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Datasheet
Comparator
Ground Sense Comparators
BA2903YF-LB
BA2901YF-LB
General Description
Key Specifications
 Operating Supply Voltage Range
single supply :
split supply :
 Supply Current
BA2903YF-LB(Dual)
BA2901YF-LB(Quad)
 Input Bias Current :
 Input Offset Current :
 Operating Temperature Range :
This is the product guarantees long time support in
Industrial market.
BA2903YF-LB and BA2901YF-LB are open collector
output comparators that can operate in single power
supply. It features wide operating voltage range of 2V to
36V and with low supply current.
Features
 Long Time Support a Product for
Industrial Applications
 Single or Dual Power Supply Operation
 Wide Operating Supply Voltage
 Standard Comparator Pin-assignments
 Common-mode Input Voltage Range includes ground
level.
 Wide Temperature Range
Packages
SOP8
SOP14
+2.0V to +36V
±1.0V to ±18V
0.6mA(Typ)
0.8mA(Typ)
50nA(Typ)
5nA(Typ)
-40°C to +125°C
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
Application




Industrial Equipment
Current Monitor
Battery Monitor
Multivibrators
Simplified schematic
VCC
OUT
+IN
-IN
VEE
Figure 1. Simplified schematic (one channel only)
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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BA2903YF-LB
Datasheet
BA2901YF-LB
Pin Configuration
BA2903YF-LB : SOP8
2
+IN1
3
Pin Name
1
OUT1
2
-IN1
3
+IN1
8 VCC
OUT1 1
-IN1
Pin No.
CH1
- +
CH2
7
OUT2
6
-IN2
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
Pin No.
Pin Name
1
OUT2
2
OUT1
3
VCC
4
-IN1
5
+IN1
+ -
VEE
5 +IN2
4
BA2901YF-LB : SOP14
OUT2
OUT1
VCC
1
14
OUT3
2
13
OUT4
3
-IN1 4
CH1
－ ＋
CH4
－ ＋
12
VEE
11
+IN4
6
-IN2
7
+IN2
+IN1
5
10
-IN4
8
-IN3
9
+IN3
-IN2
6
9
+IN3
10
-IN4
8
-IN3
11
+IN4
CH2
－ ＋
+IN2
CH3
－ ＋
7
12
VEE
13
OUT4
14
OUT3
Package
SOP8
SOP14
BA2903YF-LB
BA2901YF-LB
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BA2903YF-LB
Datasheet
BA2901YF-LB
Ordering Information
B
A
2
9
0
x
Y
F
-
Product class
LB for Industrial applications
Packaging and forming specification
H2: Embossed tape and reel
(SOP8/SOP14)
Package
F
: SOP8
SOP14
Part Number
BA2903YF
BA2901YF
LB H2
Line-up
Topr
Operating
Supply
Voltage
-40°C to +125°C
+2.0V to +36V
Dual/Quad
Orderable
Part Number
Package
Dual
SOP8
Reel of 250
BA2903YF-LBE2
Quad
SOP14
Reel of 250
BA2901YF-LBE2
Absolute Maximum Ratings (TA=25°C)
Parameter
Symbol
VCC-VEE
Supply Voltage
Power dissipation
Ratings
BA2903YF-LB
PD
+36
0.77
SOP8
SOP14
BA2901YF-LB
V
(Note 1,3)
0.56 (Note 2,3)
-
Unit
W
Differential Input Voltage (Note 4)
VID
+36
Input Common-mode Voltage Range
VICM
(VEE-0.3) to (VEE+36)
V
II
-10
mA
Operating Supply Voltage
Vopr
+2.0 ~ +36 (±1.0 ~ ±18)
V
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
TJmax
+150
°C
Input Current (Note 5)
Maximum junction Temperature
V
(Note 1) To use at temperature above TA=25°C reduce 6.2mW/°C.
(Note 2) To use at temperature above TA=25°C reduce 4.5mW/°C.
(Note 3) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%).
(Note 4) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
(Note 5) An excessive input current will flow when input voltages of less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
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BA2903YF-LB
Datasheet
BA2901YF-LB
Electrical Characteristics
○BA2903YF-LB (Unless otherwise specified VCC=+5V, VEE=0V)
Parameter
Symbol
Input Offset Voltage (Note 6,7)
VIO
Input Offset Current (Note 6,7)
IIO
Input Bias Current (Note 7,8)
IB
Input Common-mode
Voltage Range
Typ
Max
25°C
-
2
7
Full range
-
-
15
25°C
-
5
50
Full range
-
-
200
Unit
mV
EK=-1.4V
50
250
-
500
25°C
0
-
VCC-1.5
25°C
88
100
-
Full range
74
-
-
25°C
-
0.6
1
Full range
-
-
2.5
ISINK
25°C
6
16
-
mA
VOL
25°C
Full range
-
150
-
400
700
mV
25°C
-
0.1
-
Full range
-
-
1
-
1.3
-
-
0.4
-
ICC
(Note 7)
Output Saturation Voltage
(Maximum Output Voltage Low)
ILEAK
Response Time
tRE
V
dB
mA
μA
25°C
VCC=5 to 36V, EK=-1.4V
nA
-
Supply Current(Note 7)
EK=-1.4V
EK=-1.4V
-
AV
Conditions
nA
25°C
Large Signal Voltage Gain(Note 7)
Output Leakage Current(Note 7)
(High level output current)
Min
Full range
VICM
Output Sink Current (Note 9)
Limits
Temperature
range
μs
VCC=15V, EK=-1.4 to -11.4V
RL=15kΩ, VRL=15V
OUT=open
OUT=open, VCC=36V
+IN=0V, -IN=1V
OUT=1.5V
+IN=0V, -IN= 1V
ISINK=4mA
+IN=1V, -IN=0V
OUT=5V
+IN=1V, -IN=0V
OUT=36V
RL=5.1kΩ, VRL=5V
VIN=100mVP-P, overdrive=5mV
RL=5.1kΩ, VRL=5V, VIN=TTL
Logic Swing, VREF=1.4V
(Note 6) Absolute value
(Note 7) Full range TA=-40°C to +125°C
(Note 8) Current Direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
(Note 9) Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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BA2903YF-LB
Datasheet
BA2901YF-LB
○BA2901YF-LB (Unless otherwise specified VCC=+5V, VEE=0V)
Parameter
Symbol
Input Offset Voltage (Note10,11)
VIO
Input Offset Current (Note10,11)
IIO
Input Bias Current (Note11,12)
IB
Input Common-mode Voltage
Range
VICM
Large Signal Voltage Gain(Note11)
AV
Supply Current(Note11)
ICC
Output Sink Current (Note13)
ISINK
Output Saturation Voltage(Note11)
(Maximum Output Voltage Low)
VOL
Output Leakage Current(Note11)
(High level output current)
Limits
Min
Typ
Max
25°C
-
2
7
Full range
-
-
15
25°C
-
5
50
Full range
-
-
200
25°C
-
50
250
Full range
-
-
500
25°C
0
-
VCC-1.5
25°C
88
100
-
Full range
74
-
-
25°C
-
0.8
2
Full range
-
-
2.5
25°C
6
16
-
25°C
-
150
400
Full range
-
-
700
25°C
-
0.1
-
Full range
-
-
1
-
1.3
-
-
0.4
-
ILEAK
Response Time
(Note 10)
(Note 11)
(Note 12)
(Note 13)
Temperature
range
tRE
Unit
mV
EK=-1.4V
VCC=5 to 36V, EK=-1.4V
nA
EK=-1.4V
nA
EK=-1.4V
V
dB
mA
mA
mV
μA
25°C
Conditions
μs
VCC=15V, EK=-1.4 to -11.4V
RL=15kΩ, VRL=15V
OUT=open
OUT=open, VCC=36V
+IN=0V, -IN=1V
OUT=1.5V
+IN=0V, -IN= 1V
ISINK=4mA
+IN=1V, -IN=0V
OUT=5V
+IN=1V, -IN=0V
OUT=36V
RL=5.1kΩ, VRL=5V
VIN=100mVP-P, overdrive=5mV
RL=5.1kΩ, VRL=5V, VIN=TTL
Logic Swing, VREF=1.4V
Absolute value
Full range TA=-40°C to +125°C
Current Direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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BA2903YF-LB
Datasheet
BA2901YF-LB
Description of electrical characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the VCC terminal and the VEE terminal without
deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Operating and Storage Temperature Ranges (Topr, Tstg)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range
of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.
(5) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
(5) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(6) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(7) Output Sink Current (ISINK)
Denotes the maximum current that can be output under specific output conditions.
(8) Output Saturation Voltage, Low Level Output Voltage (VOL)
Signifies the voltage range that can be output under specific output conditions.
(9) Output Leakage Current, High Level Output Current (ILEAK)
Indicates the current that flows into the IC under specific input and output conditions.
(10) Response Time (tRE)
Response time indicates the delay time between the input and output signal is determined by the time difference
from the fifty percent of input signal swing to the fifty percent of output signal swing.
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BA2903YF-LB
Datasheet
BA2901YF-LB
Typical Performance Curves
○BA2903YF-LB
1.0
1.6
1.4
BA2903YF-LB
0.8
Supply Current [mA]
Power Dissipation [W]
1.2
0.6
0.4
1.0
-40℃
0.8
25℃
0.6
0.4
0.2
125℃
0.2
0.0
0.0
0
25
50
75
100
125
Ambient Temperature [°C]
150
0
Figure 2.
Power Dissipation vs Ambient Temperature
(Derating Curve)
10
20
30
Supply Voltage [V]
40
Figure 3.
Supply Current vs Supply Voltage
1.6
200
Output Saturation Voltage [mV]
1.4
Supply Current [mA]
1.2
1.0
0.8
36V
0.6
5V
0.4
150
125℃
100
25℃
50
-40℃
2V
0.2
0
0.0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
10
20
30
Supply Voltage [V]
40
Figure 5.
Output Saturation Voltage vs Supply Voltage
(ISINK=4mA)
Figure 4.
Supply Current vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA2903YF-LB
Datasheet
BA2901YF-LB
Typical Performance Curves - continued
○BA2903YF-LB
200
2.0
Output Saturation Voltage [V]
Output Saturation Voltage [mV]
1.8
150
2V
100
5V
36V
50
1.6
1.4
125℃
1.2
25℃
1.0
0.8
0.6
-40℃
0.4
0.2
0.0
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
2
4
6
8 10 12 14 16
Output Sink Current [mA]
18
20
Figure 7.
Output Saturation Voltage vs
Output Sink Current
(VCC=5V)
Figure 6.
Output Saturation Voltage vs Ambient Temperature
(ISINK=4mA)
40
8
30
5V
36V
20
2V
10
Input Offset Voltage [mV]
Output Sink Current [mA]
6
4
-40℃
2
0
25℃
125℃
-2
-4
-6
-8
0
-50
-25
0
0
25 50 75 100 125 150
Ambient Temperature [°C]
10
20
30
Supply Voltage [V]
40
Figure 9.
Input Offset Voltage vs Supply Voltage
Figure 8.
Output Sink Current vs Ambient Temperature
(OUT=1.5V)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA2903YF-LB
Datasheet
BA2901YF-LB
Typical Performance Curves - continued
8
160
6
140
4
120
Input Bias Current [nA]
Input Offset Voltage [mV]
○BA2903YF-LB
2V
2
0
5V
36V
-2
-4
100
-40℃
80
25℃
60
40
125℃
-6
20
-8
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
0
Figure 10.
Input Offset Voltage vs Ambient Temperature
10
20
30
Supply Voltage [V]
40
Figure 11.
Input Bias Current vs Supply Voltage
50
160
40
140
30
Input Offset Current [nA]
Input Bias Current [nA]
120
100
36V
80
60
40
5V
20
10
-40℃
25℃
0
125℃
-10
-20
-30
2V
20
-40
-50
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
Figure 12.
Input Bias Current vs Ambient Temperature
10
20
30
Supply Voltage [V]
40
Figure 13.
Input Offset Current vs Supply Voltage
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Datasheet
BA2901YF-LB
Typical Performance Curves - continued
○BA2903YF-LB
140
50
40
130
Large Signal Voltage Gain [dB]
Input Offset Current [nA]
30
20
10
2V
0
36V
5V
-10
-20
-30
125℃
120
110
25℃
100
90
80
70
-40
-50
60
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
10
20
30
Supply Voltage [V]
40
Figure 15.
Large Signal Voltage Gain
vs Supply Voltage
Figure 14.
Input Offset Current vs Ambient Temperature
140
160
Common Mode Rejection Ratio [dB]
130
Large Signal Voltage Gain [dB]
-40℃
36V
120
110
15V
100
5V
90
80
70
140
120
125℃
25℃
100
60
-40℃
80
60
40
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
10
20
30
Supply Voltage [V]
40
Figure 17.
Common Mode Rejection Ratio
vs Supply Voltage
Figure 16.
Large Signal Voltage Gain
vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA2903YF-LB
Datasheet
BA2901YF-LB
Typical Performance Curves - continued
150
6
125
4
36V
Input Offset Voltage [mV]
Common Mode Rejection Ratio [dB]
○BA2903YF-LB
100
75
5V
2V
50
125℃
0
-2
-4
0
-6
-25
0
25
50
75 100
Ambient Temperature [°C]
125
-40℃
2
25
-50
25℃
150
-1
Figure 18.
Common Mode Rejection Ratio
vs Ambient Temperature
1
2
3
Input Voltage [V]
4
5
Figure 19.
Input Offset Voltage - Input Voltage
(VCC=5V)
200
5
180
Response Time (Low to High) [μs]
Power Supply Rejection Ratio [dB]
0
160
140
120
100
80
-25
0
25
50
75 100
Ambient Temperature [°C]
125
3
2
125℃
1
0
-100
60
-50
4
150
-80
25℃
-40℃
-60
-40
-20
Over Drive Voltage [mV]
0
Figure 21.
Response Time (Low to High)
vs Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 20.
Power Supply Rejection Ratio
vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Datasheet
BA2901YF-LB
Typical Performance Curves - continued
○BA2903YF-LB
5
Response Time (High to Low) [μs]
Response Time (Low to High) [μs]
5
4
3
2
5mV overdrive
20mV overdrive
100mV overdrive
1
0
4
3
125℃
2
25℃
-40℃
1
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
20
40
60
80
Over Drive Voltage [mV]
100
Figure 23.
Response Time (High to Low)
vs Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 22.
Response Time (Low to High)
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
Response Time (High to Low) [μs]
5
4
3
5mV overdrive
2
20mV overdrive
100mV overdrive
1
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 24.
Response Time (High to Low)
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Datasheet
BA2901YF-LB
Typical Performance Curves - continued
○BA2901YF-LB
1.0
2.0
1.8
0.8
1.6
Supply Current [mA]
Power Dissipation [W]
-40℃
BA2901YF-LB
0.6
0.4
0.2
25℃
1.4
1.2
1.0
0.8
0.6
125℃
0.4
0.2
0.0
0.0
0
25
50
75
100
125
Ambient Temperature [°C]
150
0
Figure 25.
Power Dissipation vs Ambient Temperature
(Derating Curve)
10
20
30
Supply Voltage [V]
40
Figure 26.
Supply Current vs Supply Voltage
200
2.0
1.8
1.4
Output Saturation Voltage [mV]
Supply Current [mA]
1.6
36V
1.2
1.0
5V
0.8
0.6
2V
0.4
150
125℃
100
25℃
50
-40℃
0.2
0
0.0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
10
20
30
Supply Voltage [V]
40
Figure 28.
Output Saturation Voltage vs Supply Voltage
(ISINK=4mA)
Figure 27.
Supply Current vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA2901YF-LB
Typical Performance Curves - continued
○BA2901YF-LB
2.0
200
Output Saturation Voltage [V]
Output Saturation Voltage [mV]
1.8
150
2V
100
5V
36V
50
1.6
1.4
125℃
1.2
25℃
1.0
0.8
0.6
-40℃
0.4
0.2
0.0
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
2
4
6
8 10 12 14 16
Output Sink Current [mA]
18
20
Figure 30.
Output Saturation Voltage vs
Output Sink Current
(VCC=5V)
Figure 29.
Output Saturation Voltage vs Ambient Temperature
(ISINK=4mA)
8
40
30
5V
36V
20
2V
10
Input Offset Voltage [mV]
Output Sink Current [mA]
6
4
-40℃
2
0
25℃
125℃
-2
-4
-6
-8
0
-50
-25
0
0
25 50 75 100 125 150
Ambient Temperature [°C]
10
20
30
Supply Voltage [V]
40
Figure 32.
Input Offset Voltage vs Supply Voltage
Figure 31.
Output Sink Current vs Ambient Temperature
(OUT=1.5V)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Typical Performance Curves - continued
8
160
6
140
4
120
Input Bias Current [nA]
Input Offset Voltage [mV]
○BA2901YF-LB
2V
2
0
5V
36V
-2
-4
100
-40℃
80
25℃
60
40
125℃
-6
20
-8
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
0
Figure 33.
Input Offset Voltage vs Ambient Temperature
20
30
Supply Voltage [V]
40
Figure 34.
Input Bias Current vs Supply Voltage
160
50
40
140
30
Input Offset Current [nA]
120
Input Bias Current [nA]
10
100
36V
80
60
40
5V
20
10
-40℃
25℃
0
125℃
-10
-20
-30
2V
20
-40
-50
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
0
150
10
20
30
Supply Voltage [V]
40
Figure 36.
Input Offset Current vs Supply Voltage
Figure 35.
Input Bias Current vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA2901YF-LB
Typical Performance Curves - continued
○BA2901YF-LB
140
50
40
130
Large Signal Voltage Gain [dB]
Input Offset Current [nA]
30
20
10
2V
0
5V
-10
36V
-20
-30
125℃
120
110
25℃
100
90
80
70
-40
-50
60
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
Figure 37.
Input Offset Current vs Ambient Temperature
10
20
30
Supply Voltage [V]
40
Figure 38.
Large Signal Voltage Gain
vs Supply Voltage
140
160
Common Mode Rejection Ratio [dB]
130
Large Signal Voltage Gain [dB]
-40℃
36V
120
110
15V
100
5V
90
80
70
140
120
125℃
25℃
100
60
-40℃
80
60
40
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
10
20
30
Supply Voltage [V]
40
Figure 40.
Common Mode Rejection Ratio
vs Supply Voltage
Figure 39.
Large Signal Voltage Gain
vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA2901YF-LB
Typical Performance Curves - continued
150
6
125
4
36V
Input Offset Voltage [mV]
Common Mode Rejection Ratio [dB]
○BA2901YF-LB
100
75
5V
2V
50
25
25℃
-40℃
2
125℃
0
-2
-4
0
-6
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
-1
Figure 41.
Common Mode Rejection Ratio
vs Ambient Temperature
1
2
3
Input Voltage [V]
4
5
Figure 42.
Input Offset Voltage - Input Voltage
(VCC=5V)
5
200
180
Response Time (Low to High) [μs]
Power Supply Rejection Ratio [dB]
0
160
140
120
100
80
-25
0
25
50
75 100
Ambient Temperature [°C]
125
3
2
125℃
1
0
-100
60
-50
4
150
-80
25℃
-40℃
-60
-40
-20
Over Drive Voltage [mV]
0
Figure 44.
Response Time (Low to High)
vs Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 43.
Power Supply Rejection Ratio
vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA2901YF-LB
Typical Performance Curves - continued
○BA2901YF-LB
5
Response Time (High to Low) [μs]
Response Time (Low to High) [μs]
5
4
3
2
5mV overdrive
20mV overdrive
100mV overdrive
1
0
4
3
125℃
2
25℃
-40℃
1
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
0
20
40
60
80
Over Drive Voltage [mV]
100
Figure 46.
Response Time (High to Low)
vs Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 45.
Response Time (Low to High)
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
Response Time (High to Low) [μs]
5
4
3
5mV overdrive
2
20mV overdrive
100mV overdrive
1
0
-50
-25
0
25
50
75 100
Ambient Temperature [°C]
125
150
Figure 47.
Response Time (High to Low)
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 48(a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax-TA) / PD
°C/W
The Derating curve in Figure 48(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 48(c) and (d) shows an example of the derating curve for
BA2903YF-LB, BA2901YF-LB.
LSIの
Power dissipation
LSI
消of
費電
力 [W]
LSI
の消費電力
PPd
D(max)
D(max)
(max)
θJA=(TJmax-TA)/PD °C /W
θθja2
< θθja1
JA2 <
JA1
P2
Ambient temperature TA [ °C ]
θ’
θ'JA2
ja2
P1
Chip surface temperature TJ [ °C ]
0
25
TJ(max)
J’(max) Tj
(max)
Tj ' T
(max)
θ’θ'JA1
ja1
θθJA1
ja1
50
75
100
125
150
TA [℃
] ]
[ °C
周 囲 温 度 Ta
周囲温度
Ambient temperature
(a) Thermal resistance
(b) Derating curve
1.0
1.0
BA2903YF-LB
0.8
(Note 14)
Power Dissipation [W]
Power Dissipation [W]
θJA2
θ
ja2
0.6
0.4
0.2
0.0
0.8
0.6
BA2901YF-LB
(Note 15)
0.4
0.2
0.0
0
25
50
75 100 125
Ambient Temperature [°C]
150
0
25
50
75 100 125
Ambient Temperature [°C]
(c) BA2903Y
150
(d) BA2901Y
(Note14)
(Note15)
UNIT
6.2
4.5
mW/°C
When using the unit above TA=25°C, subtract the value above per Celsius degree.
Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted.
Figure 48. Thermal resistance and derating
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Application Information
NULL method condition for Test circuit1
VCC,VEE,EK,VICM Unit：V
Parameter
VF
S1
S2
S3
VCC
VEE
EK
VICM
Calculation
Input Offset Voltage
VF1
ON
ON
ON
5 to 36
0
-1.4
0
1
Input Offset Current
VF2
OFF
OFF
ON
5
0
-1.4
0
2
VF3
OFF
ON
VF4
ON
OFF
ON
ON
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
ON
- Calculation 1. Input Offset Voltage (VIO)
VIO =
2. Input Offset Current (IIO)
IIO =
3. Input Bias Current (IB)
IB =
4. Large Signal Voltage Gain (AV)
AV = 20Log ΔEK × (1+RF/RS)
|VF5-VF6|
|VF1|
1+RF/RS
5
0
-1.4
0
5
0
-1.4
0
15
0
-1.4
0
15
0
-11.4
0
ON
3
4
[V]
|VF2-VF1|
RI ×(1+RF/RS)
[A]
|VF4-VF3|
[A]
2 × RI ×(1+RF/RS)
[dB]
RF=50kΩ
SW1
EK
RS=50Ω
0.1µF
500kΩ
VCC
15V
Vo
RI=10kΩ
500kΩ
0.1µF
0.1µF
DUT
NULL
SW3
RS=50Ω
VICM
50kΩ
RI=10kΩ
SW2
1000pF
RL
VEE
VRL
VF
-15V
Figure 49. Test circuit1 (one channel only)
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Switch Condition for Test Circuit 2
SW No.
Supply Current
Output Sink Current
SW
1
SW
2
SW
3
SW
4
SW
5
SW
6
SW
7
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OUT=1.5V
OFF
ON
ON
OFF
OFF
OFF
ON
Output Saturation Voltage
ISINK=4mA
OFF
ON
ON
OFF
ON
ON
OFF
Output Leakage Current
OUT=36V
OFF
ON
ON
OFF
OFF
OFF
ON
Response Time
RL=5.1kΩ, VRL=5V
ON
OFF
ON
ON
OFF
OFF
OFF
VCC
A
－
＋
SW1
SW2
SW3
SW4
SW5
SW6
SW7
VEE
RL
V
-IN
VRL
+IN
A
OUT
Figure 50. Test Circuit 2 (one channel only)
IN
IN
Input wave
Input wave
VREF
overdrive voltage
overdrive voltage
VREF
OUT
OUT
Output wave
Output wave
VCC
VCC
VCC/2
VCC/2
0V
0V
tRE (Low to High)
tRE (High to Low)
Figure 51. Response Time
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Example of circuit
○Reference voltage is -IN
VCC
VRL
IN
+
IN
-
Reference Voltage
Vref
VREF
OUT
VEE
Time
OUT
High
While the input voltage is higher that the reference
voltage, the output voltage remains high. In case
the input voltage becomes lower than the reference
voltage, the output voltage will turn low.
Low
Time
○Reference voltage is +IN
IN
VCC
Vref
RL
+
Reference Voltage
IN
VRL
VREF
Time
VEE
OUT
High
While the input voltage is smaller that the reference
voltage, the output voltage remains high. In case
the input voltage becomes higher than the
reference voltage, the output voltage will turn low.
Low
Time
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of
connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
N
P
N
P+
N
N
Parasitic
Element
P+
N P
N
P+
B
N
C
E
Parasitic
Element
P Substrate
P Substrate
Parasitic
Element
Pin B
B
GND
Parasitic
Element
GND
GND
GND
Parasitic element
or Transistor
Figure 52. Example of Monolithic IC Structure
12. Unused Circuits
When there are unused circuits it is recommended that they be connected as in Figure 53, setting the non-inverting
input terminal to a potential within the in-phase input voltage range (VICR).
VCC
keep this potential
in VICM
VICM
OPEN
+
VEE
Figure 53. Disable Circuit Example
13. Input Terminal Voltage
Applying VEE + 36V to the input terminal is possible without causing deterioration of the electrical characteristics or
destruction, irrespective of the supply voltage. However, this does not ensure normal circuit operation. Please note that
the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric
characteristics.
14. Power Supply (signal / dual)
The comparator operates when the specified voltage supplied is between VCC and VEE. Therefore, the single supply
comparator can be used as a dual supply op-amp as well.
15. Terminal short-circuits
When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat generation
and, subsequently, destruction.
16. IC Handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
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Physical Dimensions Tape and Reel Information
Package Name
SOP8
Max 5.35 (include. BURR)
Drawing: EX112-5001-1
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Datasheet
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Physical Dimension Tape and Reel Information - continued
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
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Marking Diagrams
SOP14(TOP VIEW)
SOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Product Name
Package Type
Marking
BA2903Y
F-LB
SOP8
2903Y
BA2901Y
F-LB
SOP14
BA2901YF
Land pattern data
SOP8, SOP14
b2
e
MIE
ℓ2
PKG
SOP8
SOP14
Land pitch
e
Land space
MIE
1.27
4.60
All dimensions in mm
Land length
Land width
≧ℓ 2
b2
1.10
0.76
Revision History
Date
Revision
30.Jan.2014
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001