]
0.1μF
RF=50kΩ
SW1
RS=50Ω
500kΩ
VCC
RI=10kΩ
VOUT
0.1μF
15V
EK
500kΩ
DUT
SW3
RS=50Ω
1000pF
RI=10kΩ
RL
VICM
50kΩ
NULL
V VF
SW2
-15V
VEE
Figure 59. Test Circuit 1 (One Channel Only)
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LM358xxx
LM324F
Datasheet
LM2904xxx
Application Information – continued
Switch Condition for Test Circuit 2
SW No.
SW1
SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13
Supply Current
OFF
OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage(High)
OFF
OFF
ON
OFF OFF
ON
OFF OFF
OFF OFF
ON
OFF
Maximum Output Voltage(Low)
OFF
OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF
ON
OFF
Output Source Current
OFF
OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF
ON
Output Sink Current
OFF
OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF
ON
Slew Rate
OFF
OFF OFF
ON
ON
ON
OFF OFF OFF
Gain Bandwidth Product
OFF
ON
OFF OFF
ON
ON
OFF OFF
ON
ON
OFF OFF OFF
Input Referred Noise Voltage
ON
OFF OFF OFF
ON
ON
OFF OFF OFF OFF
ON
OFF OFF OFF
ON
ON
OFF OFF
SW4
R2
SW5
●
VCC
-
SW1
SW2
SW3
+
SW6
RS
SW7
SW9
SW8
SW10
SW11
SW12
SW13
R1
VEE
C
V-IN
RL
V+IN
CL
VOUT
Figure 60. Test Circuit 2 (Each Op-Amp)
Output Voltage
Input Voltage
SR=V/t
VH
VH
90%
V
10%
VL
VL
t
t
t
Input Wave
Output Wave
Figure 61. Slew Rate Input and Output Wave
VCC
VCC
R1//R2
R1// R2
VEE
VEE
R1
VIN
R2
V
VOUT1
= 1VRMS
R1
CS = 20 × log
R2
V
VOUT2
100 × VOUT1
VOUT2
Figure 62. Test Circuit 3 (Channel Separation)
(R1=1kΩ,R2=100kΩ)
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LM358xxx
LM324F
Datasheet
LM2904xxx
Application Information – continued
1.
Unused Circuits
It is recommended to apply the connection (see Figure 63) and set the
non-inverting input pin at a potential within the Input Common-mode
Voltage Range (VICM) for any unused circuit.
Keep this potential
2.
Input Voltage
Regardless of the supply voltage, applying VEE+36V to the input pin is
possible without causing deterioration of the electrical characteristics or
destruction. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input
voltage is within the common mode input voltage range of the electric
characteristics.
in VICM
VCC
VICM
VEE
Figure 63. The Example of Application
Circuit for Unused Op-amp
3.
Power Supply (Single/Dual)
The operational amplifiers operate when the voltage supplied is between VCC pin and VEE pin. Therefore, the single
supply operational amplifiers can be used as dual supply operational amplifiers as well.
4.
IC Handling
When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to
the piezo effect. Be careful with the warp on the printed circuit board.
5.
The IC Destruction Caused by Capacitive Load
The IC may be damaged when VCC pin and VEE pin is shorted with the charged output pin capacitor. When IC is used
as an operational amplifier or as an application circuit where oscillation is not activated by an output capacitor, output
capacitor must be kept below 0.1µF in order to prevent the damage mentioned above.
I/O Equivalent Circuit
Symbol
Pin Nos.
+IN
-IN
LM358xxx, LM2904xxx: 2,3,5,6
LM324F: 2,3,5,6,9,10,12,13
Equivalent Circuit
VCC
OUT
LM358xxx, LM2904xxx: 1,7
LM324F: 1,7,8,14
OUT
VEE
VCC
VCC
LM358xxx, LM2904xxx: 8
LM324F: 4
VEE
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LM358xxx
LM324F
Datasheet
LM2904xxx
Examples of Circuit
○Voltage Follower
Voltage gain is 0dB.
VCC
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage (VOUT) due to high input
impedance and low output impedance. Computation for
output voltage (VOUT) is shown below.
VOUT
VIN
VOUT=VIN
VEE
Figure 64. Voltage Follower Circuit
○Inverting Amplifier
R2
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
VCC
R1
VIN
VOUT
VOUT=-(R2/R1)・VIN
This circuit has input impedance equal to R1.
R1//R2
VEE
Figure 65. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
For non-inverting amplifier, input voltage (VIN) is
amplified by a voltage gain, which depends on the ratio
of R1 and R2. The output voltage (VOUT) is in-phase with
the input voltage (VIN) and is shown in the next
expression.
VCC
VOUT
VIN
VOUT=(1 + R2/R1)・VIN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
VEE
Figure 66. Non-inverting Amplifier Circuit
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LM358xxx
LM324F
Datasheet
LM2904xxx
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to rise above the ambient temperature. The allowable temperature that
the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal
resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 67(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (Tjmax), and power dissipation
(PD).
θJA = (Tjmax-TA) / PD °C/W
The Derating Curve in Figure 67(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance
(θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity,
etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figures 67(c) to (e) show the examples of derating curves for LM358xxx, LM2904xxx,
LM324F respectively.
Power Dissipation of LSI [W]
PDmax
Power dissipation of IC
θJA=(Tjmax-TA)/ PD °C/W
Ambient Temperature, TA [ °C ]
P2
θJA2 < θJA1
θJA2
P1
Tjmax
θJA1
0
Chip Surface Temperature, TJ [ °C ]
25
50
75
100
125
150
Ambient Temperature, TA [ °C ]
(b) Derating Curve
(a) Thermal Resistance
1.0
1.0
0.8
LM358F
0.8
(Note 16)
Power Dissipation [W]
Power Dissipation [W]
(Note 18)
LM358FJ (Note 17)
0.6
LM358FVT (Note 18)
LM358FV (Note 18)
0.4
(Note 19)
LM358FVJ
LM358FVM (Note 19)
0.2
LM2904FVT
LM2904FV (Note 18)
0.6
LM2904F (Note 16)
LM2904FJ (Note 17)
0.4
LM2904FVJ(Note 19)
LM2904FVM (Note 19)
0.2
0.0
0
25
50
75 85 100
125
Ambient Temperature [°C]
0.0
150
(c) LM358xxx
25
50
75 85 100
125
Ambient Temperature [°C]
150
(d) LM2904xxx
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LM358xxx
LM324F
Datasheet
LM2904xxx
1.0
Power Dissipation [W]
0.8
0.6
LM324F (Note 19)
0.4
0.2
0.0
0
25
85
50
75
100
125
Ambient Temperature [°C]
150
(e) LM324F
Note 16
Note 17
Note 18
Note 19
Note 20
Unit
5.5
5.4
5.0
4.7
4.5
mW/°C
When using the unit above TA=25°C, subtract the value above per Celsius degree.
Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted.
Figure 67. Thermal Resistance and Derating Curve
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LM358xxx
LM324F
Datasheet
LM2904xxx
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the PD rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
In-rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Operational Notes – continued
11.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 68. Example of monolithic IC structure
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LM358xxx
LM324F
Datasheet
LM2904xxx
Physical Dimensions, Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Physical Dimensions, Tape and Reel Information – continued
Package Name
SOP-J8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Physical Dimensions, Tape and Reel Information – continued
Package Name
SSOP-B8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Physical Dimensions, Tape and Reel Information – continued
Package Name
TSSOP-B8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Physical Dimensions, Tape and Reel Information – continued
Package Name
TSSOP-B8J
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Physical Dimensions, Tape and Reel Information – continued
Package Name
MSOP8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
Direction of feed
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Physical Dimensions, Tape and Reel Information – continued
Package Name
SOP14
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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LM358xxx
LM324F
Datasheet
LM2904xxx
Ordering Information
L
M
x
x
x
Part Number
LM358F
LM358FJ
LM358FV
LM358FVT
LM358FVJ
LM358FVM
LM324F
LM2904F
LM2904FJ
LM2904FV
LM2904FVT
LM2904FVJ
LM2904FVM
x
x
x
-
x
Package
: SOP8
F
: SOP14
: SOP-J8
FJ
: SSOP-B8
FV
: TSSOP-B8
FVT
: TSSOP-B8J
FVJ
: MSOP8
FVM
x
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP-J8/SSOP-B8/
TSSOP-B8/ SOP14)
TR: Embossed tape and reel
(MSOP8)
Line-up
Operating Temperature Range
Channel
-40°C to +85°C
2ch
4ch
-40°C to +125°C
2ch
Package
Reel of 2500
LM358F-E2
SOP-J8
Reel of 2500
LM358FJ-E2
SSOP-B8
Reel of 2500
LM358FV-E2
TSSOP-B8
Reel of 3000
LM358FVT-E2
TSSOP-B8J
Reel of 2500
LM358FVJ-E2
LM358FVM-GTR
MSOP8
Reel of 3000
SOP14
Reel of 2500
LM324F-E2
SOP8
Reel of 2500
LM2904F-E2
SOP-J8
Reel of 2500
LM2904FJ-E2
SSOP-B8
Reel of 2500
LM2904FV-E2
TSSOP-B8
Reel of 3000
LM2904FVT-E2
TSSOP-B8J
Reel of 2500
LM2904FVJ-E2
MSOP8
Reel of 3000
LM2904FVM-GTR
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SOP8
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LM358xxx
LM324F
Datasheet
LM2904xxx
Marking Diagram
SOP8(TOP VIEW)
TSSOP-B8(TOP VIEW)
SOP-J8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
SOP14(TOP VIEW)
1PIN MARK
TSSOP-B8J(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
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LM358xxx
LM324F
Datasheet
LM2904xxx
Marking Diagram – continued
Product Name
Package Type
LM358
Marking
F
SOP8
FJ
SOP-J8
FV
SSOP-B8
FVT
TSSOP-B8
FVJ
TSSOP-B8J
FVM
MSOP8
F
SOP14
LM324F
F
SOP8
2904L
FJ
SOP-J8
2904L
FV
SSOP-B8
04L
FVT
TSSOP-B8
2904L
FVJ
TSSOP-B8J
2904L
FVM
MSOP8
2904L
LM324
LM2904
358L
Land Pattern Data
SOP8, SOP-J8, SSOP-B8, TSSOP-B8, SOP14, TSSOP-B8J, MSOP8
b2
e
MIE
ℓ2
All dimensions in mm
Package
SOP8
SOP14
Land pitch
e
Land space
MIE
Land length
≧ℓ2
Land width
b2
1.27
4.60
1.10
0.76
SOP-J8
1.27
3.9
1.35
0.76
SSOP-B8
0.65
4.60
1.20
0.35
TSSOP-B8
0.65
4.60
1.20
0.35
TSSOP-B8J
0.65
3.20
1.15
0.35
MSOP8
0.65
2.62
0.99
0.35
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LM358xxx
LM324F
Datasheet
LM2904xxx
Revision History
Date
Revision
Changes
10.Jul.2015
001
New Release
09.Oct.2015
002
LM358FJ, LM358FV, LM358FVT, and LM324F are added
10.Feb.2016
003
LM2904xxx (F, FJ, FV, FVT, FVM, FVJ), and LM358xxx (FVM, FVJ) are added
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001