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Datasheet
Operational Amplifiers Series
Input/Output Full Swing
High Slew Rate
Low Voltage CMOS Operational Amplifiers
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Key Specifications
 Low Operating Supply Voltage (single supply):
+2.4V to +5.5V
 High Slew Rate:
3.0V/µs
 Wide Temperature Range:
BU7291G/BU7294xx
-40C to +85C
BU7291SG/BU7294Sxx
-40C to +105C
 Low Input Offset Current:
1pA (Typ)
 Low Input Bias Current:
1pA (Typ)
●General Description
BU7291G/BU7294xx and BU7291SG/BU7294Sxx
are low supply voltage CMOS operational single/quad
Amplifiers. This series is a Input/Output full swing, high
slew rate, low supply current and high speed operation.
Input bias current is very low at 1pA (Typ) .
Especially,BU7291SG and BU7294Sxx, it has wide
temperature range from -40C to +105C.
●Features
 High slew rate
 Input/Output full swing
 Large DC voltage gain
 Low input bias current
●Package
SSOP5
SOP14
SSOP-B14
W(Typ) x D(Typ) x H(Max)
2.90mm x 2.80mm x 1.25mm
8.70mm x 6.20mm x 1.71mm
5.00mm x 6.40mm x 1.35mm
●Application
 Battery equipment
 Consumer electronics
●Simplified schematic
VDD
Vbias
+IN
Class
AB control
OUT
-IN
Vbias
VSS
Figure 1. Simplified schematic (1 channel only)
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays.
1/27
TSZ02201-0RAR1G200390-1-2
22.May.2013 Rev.001
Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Pin Configuration
BU7291G, BU7291SG : SSOP5
+IN
1
VSS
2
-IN
Pin No.
Pin Name
1
+IN
2
VSS
3
-IN
4
OUT
5
VDD
14 OUT4
Pin No.
Pin Name
13 -IN4
1
OUT1
-IN1
+IN1
VDD
5
+
4 OUT
3
BU7294F, BU7294SF : SOP14
BU7294FV, BU7294SFV : SSOP-B14
OUT1 1
-IN1
2
CH1
CH4
- +
+ -
+IN1
3
12 +IN4
2
VDD
4
11 VSS
3
+IN2
5
-IN2
6
10 +IN3
- +
+ -
CH3
CH2
9 -IN3
OUT2 7
8 OUT3
4
VDD
5
+IN2
6
-IN2
7
OUT2
8
OUT3
9
-IN3
10
+IN3
11
VSS
12
+IN4
13
-IN4
14
OUT4
SSOP5
Package
SOP14
SSOP-B14
BU7291G
BU7291SG
BU7294F
BU7294SF
BU7294FV
BU7294SFV
●Ordering Information
B
U
7
2
9
Part Number
BU7291G
BU7291SG
BU7294xx
BU7294Sxx
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x
x
x
x
-
xx
Packaging and forming specification
E2: Embossed tape and reel
(SOP14/ SSOP-B14)
TR: Embossed tape and reel
(SSOP5)
Package
G:SSOP5
F:SOP14
FV:SSOP-B14
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TSZ02201-0RAR1G200390-1-2
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Line-up
Topr
Package
Operable Part Number
-40C to +85C
SSOP5
Reel of 3000
BU7291G-TR
-40C to +105C
SSOP5
Reel of 3000
BU7291SG-TR
-40C to +85C
SOP14
Reel of 2500
BU7294F-E2
-40C to +105C
SOP14
Reel of 2500
BU7294SF-E2
-40C to +85C
SSOP-B14
Reel of 2500
BU7294FV-E2
-40C to +105C
SSOP-B14
Reel of 2500
BU7294SFV-E2
●Absolute Maximum Ratings(Ta=25C)
Ratings
Parameter
Symbol
Supply Voltage
Power dissipation
BU7291
BU7294
VDD-VSS
Pd
BU7291S
BU7294S
+7
Unit
V
*1*4
SSOP5
0.54
SOP14
0.45*2*4
SSOP-B14
0.70*3*4
W
Differential Input Voltage*5
Input Common-mode
Voltage Range
Input Current *6
Vid
VDD - VSS
V
Vicm
(VSS - 0.3) to VDD + 0.3
V
Ii
±10
mA
Operating Supply Voltage
Vopr
+2.4 to +5.5
V
Operating Temperature
Topr
Storage Temperature
Maximum
Junction Temperature
Tstg
- 55 to +125
C
Tjmax
+125
C
- 40 to +85
- 40 to +105
C
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or use out absolute maximum rated
temperature environment may cause deterioration of characteristics.
*1
To use at temperature above Ta＝25C reduce 5.4mW.
*2
To use at temperature above Ta＝25C reduce 4.5mW.
*3
To use at temperature above Ta＝25C reduce 7.0mW.
*4
Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*5
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input pin voltage is set to more than VSS.
*6
An excessive input current will flow when input voltages of more than VDD+0.6V or lesser than VSS-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
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TSZ02201-0RAR1G200390-1-2
22.May.2013 Rev.001
Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Electrical Characteristics
○BU7291, BU7291S (Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C)
Limits
Temperature
Parameter
Symbol
Range
Min.
Typ.
Max.
Unit
Condition
Input Offset Voltage *7
Vio
25C
-
1
9
mV
-
Input Offset Current*7
Iio
25C
-
1
-
pA
-
Input Bias Current *7
Ib
25C
-
1
-
pA
-
25C
-
470
800
Full range
-
-
1100
μA
RL=∞
Av=0dB, +IN=1.5V
-
V
RL=10kΩ
-
VSS+0.1
V
RL=10kΩ
70
105
-
dB
RL=10kΩ
25C
0
-
3
V
VSS to VDD
CMRR
25C
40
60
-
dB
-
Power Supply Rejection Ratio
PSRR
25C
45
80
-
dB
-
Output Source Current *9
Isource
25C
5
8
-
mA
VDD-0.4V
Isink
25C
9
16
-
mA
VSS+0.4V
SR
25C
-
3.0
-
V/μs
CL=25pF
GBW
25C
-
2.8
-
MHz
CL=25pF, f=100kHz
Unity Gain Frequency
fT
25C
-
2.8
-
MHz
CL=25pF
Phase Margin
θ
25C
-
50
-
deg
CL=25pF
THD+N
25C
-
0.03
-
%
Supply Current*8
IDD
Maximum Output Voltage(High)
VOH
25C
VDD-0.1
-
Maximum Output Voltage(Low)
VOL
25C
-
Av
25C
Vicm
Common-mode Rejection Ratio
Large Signal Voltage Gain
Input Common-mode
Voltage Range
Output Sink Current *9
Slew Rate
Gain Band Width
Total Harmonic Distortion
+Noise
*7
*8
*9
OUT=0.8VP-P, f=1kHz
Absolute value
Full range BU7291: Ta=-40C to +85C BU7291S: Ta=-40C to +105C
Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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TSZ02201-0RAR1G200390-1-2
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
○BU7294, BU7294S (Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C)
Limits
Temperature
Parameter
Symbol
Range
Min.
Typ.
Max.
Unit
Condition
Input Offset Voltage *10
Vio
25C
-
1
9
mV
-
Input Offset Current*10
Iio
25C
-
1
-
pA
-
Input Bias Current *10
Ib
25C
-
1
-
pA
-
25C
-
2000
3200
Full range
-
-
4400
VOH
25C
VDD-0.1
-
VOL
25C
-
Av
25C
Vicm
Common-mode Rejection Ratio
μA
RL=∞, All Op-Amps
Av=0dB, +IN=1.5V
-
V
RL=10kΩ
-
VSS+0.1
V
RL=10kΩ
70
105
-
dB
RL=10kΩ
25C
0
-
3
V
VSS to VDD
CMRR
25C
40
60
-
dB
-
Power Supply Rejection Ratio
PSRR
25C
45
80
-
dB
-
Output Source Current *12
Isource
25C
5
8
-
mA
VDD-0.4V
Isink
25C
9
16
-
mA
VSS+0.4V
SR
25C
-
3.0
-
V/μs
CL=25pF
GBW
25C
-
2.8
-
MHz
CL=25pF, f=100kHz
Unity Gain Frequency
fT
25C
-
2.8
-
MHz
CL=25pF
Phase Margin
θ
25C
-
50
-
deg
CL=25pF
THD+N
25C
-
0.03
-
%
OUT=0.8VP-P, f=1kHz
CS
25C
-
100
-
dB
f=1kHz, OUT=0.5Vrms
Supply Current*11
IDD
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Large Signal Voltage Gain
Input Common-mode
Voltage Range
Output Sink Current *12
Slew Rate
Gain Band Width
Total Harmonic Distortion
+Noise
Channel Separation
*10
*11
*12
Absolute value
Full range BU7294: Ta=-40C to +85C BU7294S: Ta=-40C to +105C
Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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TSZ02201-0RAR1G200390-1-2
22.May.2013 Rev.001
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
Datasheet
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
1.1 Supply Voltage (VDD/VSS)
Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without
deterioration or destruction of characteristics of internal circuit.
1.2 Differential Input Voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
1.3 Input Common-mode Voltage Range (Vicm)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25C
(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
2.1 Input Offset Voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
2.2 Input Offset Current (Iio)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
2.3 Input Bias Current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
2.4 Supply Current (IDD)
Indicates the current that flows within the IC under specified no-load conditions.
2.5 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
2.6 Large Signal Voltage Gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential Input voltage)
2.7 Input Common-mode Voltage Range (Vicm)
Indicates the input voltage range where IC normally operates.
2.8 Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.9 Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.10 Output Source Current/ Output Sink Current (Isource / Isink)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
2.11 Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
2.12 Gain Band Width (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
2.13 Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
2.14 Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
2.16 Total Harmonic Distortion+Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.12 Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
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TSZ02201-0RAR1G200390-1-2
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves
○BU7291, BU7291S
800
0.8
POWER DISSIPATION [W] .
POWER DISSIPATION [W] .
800
0.8
0.6
600
BU7291G
400
0.4
200
0.2
0
0
85
25
50
75
AMBIENT TEMPERATURE [°C]
0.6
600
BU7291SG
400
0.4
0.2
200
0
100
0
125
Figure 3.
Derating curve
1200
1200
1000
1000
SUPPLY CURRENT [μA]
SUPPLY CURRENT [μA]
Figure 2.
Derating curve
105
25
50
75
100
AMBIENT TEMPERATURE [°C]
800
105C
85C
600
400
-40C
25C
200
800
5.5V
600
3.0V
400
2.4V
200
0
0
2
3
4
5
SUPPLY VOLTAGE [V]
6
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 5.
Supply Current – Ambient Temperature
Figure 4.
Supply Current – Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7291G: -40C to +85C
BU7291SG: -40C to +105C
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TSZ02201-0RAR1G200390-1-2
22.May.2013 Rev.001
Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7291, BU7291S
6
6
5
OUTPUT VOLTAGE HIGH [V]
OUTPUT VOLTAGE HIGH [V]
105C
5
85C
4
25C
3
-40C
2
1
5.5V
4
3.0V
3
2.4V
2
1
0
0
1
2
3
4
5
SUPPLY VOLTAGE [V]
6
-50
Figure 6.
Maximum Output Voltage High – Supply Voltage
(RL=10kΩ)
125
Figure 7.
Maximum Output Voltage High – Ambient
Temperature
(RL=10kΩ)
10
OUTPUT VOLTAGE LOW [mV]
10
OUTPUT VOLTAGE LOW [mV]
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
8
6
85C
-40C
105C
25C
4
2
0
8
6
5.5V
4
2
2.4V
3.0V
0
2
3
4
5
SUPPLY VOLTAGE [V]
6
-50
Figure 8.
Maximum Output Voltage Low Supply Voltage
(RL=10kΩ)
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 9.
Maximum Output Voltage Low –
Ambient Temperature
(RL=10kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7291G: -40C to +85C
BU7291SG: -40C to +105C
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TSZ02201-0RAR1G200390-1-2
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7291, BU7291S
20
OUTPUT SOURCE CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
50
40
-40C
25C
30
20
85C
105C
10
5.5V
15
3.0V
10
2.4V
5
0
0
0
0.5
1
1.5
2
2.5
-50
3
0
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
OUTPUT VOLTAGE [V]
Figure 10.
Output Source Current – Output Voltage
(VDD=3V)
Figure 11.
Output Source Current – Ambient Temperature
(OUT=VDD-0.4V)
80
80
OUTPUT SINK CURRENT [mA]
-40C
OUTPUT SINK CURRENT [mA]
-25
60
25C
40
85C
105C
20
60
5.5V
40
3.0V
20
2.4V
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50
OUTPUT VOLTAGE [V]
-25
0
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
Figure 12.
Output Sink Current – Output Voltage
(VDD=3V)
Figure 13.
Output Sink Current – Ambient Temperature
(OUT=VSS+0.4V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7291G: -40C to +85C
BU7291SG: -40C to +105C
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TSZ02201-0RAR1G200390-1-2
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7291, BU7291S
5
5
4
4
25C
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
-40C
3
2
1
85C
105C
0
-1
-2
-3
-4
2
5.5V
1
0
3.0V
-1
2.4V
-2
-3
-4
-5
-5
2
3
4
5
6
SUPPLY VOLTAGE [V]
-50
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
Figure 14.
Input Offset Voltage – Supply Voltage
(Vicm=VDD, OUT=1.5V)
Figure 15.
Input Offset Voltage – Ambient Temperature
(Vicm=VDD, OUT=1.5V)
15
125
160
LARGE SIGNAL VOLTAGE GAIN [dB] .
INPUT OFFSET VOLTAGE [mV]
3
10
-40C
85C
5
0
105C
25C
-5
-10
-15
140
105C
85C
120
25C
100
-40C
80
60
-1
0
1
2
3
4
COMMON MODE INPUT VOLTAGE [V]
2
Figure 16.
Input Offset Voltage –
Common Mode Input Voltage
(VDD=3V)
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 17.
Large Signal Voltage Gain – Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7291G: -40C to +85C
BU7291SG: -40C to +105C
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TSZ02201-0RAR1G200390-1-2
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7291, BU7291S
COMMON MODE REJECTION
REJECTION RATIO
RATIO [dB]
[dB]
LARGE SIGNAL VOLTAGE GAIN [dB] .
160
140
5.5V
120
2.4V
100
3.0V
80
60
120
100
105C
60
-40C
25C
40
20
0
-50
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
2
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 19.
Common Mode Rejection Ratio – Supply Voltage
Figure 18.
Large Signal Voltage Gain – Ambient Temperature
140
120
POWER SUPPLY REJECTION RATIO [dB]
COMMON MODE REJECTION RATIO [dB] .
85C
80
120
100
100
5.5V
80
60
2.4V
3.0V
40
20
0
-50
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
80
60
40
20
0
-50
Figure 20.
Common Mode Rejection Ratio – Ambient Temperature
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 21.
Power Supply Rejection Ratio – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7291G: -40C to +85C
BU7291SG: -40C to +105C
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7291, BU7291S
5
5
4
4
SLEW RATE H-L [V/μs]
SLEW RATE L-H [V/μs]
5.5V
5.5V
3
2.4V
2
3.0V
2.4V
2
1
1
0
0
-50
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
3.0V
3
-50
Figure 22.
Slew Rate L-H – Ambient Temperature
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 23.
Slew Rate H-L – Ambient Temperature
200
100
Phase
80
60
100
Gain
40
PHASE [deg]
GAIN[dB]
150
50
20
0
0
101
1.E+01
102
1.E+02
103
104
105
FREQUENCY [Hz]
1.E+03
1.E+04
1.E+05
106
1.E+06
107
1.E+07
Figure 24.
Voltage Gain・Phase－Frequency
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7291G: -40C to +85C
BU7291SG: -40C to +105C
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7294, BU7294S
800
0.8
800
0.8
600
0.6
POWER DISSIPATION [W]
POWER DISSIPATION [W]
BU7294F
BU7294FV
400
0.4
200
0.2
600
0.6
BU7294SF
BU7294SFV
400
0.4
200
0.2
0
0
0
85
25
50
75
100
AMBIENT TEMPERATURE [°C]
105
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
0
125
Figure 26.
Derating curve
5000
5000
4000
4000
SUPPLY CURRENT [uA]
SUPPLY CURRENT [uA]
Figure 25.
Derating curve
105C
3000
85C
2000
25C
1000
-40C
0
3000
5.5V
2000
3.0V
2.4V
1000
0
2
3
4
5
SUPPLY VOLTAGE [V]
6
-50
Figure 27.
Supply Current – Supply Voltage
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 28.
Supply Current – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7294G: -40C to +85C
BU7294SG: -40C to +105C
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7294, BU7294S
6
6
OUTPUT VOLTAGE HIGH [V]
OUTPUT VOLTAGE HIGH [V]
105C
5
25C
4
85C
3
-40C
2
1
0
5
5.5V
4
3.0V
3
2
2.4V
1
0
2
3
4
5
SUPPLY VOLTAGE [V]
6
-50
9
9
OUTPUT VOLTAGE LOW [mV]
OUTPUT VOLTAGE LOW [mV]
10
8
7
105C
85C
5
4
3
25C
-40C
25
50
75
100
125
Figure 30.
Maximum Output Voltage High –
Ambient Temperature
(RL=10kΩ)
10
2
0
AMBIENT TEMPERATURE [°C]
Figure 29.
Maximum Output Voltage High –
Supply Voltage
(RL=10kΩ)
6
-25
1
8
7
6
5.5V
5
4
3
3.0V
2
2.4V
1
0
0
2
3
4
5
SUPPLY VOLTAGE [V]
6
-50
Figure 31.
Maximum Output Voltage Low –
Supply Voltage
(RL=10kΩ)
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 32.
Maximum Output Voltage Low –
Ambient Temperature
(RL=10kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7294G: -40C to +85C
BU7294SG: -40C to +105C
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7294, BU7294S
50
OUTPUT SOURCE CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
50
40
-40C
25C
30
20
85C
105C
10
0
40
30
20
5.5V
3.0V
10
2.4V
0
0
0.5
1
1.5
2
2.5
3
-50
OUTPUT VOLTAGE [V]
0
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
Figure 33.
Output Source Current – Output Voltage
(VDD=3V)
Figure 34.
Output Source Current –Ambient Temperature
(OUT=VDD-0.4V)
80
OUTPUT SINK CURRENT [mA]
80
OUTPUT SINK CURRENT [mA]
-25
-40C
60
25C
40
85C
105C
20
60
40
5.5V
3.0V
20
2.4V
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50
OUTPUT VOLTAGE [V]
-25
0
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
Figure 36.
Output Sink Current – Ambient Temperature
(OUT=VSS+0.4V)
Figure 35.
Output Sink Current – Output Voltage
(VDD=3V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7294: -40C to +85C
BU7294S: -40C to +105C
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
5
5
4
4
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
●Typical Performance Curves - Continued
○BU7294, BU7294S
3
2
1
0
85C
-1
105C
-2
-40C
25C
-3
2
1
0
-1
-2
5.5V
-3
-4
-5
-5
3
4
5
SUPPLY VOLTAGE [V]
Figure 37.
Input Offset Voltage – Supply Voltage
3.0V
2.4V
-4
2
-50
6
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 38.
Input Offset Voltage – Ambient Temperature
160
LARGESIGNAL
SIGNALVOLTAGE
VOLTAGEGAIN
GAIN[dB]
[dB]
LARGE
15
INPUT OFFSET VOLTAGE [mV]
3
10
-40C
25C
85C
105C
5
0
-5
-10
140
105C
120
100
-40C
25C
85C
80
60
-15
-1
0
1
2
3
COMMON MODE INPUT VOLTAGE [V]
2
4
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 40.
Large Signal Voltage Gain – Supply Voltage
Figure 39.
Input Offset Voltage –
Common Mode Input Voltage
(VDD=3V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7294: -40C to +85C
BU7294S: -40C to +105C
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7294, BU7294S
140
120
100
2.4V
80
5.5V
3.0V
60
40
20
0
-50
120
COMMON
COMMONMODE
MODEREJECTION
REJECTION RATIO
RATIO[dB]
[dB]
LARGESIGNAL
SIGNALVOLTAGE
VOLTAGEGAIN
GAIN[dB]
[dB]
LARGE
160
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
100
105C
80
60
-40C
40
25C
20
0
125
2
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 42.
Common Mode Rejection Ratio – Supply Voltage
Figure 41.
Large Signal Voltage Gain – Ambient Temperature
140
120
POWER SUPPLY REJECTION RATIO [dB]
COMMON MODE REJECTION RATIO [dB]
COMMON MODE REJECTION RATIO [dB]
85C
120
100
5.5V
100
80
60
2.4V
3.0V
40
20
0
80
60
40
20
0
-50
-25
0
25
50
75
100
125
-50
AMBIENT TEMPERATURE [°C]
Figure 43.
Common Mode Rejection Ratio – Ambient Temperature
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 44.
Power Supply Rejection Ratio – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7294: -40C to +85C
BU7294S: -40C to +105C
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17/27
TSZ02201-0RAR1G200390-1-2
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Typical Performance Curves - Continued
○BU7294, BU7294S
5
5
4
SLEW RATE H-L [V/μs]
SLEW RATE L-H [V/μs]
5.5V
5.5V
3
2.4V
2
3.0V
1
4
3.0V
3
2.4V
2
1
0
0
-50
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
-50
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 46.
Slew Rate H-L – Ambient Temperature
Figure 45.
Slew Rate L-H – Ambient Temperature
200
100
Phase
150
60
100
40
Gain
PHASE [deg]
GAIN[dB]
80
50
20
0
1
10
0
2
10
0
3
10
1
4
10
10
105
100
0
6
7
10
10
1000 10000
FREQUENCY [Hz]
Figure 47.
Voltage Gain・Phase－Frequency
(*)The data above is measurement value of typical sample, it is not guaranteed.
BU7294: -40C to +85C
BU7294S: -40C to +105C
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TSZ02201-0RAR1G200390-1-2
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Application Information
NULL method condition for Test circuit1
Parameter
Input Offset Voltage
VDD, VSS, EK, Vicm Unit:V
VF
S1
S2
S3
VDD
VSS
EK
VF1
ON
ON
OFF
3
0
-1.5
ON
ON
ON
3
0
VF2
VF3
1
1.5
2
-2.5
VF4
0
ON
ON
OFF
3
0
-1.5
VF5
3
3
VF6
Power Supply Rejection Ratio
3
-0.5
Large Signal Voltage Gain
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
Vicm Calculation
ON
ON
2.4
OFF
VF7
0
-1.2
0
4
5.5
－ Calculation－
|VF1|
1. Input Offset Voltage (Vio)
Vio =
2. Large Signal Voltage Gain(Av)
Av = 20Log
[V]
1+RF/RS
2 × (1+RF/RS)
[dB]
|VF2-VF3|
3. Common-mode Rejection Ratio (CMRR)
CMRR= 20Log
1.8 × (1+RF/RS)
[dB]
|VF4 - VF5|
4. Power Supply Rejection Ratio (PSRR)
PSRR = 20Log
3.8 × (1+ RF/RS)
[dB]
|VF6 - VF7|
0.1µF
RF=50kΩ
SW1
EK
RS=50Ω
0.01µF
500kΩ
VDD
Ri=10kΩ
15V
Vo
500kΩ
0.015µF
0.015µF
DUT
NULL
SW3
RS=50Ω
1000pF
Ri=10kΩ
RL
Vicm
50kΩ
VF
SW2
VSS
VRL
-15V
Figure 48. Test circuit 1 (one channel only)
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TSZ02201-0RAR1G200390-1-2
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
Switch Condition for Test circuit2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
Supply Current
OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage RL=10kΩ
OFF
ON
OFF OFF
ON
OFF OFF
Output Current
OFF
ON
OFF OFF
ON
OFF OFF OFF OFF
Slew Rate
OFF OFF
Unity Gain Frequency
ON
ON
OFF OFF
OFF OFF OFF
ON
ON
ON
ON
OFF OFF
ON
ON
OFF
OFF OFF
OFF
ON
OFF OFF
ON
OFF OFF OFF
ON
OFF OFF
ON
Input voltage
SW3
VH
R2 100kΩ
SW4
●
●
VDD=3V
VL
t
－
SW1
Input wave
SW2
Output voltage
＋
SW5
SW6
SW8
SW7
SW9
SW10
SW11 SW12
90% SR=ΔV/Δt
VH
R1
1kΩ
VSS
ΔV
RL
VIN-
VIN+
CL
10%
VL
VL
Vo
Δt
t
Output wave
Figure 50. Slew rate input output wave
Figure 49. Test circuit 2
R2=100kΩ
R2=100kΩ
VDD
VDD
R1=1kΩ
R1=1kΩ
OTHER
CH
VIN
R1//R2
OUT1
=0.5Vrms
OUT2
R1//R2
VSS
VSS
CS=20Log
100×OUT1
OUT2
Figure 51. Test circuit 3 (Channel Separation)
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TSZ02201-0RAR1G200390-1-2
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BU7291G, BU7291SG, BU7294xx, BU7294Sxx
Datasheet
●Application example
○Voltage follower
Voltage gain is 0dB.
Using this circuit, the output voltage (OUT) is configured
to be equal to the input voltage (IN). This circuit also
stabilizes the output voltage (OUT) due to high input
impedance and low output impedance. Computation for
output voltage (OUT) is shown below.
OUT=IN
VDD
OUT
IN
VSS
Figure 52. Voltage follower
○Inverting amplifier
For inverting amplifier, input voltage (IN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
Figure 53. Inverting amplifier circuit
○Non-inverting amplifier
R1
R2
VDD
OUT
For non-inverting amplifier, input voltage (IN) is
amplified by a voltage gain, which depends on the ratio
of R1 and R2. The output voltage (OUT) is in-phase
with the input voltage (IN) and is shown in the next
expression.
OUT=(1 + R2/R1)・IN
Effectively, this circuit has high input impedance since
its input side is the same as that of the operational
amplifier.
IN
VSS
Figure 54. Non-inverting amplifier circuit
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Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at Ta=25C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θjaC/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 55. (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θja), given the ambient temperature (Ta), maximum junction temperature (Tjmax), and power
dissipation (Pd).
θja = (Tjmax－Ta) / Pd C/W
・・・・・ (Ⅰ)
The Derating curve in Figure 55. (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 56. (c) to (d) shows an example of the derating curve for BU7291,
BU7291S, BU7294, BU7294S.
Power dissipation of LSI [W]
Pd(max)
θja=(Tjmax-Ta)/Pd C/W
Power dissipation of IC
P2
Ambient temperature Ta[ C ]
θja2 <θja1
P1
θja2
Tj(max)
θja1
0
Chip surface temperature Tj[ C ]
25
50
75
100
125
Ambient temperature Ta[C]
(b) Derating curve
(a) Thermal resistance
Figure 55. Thermal resistance and Derating Curve
1000
1.0
800
0.8
POWER DISSIPATION [W] .
POWER DISSIPATION [W] .
1000
1.0
BU7294FV (*13)
600
0.6
BU7294F (*15)
400
0.4
BU7291G (*14)
200
0.2
0
800
0.8
BU7294SFV (*13)
600
0.6
BU7294SF (*15)
400
0.4
BU7291SG (*14)
200
0.2
0
0
25
50
75
85
100
0
AMBIENT TEMPERATURE [℃ ]
25
50
75
105
100
125
AMBIENT TEMPERATURE [℃ ]
(*13)
(*14)
(*15)
Unit
7.0
5.4
4.5
mW/C
When using the unit above Ta=25C, subtract the value above per degree C. Power dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted
Figure 56. Derating Curve
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TSZ02201-0RAR1G200390-1-2
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BU7291G, BU7291SG, BU7294xx, BU7294Sxx
Datasheet
●Operational Notes
1) Absolute maximum ratings
Absolute maximum ratings are the values which indicate the limits, within which the given voltage range can be safely
charged to the terminal. However, it does not guarantee the circuit operation.
2) Applied voltage to the input terminal
For normal circuit operation of voltage comparator, please input voltage for its input terminal within input common mode
voltage VDD + 0.3V. Then, regardless of power supply voltage,VSS - 0.3V can be applied to input terminals without
deterioration or destruction of its characteristics.
3) Power supply (single / dual)
The op-amp operates when the voltage supplied is between VDD and VSS.
Therefore, the single supply op-amp can be used as dual supply op-amp as well.
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including
reduced current capability due to the rise of chip temperature. Therefore, please take into consideration the power
dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal
derating curves for more information.
5) Short-circuit between pins and erroneous mounting
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation
or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Short-circuit between pins and erroneous mounting
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) IC handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
8) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, make sure that
the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the
assembly process as well as during transportation and storage.
9) Output capacitor
If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the
output pin and may destroy the IC when the VDD pin or VIN pin is shorted to ground or pulled down to 0V. Use a
capacitor smaller than 0.1μF between output pin and VSS pin.
10) Oscillation by output capacitor
Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop
circuit with these ICs.
11) Latch up
Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and
protect the IC from abnormaly noise.
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©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
23/27
TSZ02201-0RAR1G200390-1-2
22.May.2013 Rev.001
Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Physical Dimensions Tape and Reel Information
Package Name
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
SSOP5
24/27
TSZ02201-0RAR1G200390-1-2
22.May.2013 Rev.001
Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
)
∗ Order quantity needs to be multiple of the minimum quantity.
25/27
TSZ02201-0RAR1G200390-1-2
22.May.2013 Rev.001
Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
Package Name
SSOP-B14
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
)
∗ Order quantity needs to be multiple of the minimum quantity.
26/27
TSZ02201-0RAR1G200390-1-2
22.May.2013 Rev.001
Datasheet
BU7291G, BU7291SG, BU7294xx, BU7294Sxx
●Marking Diagram
SSOP5(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
SSOP-B14(TOP VIEW)
Product Name
Part Number Marking
LOT Number
BU7291
BU7291S
BU7294
Package Type
G
SSOP5
F
SOP14
FV
SSOP-B14
F
BU7294S
SOP14
FV
SSOP-B14
Marking
D1
FB
BU7294F
7294
BU7294SF
7294S
1PIN MARK
●Land pattern data
all dimensions in mm
Land length
Land width
≧ℓ 2
b2
PKG
Land pitch
e
Land space
MIE
SSOP5
0.95
2.4
1.0
0.6
SOP14
1.27
4.60
1.10
0.76
SSOP-B14
0.65
4.60
1.20
0.35
SSOP5
e
SOP14, SSOP-B14
e
ℓ2
MIE
e
MIE
b2
b2
ℓ 2
●Revision History
Date
22.May.2013
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
Revision
001
Changes
New Release
27/27
TSZ02201-0RAR1G200390-1-2
22.May.2013 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001