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Datasheet
Operational Amplifier
Ground Sense Operational Amplifiers
BA2904YF-LB
BA2902YF-LB
General Description
Key Specifications
 Operating Supply Voltage
Single Supply :
Dual Supply :
 Supply Current
BA2904YF-LB (Dual)
BA2902YF-LB (Quad)
 Input Bias Current :
 Input Offset Current :
 Operating Temperature Range :
This is the product guarantees long time support in
Industrial market.
BA2904YF-LB and BA2902YF-LB are operational
amplifiers that can operate in single power supply. It
features low power consumption, input common-mode
voltage range includes ground, and can operate from
+3V to +36V.
Applications are Car Navigation System, Car Audio,
Automotive Body and Exteriors.
+3.0V to +36V
±1.5V to ±18V
0.5mA(Typ)
0.7mA(Typ)
20nA(Typ)
2nA(Typ)
-40°C to +125°C
Features
 Long Time Support a Product for Industrial
Applications
 Single or Dual Power Supply Operation
 Wide Operating Supply Voltage
 Common-mode Input Voltage Range includes
ground level
 Low Supply Current
 Wide Temperature Range
Packages
SOP8
SOP14
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
Applications




Industrial Equipment
Current sense application
Buffer application amplifier
Active filter
Simplified Schematic
VCC
－ IN
OUT
＋ IN
VEE
Figure 1. Simplified Schematic (1 Channel Only)
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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Datasheet
BA2904YF-LB BA2902YF-LB
Pin Configuration
BA2904YF-LB : SOP8
2
+IN1
3
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
Pin No.
Pin Name
1
OUT1
2
-IN1
8 VCC
OUT1 1
-IN1
Pin No.
CH1
- +
CH2
7
OUT2
6
-IN2
+ -
VEE
5 +IN2
4
BA2902YF-LB : SOP14
OUT1 1
14 OUT4
3
+IN1
-IN1 2
13 -IN4
4
VCC
+IN1 3
12 +IN4
5
+IN2
VCC 4
11 VEE
+IN2
CH1
- +
CH4
+ -
5
-IN2 6
- +
CH2
+ CH3
OUT2 7
6
-IN2
7
OUT2
10 +IN3
8
OUT3
9 -IN3
9
-IN3
10
+IN3
8 OUT3
SOP8
SOP14
BA2904YF-LB
BA2902YF-LB
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11
VEE
12
+IN4
13
-IN4
14
OUT4
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
Ordering Information
B
A
2
9
0
x
Y
F
-
Product class
LB for Industrial applications
Packaging and forming specification
H2: Embossed tape and reel
(SOP8/SOP14)
Package
F
: SOP8
SOP14
Parts Number
BA2904YF
BA2902YF
LB H2
Line-up
Topr
Supply
Voltage
-40°C to +125°C
+3V to +36V
Number of
Channels
Orderable
Part Number
Package
Dual
SOP8
Reel of 250
BA2904YF-LBH2
Quad
SOP14
Reel of 250
BA2902YF-LBH2
Absolute Maximum Ratings (TA=25°C)
Parameter
Symbol
Supply Voltage
Power Dissipation
Ratings
BA2904YF-LB
VCC-VEE
PD
SOP8
SOP14
BA2902YF-LB
+36
0.77
V
(Note 1,3)
0.56 (Note 2,3)
-
Unit
W
Differential Input Voltage(Note 4)
VID
+36
Input Common-mode Voltage Range
VICM
(VEE-0.3) to (VEE+36)
V
II
-10
mA
Operating Supply Voltage
Vopr
+3.0 to +36 (±1.5 to ±18)
V
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
TJmax
+150
°C
Input Current(Note 5)
Maximum Junction Temperature
V
(Note 1) To use at temperature above TA=25°C reduce 6.2mW/°C.
(Note 2) To use at temperature above TA=25°C reduce 4.5mW/°C.
(Note 3) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%).
(Note 4) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
(Note 5) An excessive input current will flow when input voltages of less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
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Datasheet
BA2904YF-LB BA2902YF-LB
Electrical Characteristics
○BA2904YF-LB (Unless otherwise specified VCC=+5V, VEE=0V)
Temperature
Parameter
Symbol
Range
Min
Input Offset Voltage(Note 6,7)
Input Offset Voltage Drift
Input Offset Current(Note 6,7)
VIO
△VIO/△T
IIO
25°C
-
Limit
Typ
2
Max
7
Full range
-
-
10
-
-
±7
-
25°C
-
2
50
Full range
-
-
200
-
-
±10
-
25°C
-
20
250
Full range
-
-
250
Input Offset Current Drift
ΔIIO/ΔT
Input Bias Current(Note 7,8)
IB
Supply Current(Note 7)
ICC
Maximum Output Voltage(High)(Note 7)
VOH
Maximum Output Voltage(Low)(Note 7)
VOL
Large Signal Voltage Gain
AV
25°C
25°C
-
0.5
1.2
Full range
-
-
2
25°C
3.5
-
-
Full range
27
28
-
Full range
-
5
20
25
100
-
88
100
-
Unit
mV
Conditions
EK=-1.4V
VCC=5 to 30V, EK=-1.4V
μV/°C EK=-1.4V
nA
EK=-1.4V
pA/°C EK=-1.4V
nA
EK=-1.4V
mA
RL=∞, All Op-Amps
V
mV
RL=2kΩ
VCC=30V, RL=10kΩ
RL=∞, All Op-Amps
V/mV RL≥2kΩ, VCC=15V
EK=-1.4V to -11.4V
dB
Input Common-mode
Voltage Range
Common-mode Rejection Ratio
VICM
25°C
0
-
VCC-1.5
V
CMRR
25°C
50
80
-
dB
(VCC-VEE)=5V
EK=VEE-1.4V
EK=-1.4V
Power Supply Rejection Ratio
PSRR
25°C
65
100
-
dB
VCC=5 to 30V
25°C
20
30
-
Full range
10
-
-
mA
+IN=1V, -IN=0V
OUT=0V, Short Current
25°C
10
20
-
Full range
2
-
-
mA
+IN=0V, -IN=1V
OUT=5V, Short Current
25°C
12
40
-
μA
SR
25°C
-
0.2
-
V/μs
GBW
25°C
-
0.5
-
MHz
Input Referred Noise Voltage
VN
25°C
-
40
-
nV/ Hz
Channel Separation
CS
25°C
-
120
-
dB
Output Source Current (Note 7,9)
Output Sink Current
(Note 7,9)
Slew Rate
Gain Bandwidth Product
(Note 6)
(Note 7)
(Note 8)
(Note 9)
ISOURCE
ISINK
+IN=0V, -IN=1V
OUT=200mV
VCC=15V, AV=0dB
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
CL=100pF
VCC=15V, VEE=-15V
AV=40dB, VICM=0V
RS=100Ω, f=1kHz
AV=40dB, f=1kHz
OUT=0.5Vrms
Absolute value
Full range TA=-40°C to +125°C
Current Direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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Datasheet
BA2904YF-LB BA2902YF-LB
Electrical Characteristics
○BA2902YF-LB (Unless otherwise specified VCC=+5V, VEE=0V)
Temperature
Parameter
Symbol
Range
Min
Input Offset Voltage (Note 10,11)
Input Offset Voltage Drift
Input Offset Current (Note 10,11)
Input Offset Current Drift
VIO
△VIO/△T
IIO
ΔIIO/ΔT
25°C
-
Limit
Typ
2
Max
7
Full range
-
-
10
-
-
±7
-
25°C
-
2
50
Full range
-
-
200
-
-
±10
-
25°C
-
20
250
Full range
-
-
250
Input Bias Current (Note 11,12)
IB
Supply Current(Note 11)
ICC
Maximum Output Voltage(High)(Note 11)
VOH
Maximum Output Voltage(Low)(Note 11)
VOL
Large Signal Voltage Gain
AV
25°C
25°C
-
0.7
2
Full range
-
-
3
25°C
3.5
-
-
Full range
27
28
-
Full range
-
5
20
25
100
-
88
100
-
Unit
mV
Conditions
EK=-1.4V
VCC=5 to 30V, EK=-1.4V
μV/°C EK=-1.4V
nA
EK=-1.4V
pA/°C EK=-1.4V
nA
EK=-1.4V
mA
RL=∞, All Op-Amps
V
mV
RL=2kΩ
VCC=30V, RL=10kΩ
RL=∞, All Op-Amps
V/mV RL≥2kΩ, VCC=15V
EK=-1.4V to -11.4V
dB
Input Common-mode
Voltage Range
Common-mode Rejection Ratio
VICM
25°C
0
-
VCC-1.5
V
CMRR
25°C
50
80
-
dB
(VCC-VEE)=5V
EK=VEE-1.4V
EK=-1.4V
Power Supply Rejection Ratio
PSRR
25°C
65
100
-
dB
VCC=5 to 30V
25°C
20
30
-
Full range
10
-
-
mA
+IN=1V, -IN=0V
OUT=0V, Short Current
25°C
10
20
-
Full range
2
-
-
mA
+IN=0V, -IN=1V
OUT=5V, Short Current
25°C
12
40
-
μA
SR
25°C
-
0.2
-
V/μs
GBW
25°C
-
0.5
-
MHz
Input Referred Noise Voltage
VN
25°C
-
40
-
nV/ Hz
Channel Separation
CS
25°C
-
120
-
dB
Output Source Current(Note 11,13)
Output Sink Current
(Note 11,13)
Slew Rate
Gain Bandwidth Product
(Note 10)
(Note 11)
(Note 12)
(Note 13)
ISOURCE
ISINK
+IN=0V, -IN=1V
OUT=200mV
VCC=15V, AV=0dB
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
CL=100pF
VCC=15V, VEE=-15V
AV=40dB, VICM=0V
RS=100Ω, f=1kHz
AV=40dB, f=1kHz
OUT=0.5Vrms
Absolute value
Full range TA=-40°C to +125°C
Current Direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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Datasheet
BA2904YF-LB BA2902YF-LB
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between VCC and VEE without deterioration or destruction of
characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Operating and Storage Temperature Ranges (Topr, Tstg)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range
of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.
(5)
Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Voltage Drift (△VIO/△T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
(3) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(4) Input Offset Current Drift (△IIO /△T)
Denotes the ratio of the input offset current fluctuation to the ambient temperature fluctuation.
(5) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(6) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(7) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into high-level output
voltage and low-level output voltage. High-level output voltage indicates the upper limit of output voltage while
Low-level output voltage indicates the lower limit.
(8) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(9) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
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Datasheet
BA2904YF-LB BA2902YF-LB
(10) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage) / (Input offset fluctuation)
(11) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of power supply voltage) / (Input offset fluctuation)
(12) Output Source Current/ Output Sink Current (ISOURCE / ISINK)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(13) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(14) Gain Bandwidth Product (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
(15) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
(16) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
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Datasheet
BA2904YF-LB BA2902YF-LB
Typical Performance Curves
○BA2904YF-LB
1.0
1.0
0.8
BA2904YF-LB
Supply Current [mA]
Power Dissipation [W] .
0.8
0.6
0.4
0.6
-40℃
0.4
125℃
0.2
0.2
0.0
0.0
0
25
50
75
100
125
Ambient Temperature [°C]
150
0
10
20
30
Supply Voltage [V]
40
Figure 3.
Supply Current vs Supply Voltage
Figure 2.
Derating Curve
1.0
Maximum Output Voltage(High) [V]
40
0.8
Supply Current [mA]
25℃
0.6
5V
32V
36V
0.4
3V
0.2
0.0
30
-40℃
20
125℃
25℃
10
0
-50
-25
0
0
25 50 75 100 125 150
Ambient Temperature [°C]
Figure 4.
Supply Current vs Ambient Temperature
(*)The above data is measurement value of
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TSZ22111･15･001
10
20
30
Supply Voltage [V]
40
Figure 5.
Maximum Output Voltage(High) vs Supply Voltage
(RL=10kΩ)
typical sample, it is not guaranteed.
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TSZ02201-0RAR0G200690-1-2
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Datasheet
BA2904YF-LB BA2902YF-LB
5
50
4
40
Output Source Current [mA]
Maximum Output Voltage(High) [V]
○BA2904YF-LB
3
2
1
0
-50
-40℃
25℃
30
20
125℃
10
0
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
100
40
10
Output Sink Current [mA]
Output Source Current [mA]
50
5V
30
15V
20
-40℃
0.1
0
0.001
0
25 50 75 100 125 150
Ambient Temperature [°C]
25℃
0
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0.4
0.8
1.2
Output Voltage [V]
1.6
2
Figure 9.
Output Sink Current vs Output Voltage
(VCC=5V)
Figure 8.
Output Source Current vs Ambient Temperature
(OUT=0V)
(*)The above data is measurement value of
5
125℃
0.01
-25
4
1
10
-50
2
3
Output Voltage[V]
Figure 7.
Output Source Current vs Output Voltage
(VCC=5V)
Figure 6.
Maximum Output Voltage(High) vs Ambient Temperature
(VCC=5V, RL=2kΩ)
3V
1
typical sample, it is not guaranteed.
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Datasheet
BA2904YF-LB BA2902YF-LB
○BA2904YF-LB
80
30
15V
70
Low - Level Sink Current [µA]
Output Sink Current [mA]
-40℃
20
5V
3V
10
25℃
60
50
40
125℃
30
20
10
0
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
10
15
20
25
Supplly Voltage [V]
30
35
Figure 11.
Low Level Sink Current vs Supply Voltage
(OUT=0.2V)
Figure 10.
Output Sink Current vs Ambient Temperature
(OUT=VCC)
8
80
70
6
32V
36V
60
Input Offset Voltage [mV]
Low - Level Sink Current [µA]
5
5V
50
40
3V
30
20
4
-40℃
0
-4
-6
0
-8
-25
0
25 50 75 100 125 150
Ambient Temperature [°C]
125℃
-2
10
-50
0
5
10
15
20
25
Supply Voltage [V]
30
35
Figure 13.
Input Offset Voltage vs Supply Voltage
(VICM=0V, EK=-1.4V)
Figure 12.
Low Level Sink Current vs Ambient Temperature
(OUT=0.2V)
(*)The above data is measurement value of
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25℃
2
typical sample, it is not guaranteed.
10/27
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Datasheet
BA2904YF-LB BA2902YF-LB
○BA2904YF-LB
8
50
40
4
2
Input Bias Current [nA]
Input Offset Voltage [mV]
6
3V
0
5V
36V
-2
-4
30
-40℃
25℃
20
10
125℃
-6
-8
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
5
15
20
25
Supply Voltage [V]
30
35
Figure 15.
Input Bias Current vs Supply Voltage
(VICM=0V, EK=-1.4V)
Figure 14.
Input Offset Voltage vs Ambient Temperature
(VICM=0V, EK=-1.4V)
50
50
40
30
Input Bias Current [nA]
40
Input Bias Current [nA]
10
32V
36V
20
3V
5V
30
20
10
10
0
0
-10
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
-50
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0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 17.
Input Bias Current vs Ambient Temperature
(VCC=30V, VICM=28V, EK=-1.4V)
Figure 16.
Input Bias Current vs Ambient Temperature
(VICM=0V, EK=-1.4V)
(*)The above data is measurement value of
-25
typical sample, it is not guaranteed.
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30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
○BA2904YF-LB
8
10
6
125℃
25℃
5
Input Offset Current [nA]
Input Offset Voltage [mV]
-40℃
4
2
0
-2
-4
-40℃
25℃
0
125℃
-5
-6
-8
-10
-1
0
1
2
3
Input Voltage [V]
4
5
0
5
10
15
20
25
Supply Voltage [V]
30
35
Figure 19.
Input Offset Current vs Supply Voltage
(VICM=0V, EK=-1.4V)
Figure 18.
Input Offset Voltage vs Input Voltage
(VCC=5V)
140
10
Large Signal Voltage Gain [dB]
Input Offset Current [nA]
130
5
3V
0
5V
36V
-5
-40℃
120
25℃
110
100
125℃
90
80
70
-10
60
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
4
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©2014 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
8
10
12
Supply Voltage [V]
14
16
Figure 21.
Large Signal Voltage Gain vs Supply Voltage
(RL=2kΩ)
Figure 20.
Input Offset Current vs Ambient Temperature
(VICM=0V, EK=-1.4V)
(*)The above data is measurement value of
6
typical sample, it is not guaranteed.
12/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
○BA2904YF-LB
140
140
Common Mode Rejection Ratio [dB]
Large Signal Voltage Gain [dB]
130
15V
120
110
5V
100
90
80
70
120
-40℃
100
125℃
80
60
40
60
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
Figure 22.
Large Signal Voltage Gain vs Ambient Temperature
(RL=2kΩ)
10
20
30
Supply Voltage [V]
40
Figure 23.
Common Mode Rejection Ratio vs Supply Voltage
140
140
130
32V
36V
120
Power Supply Rejection Ratio [dB]
Common Mode Rejection Ratio [dB]
25℃
100
5V
80
3V
60
120
110
100
90
80
70
40
60
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
-50
Figure 24.
Common Mode Rejection Ratio vs Ambient Temperature
(*)The above data is measurement value of
www.rohm.com
©2014 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 25.
Power Supply Rejection Ratio vs Ambient Temperature
typical sample, it is not guaranteed.
13/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
1.0
2.0
0.8
1.6
Supply Current [mA]
Power Dissipation [W]
○BA2902YF-LB
BA2902YF-LB
0.6
0.4
1.2
-40℃
0.8
125℃
0.2
0.4
0.0
0.0
0
25
50
75
100
125
Ambient Temperature [°C]
150
0
10
20
30
Supply Voltage [V]
40
Figure 27.
Supply Current vs Supply Voltage
Figure 26.
Derating Curve
40
Maximum Output Voltage(High) [V]
2.0
1.6
Supply Current [mA]
25℃
1.2
5V
32V
36V
0.8
3V
0.4
0.0
30
-40℃
20
125℃
25℃
10
0
-50 -25
0
25 50 75 100 125 150
Ambient Temperature [°C]
0
Figure 28.
Supply Current vs Ambient Temperature
(*)The above data is measurement value of
www.rohm.com
©2014 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
10
20
30
Supply Voltage [V]
40
Figure 29.
Maximum Output Voltage(High) vs Supply Voltage
(RL=10kΩ)
typical sample, it is not guaranteed.
14/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
5
50
4
40
Output Source Current [mA]
Maximum Output Voltage(High) [V]
○BA2902YF-LB
3
2
1
0
-50
-40℃
25℃
30
20
125℃
10
0
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
100
40
10
3V
5V
30
15V
20
10
4
5
125℃
1
-40℃
0.1
25℃
0.01
0
-50
2
3
Output Voltage[V]
Figure 31.
Output Source Current vs Output Voltage
(VCC=5V)
50
Output Sink Current [mA]
Output Source Current [mA]
Figure 30.
Maximum Output Voltage(High) vs Ambient Temperature
(VCC=5V, RL=2kΩ)
1
0.001
-25
0
25 50 75 100 125 150
Ambient Temperature [°C]
0
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©2014 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
0.8
1.2
Output Voltage [V]
1.6
2
Figure 33.
Output Sink Current vs Output Voltage
(VCC=5V)
Figure 32.
Output Source Current vs Ambient Temperature
(OUT=0V)
(*)The above data is measurement value of
0.4
typical sample, it is not guaranteed.
15/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
○BA2902YF-LB
30
80
15V
70
Low - Level Sink Current [µA]
Output Sink Current [mA]
-40℃
20
5V
3V
10
25℃
60
50
40
125℃
30
20
10
0
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
10
15
20
25
Supplly Voltage [V]
30
35
Figure 35.
Low Level Sink Current vs Supply Voltage
(OUT=0.2V)
Figure 34.
Output Sink Current vs Ambient Temperature
(OUT=VCC)
8
80
70
6
32V
36V
60
Input Offset Voltage [mV]
Low - Level Sink Current [µA]
5
5V
50
40
3V
30
20
10
4
-40℃
25℃
2
0
125℃
-2
-4
-6
0
-8
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [°C]
0
Figure 36.
Low Level Sink Current vs Ambient Temperature
(OUT=0.2V)
(*)The above data is measurement value of
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©2014 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
5
10
15
20
25
Supply Voltage [V]
30
35
Figure 37.
Input Offset Voltage vs Supply Voltage
(VICM=0V, OUT=1.4V)
typical sample, it is not guaranteed.
16/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
○BA2902YF-LB
8
50
40
4
2
Input Bias Current [nA]
Input Offset Voltage [mV]
6
3V
0
5V
36V
-2
-4
30
-40℃
25℃
20
125℃
10
-6
-8
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
10
15
20
25
Supply Voltage [V]
30
35
Figure 39.
Input Bias Current vs Supply Voltage
(VICM=0V, EK=-1.4V)
Figure 38.
Input Offset Voltage vs Ambient Temperature
(VICM=0V, EK=-1.4V)
50
50
40
30
Input Bias Current [nA]
40
Input Bias Current [nA]
5
32V
36V
20
3V
5V
30
20
10
10
0
0
-10
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
-50
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©2014 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 41.
Input Bias Current vs Ambient Temperature
(VCC=30V, VICM=28V, EK=-1.4V)
Figure 40.
Input Bias Current vs Ambient Temperature
(VICM=0V, EK=-1.4V)
(*)The above data is measurement value of
-25
typical sample, it is not guaranteed.
17/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
○BA2902YF-LB
8
10
6
125℃
25℃
5
Input Offset Current [nA]
Input Offset Voltage [mV]
-40℃
4
2
0
-2
-4
-40℃
25℃
0
125℃
-5
-6
-8
-10
-1
0
1
2
3
Input Voltage [V]
4
5
0
5
10
15
20
25
Supply Voltage [V]
30
35
Figure 43.
Input Offset Current vs Supply Voltage
(VICM=0V, EK=-1.4V)
Figure 42.
Input Offset Voltage vs Input Voltage
(VCC=5V)
140
10
Large Signal Voltage Gain [dB]
Input Offset Current [nA]
130
5
3V
0
5V
36V
-5
-40℃
120
25℃
110
100
125℃
90
80
70
-10
60
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
4
www.rohm.com
©2014 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
8
10
12
Supply Voltage [V]
14
16
Figure 45.
Large Signal Voltage Gain vs Supply Voltage
(RL=2kΩ)
Figure 44.
Input Offset Current vs Ambient Temperature
(VICM=0V, EK=-1.4V)
(*)The above data is measurement value of
6
typical sample, it is not guaranteed.
18/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
○BA2902YF-LB
140
140
Common Mode Rejection Ratio [dB]
Large Signal Voltage Gain [dB]
130
15V
120
110
5V
100
90
80
70
120
-40℃
100
125℃
80
60
40
60
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
Figure 46.
Large Signal Voltage Gain vs Ambient Temperature
(RL=2kΩ)
10
20
30
Supply Voltage [V]
40
Figure 47.
Common Mode Rejection Ratio vs Supply Voltage
140
140
130
32V
36V
120
Power Supply Rejection Ratio [dB]
Common Mode Rejection Ratio [dB]
25℃
100
5V
80
3V
60
120
110
100
90
80
70
60
40
-50
-50
-25
0
25
50
75 100 125 150
Ambient Temperature [°C]
Figure 48.
Common Mode Rejection Ratio vs Ambient Temperature
(*)The above data is measurement value of
www.rohm.com
©2014 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 49.
Power Supply Rejection Ratio vs Ambient Temperature
typical sample, it is not guaranteed.
19/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 50 (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax－TA) / PD °C/W
The Derating curve in Figure 50 (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 50(c) and 50(d) shows an example of the derating curve for
BA2904YF-LB, BA2902YF-LB.
LSIの 消 費
力 [W]
Power dissipation
of 電
LSI
Pd (max)
θja=(Tjmax-Ta)/Pd °C/W
P2
θja2 < θja1
Ambient temperature Ta[ °C ]
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
Chip surface temperature Tj[ °C ]
0
25
50
θ ja1
75
100
Ambient temperature
周 囲 温 度 Ta [℃ ]
(a) Thermal resistance
125
150
(b) Derating curve
Figure 89. Thermal resistance and Derating Curve
1.0
BA2904YF-LB
0.8
(Note 14)
Power Dissipation [W]
Power Dissipation [W]
1.0
0.6
0.4
0.2
0.0
0.8
0.6
BA2902YF-LB
(Note 15)
0.4
0.2
0.0
0
25
50
75 100 125
Ambient Temperature [°C]
150
0
25
50
75 100 125
Ambient Temperature [°C]
(c) BA2904YF-LB
150
(d) BA2902YF-LB
(Note14)
(Note15)
Unit
6.2
4.5
mW/°C
When using the unit above TA=25°C, subtract the value above per Celsius degree .
Mounted on a FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%)
Figure 50. Thermal resistance and derating
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TSZ22111･15･001
20/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
Application Information
NULL method condition for Test circuit1
VCC, VEE, EK, VICM Unit: V
Parameter
VF
S1
S2
Input Offset Voltage
VF1
ON
ON
Input Offset Current
VF2
OFF
OFF
VF3
OFF
ON
VF4
ON
OFF
ON
ON
ON
ON
ON
OFF
ON
ON
OFF
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
VF7
Common-mode Rejection Ratio
(Input common-mode Voltage Range)
VF8
VF9
Power Supply Rejection Ratio
VF10
- Calculation 1. Input Offset Voltage (VIO)
VIO =
2. Input Offset Current (IIO)
IIO =
3. Input Bias Current (IB)
IB =
S3
VEE
EK
VICM
calculation
OFF 5 to 30
0
-1.4
0
1
OFF
5
0
-1.4
0
2
OFF
5
0
-1.4
0
3
15
0
-1.4
0
15
0
-11.4
0
5
0
-1.4
0
5
0
-1.4
3.5
5
0
-1.4
0
30
0
-1.4
0
|VF1|
4
5
6
[V]
1+RF/RS
|VF2-VF1|
RI ×(1+RF/RS)
|VF4-VF3|
2 × RI ×(1+RF/RS)
AV = 20Log
4. Large Signal Voltage Gain (AV)
VCC
[A]
[A]
ΔEK × (1+RF/RS)
|VF5-VF6|
5. Common-mode Rejection Ration (CMRR)
CMRR  20 × Log
6. Power supply rejection ratio (PSRR)
PSRR  20 × Log
[dB]
ΔVICM × (1+ R F /R S )
[dB]
VF8 - VF7
ΔVcc × (1+ RF /RS )
[dB]
VF10 - VF9
0.1μF
RF=50kΩ
SW1
RS=50Ω
500kΩ
VCC
RI=10kΩ
Vo
0.1μF
15V
EK
500kΩ
DUT
SW3
RS=50Ω
RI=10kΩ
NULL
RL
VICM
50kΩ
1000pF
SW2
V VF
VEE
-15V
Figure 51. Test circuit1 (one channel only)
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TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
Switch Condition for Test Circuit 2
SW
1
SW
3
SW
4
SW
5
Supply Current
OFF OFF OFF
ON
OFF
Maximum Output Voltage (high)
OFF OFF
ON OFF OFF
ON OFF OFF
OFF OFF OFF
ON
OFF
Maximum Output Voltage (Low)
OFF OFF
ON OFF OFF
ON OFF OFF OFF OFF OFF OFF
ON
OFF
Output Source Current
OFF OFF
ON OFF OFF
ON OFF OFF OFF OFF OFF OFF OFF
ON
Output Sink Current
OFF OFF
ON OFF OFF
ON OFF OFF OFF OFF OFF OFF OFF
ON
Slew Rate
OFF OFF OFF ON
OFF OFF OFF
ON
ON
ON
OFF OFF OFF OFF
Gain Bandwidth Product
OFF
ON OFF OFF
ON
ON OFF OFF
ON
ON
OFF OFF OFF OFF
Equivalent Input Noise Voltage
ON
OFF OFF OFF
ON
ON OFF OFF OFF OFF
ON OFF OFF OFF
SW No.
SW
2
SW
6
SW
7
SW
8
SW
9
SW
10
SW
11
SW
12
SW
13
SW
14
ON OFF OFF OFF OFF OFF OFF OFF OFF
ON
Input voltage
SW4
VH
R2
SW5
●
VCC
VL
－
SW1
SW2
SW3
SW6
RS
SW7
Input wave
Output voltage
＋
SW9
SW8
SW10
SW11
SW12
SW13 SW14
90%
VH
R1=1kΩ
SR＝ΔV/Δt
ΔV
VEE
CC
VIN-
t
RL
VIN+
CL
VL
VOUT
10%
Δt
Output wave
Figure 52. Test Circuit 2 (each Op-Amp)
Figure 53. Slew Rate Input Waveform
VCC
VCC
R1//R2
OTHER
CH
R1//R2
VEE
R1
VEE
R2
V
IN
40dB amplifier
t
OUT1
=0.5Vrms
R1
R2
V
OUT2
40dB amplifier
100×OUT1
CS=20×log
(R1=1kΩ, R2=100kΩ)
Figure 54. Test Circuit 3(Channel Separation)
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22/27
OUT2
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of
connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
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23/27
TSZ02201-0RAR0G200690-1-2
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Datasheet
BA2904YF-LB BA2902YF-LB
Operational Notes – continued
11. Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
N
P
N
P+
N
Pin B
B
Parasitic
Element
N
P+
N P
P+
B
N
C
E
Parasitic
Element
P Substrate
P Substrate
Parasitic
Element
N
GND
Parasitic
Element
GND
GND
GND
Parasitic element
or Transistor
Figure 55. Example of Monolithic IC Structure
12. Unused Circuits
When there are unused circuits it is recommended that they be connected as in Figure 56, setting the non-inverting
input terminal to a potential within the in-phase input voltage range (VICM).
VCC
+
-
Keep this potential
VICM
in VICM
VEE
Figure 56. Disable Circuit Example
13. Input Terminal Voltage
(BA2904 / BA2902) Applying VEE + 36V to the input terminal is possible without causing deterioration of the electrical
characteristics or destruction, irrespective of the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage is within the common mode input voltage
range of the electric characteristics.
14. Power Supply (signal / dual)
The op-amp operates when the specified voltage supplied is between VCC and VEE. Therefore, the single supply
op-amp can be used as a dual supply op-amp as well.
15. Terminal short-circuits
When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat generation
and, subsequently, destruction.
16. IC Handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
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24/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
BA2904YF-LB BA2902YF-LB
Physical Dimensions Tape and Reel Information
Package Name
SOP8
Max 5.35 (include. BURR)
Drawing: EX112-5001-1
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Datasheet
BA2904YF-LB BA2902YF-LB
Physical Dimension Tape and Reel Information - continued
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
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Datasheet
BA2904YF-LB BA2902YF-LB
Marking Diagrams
SOP8 (TOP VIEW)
SOP14 (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Product Name
Package Type
Marking
BA2904Y
F-LB
SOP8
2904Y
BA2902Y
F-LB
SOP14
BA2902YF
Land pattern data
SOP8, SSOP-B8, MSOP8, SOP14, SSOP-B14
b2
e
MIE
ℓ 2
PKG
SOP8
SOP14
Land pitch
e
Land space
MIE
1.27
4.60
All dimensions in mm
Land length
Land width
≧ℓ 2
b2
1.10
0.76
Revision History
Date
Revision
30.Jan.2014
001
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TSZ22111･15･001
Changes
New Release
27/27
TSZ02201-0RAR0G200690-1-2
30.Jan.2014 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001