Process Change Notice #1104212 ____________________________________________________________________________________________________ User Registration Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content available only to registered users. http://www.silabs.com/profile PCN Date: 21Apr11 Effective Date: 26Jul11 Title: Si4702/03 Fab Site (SMIC) and Assembly Sites (SPIL and ASEKR) Expansion Originator: Wade Gillham Phone: 512-532-5248 Dept: Broadcast Marketing Customer Contact: Kathy Haggar Phone: 512-532-5261 Dept: Sales PCN Type: Assembly Discontinuance Package Datasheet Fabrication Product Revision Packing Labeling Location Test Other Last Order Date: 26Jul11 PCN Details Description of Change: Silicon Laboratories (Silicon Labs) is pleased to announce the successful qualification of the following additional fab and assembly sites for the Si4702/03 family of FM receiver products: Fab Site - Semiconductor Manufacturing International Corporation (SMIC) in Shanghai, China SMIC is an existing fab site for Silicon Labs, is certified to ISO9001, ISO14001 and ISO/TS16949 and is a Sony Green Partner. Assembly Site - Siliconware Precision Industries Co. Ltd., Taiwan (SPIL) SPIL is an existing assembly site for Silicon Labs, is certified to ISO9001, ISO14001 and ISO/TS16949 and is a Sony Green Partner. Assembly Site - Advanced Semiconductor Engineering in Korea (ASEKR) ASEKR is an existing assembly site for Silicon Laboratories and is certified for ISO9001, ISO14001, ISO/TS 16949 and is a Sony Green Partner. Si4702/03 devices manufactured in SMIC will be noted with an incremented die revision number making the part numbers Si4702/03-D30; however the devices are a drop-in replacement for the Si4702/03-C19. Approved Bills of Material Supplier ASEKR (Au wire) ASEKR (Cu wire) SPIL Leadframe Half Etched, Copper C7025, Ring Ag-Plating Half Etched, Copper C7025, Ring Ag-Plating Etched, EFTEC 64T Pre-Plating Die Attach Hitachi EN4900GC Hitachi EN4900GC Sumitomo 1033BF Wire bond 1.0 mil Au wire 0.9mil CuPd wire 1.0 mil Au wire Sumitomo EME- G700 Sumitomo EME- G700 Sumitomo EME- G770 Sn 100 (Matte Tin) Sn 100 (Matte Tin) Sn 100 (Matte Tin) Mold Compound Lead finish Reason for Change: Expand manufacturing capacity for the Si4702/03 product family. W7206F1 Process Change Notice Form rev Z The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1 Process Change Notice #1104212 ____________________________________________________________________________________________________ Impact on Form, Fit, Function, Quality, Reliability: There is no impact to the Form, Fit, Quality or Reliability of the Si4702/03 family of FM receivers manufactured at SMIC. The Si4702/03-D30 parts are a drop-in replacement for the existing Si4702/03-C19 parts. The Function has changed where the power consumption has increased slightly (~8%) for the SMIC produced parts. There is no impact on Form Fit, Function, Quality or Reliability of the Si4702/03-D30 variants assembled at either SPIL or ASEKR assembly sites. Product Identification: This PCN applies to devices ordered using the following ordering part numbers. Part Number Fabrication Facility Assembly Location Assembly Location Si4702-C19-GM TSMC SPIL ASEKR Si4702-D30-GM SMIC SPIL ASEKR Si4703-C19-GM TSMC SPIL ASEKR Si4703-D30-GM SMIC SPIL ASEKR Note: Affected Part Numbers also include tape and reel equivalents (“R” suffix). Last Date of Unchanged Product: 26Jul11 Following the Effective Date of this PCN, Silicon Laboratories may utilize any of the qualified foundries or assembly sites to schedule and fulfill orders for the Si4702/03 products. Orders placed using any of the above part numbers may be fulfilled with their equivalent counterpart at Silicon Labs’ discrection. Qualification Samples: Samples are available now. Please contact your local Silicon Laboratories sales representative to order samples. A list of authorized sales representatives may be found at www.silabs.com Customer Early Acceptance Sign Off: Customers may approve early PCN acceptance by completing the information below: Early Acceptance Date: Name: Company: Email your early Acceptance approval to: [email protected] Qualification Data: See Appendix A for the Qualification Report W7206F1 Process Change Notice Form rev Z The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2 Process Change Notice #1104212 ____________________________________________________________________________________________________ Appendix A: Si4702/03-D30-GM Qualification Report Part Rev D30, SMIC Fabrication, ASEKR Assembly except as noted Test Name Test Condition Qualification Lot ID or Start Fail/Pass or End Notes Summary 1 3 lots Status Test Group A – Accelerated Environment Stress Tests - ASEKR 3x3 QFN JA110 HAST Q23521 0/78 Q23544 0/78 Vcc=5.5V, 96 hours Q23548 0/78 JA104 Q25083 0/80 Q23546 0/78 Q23549 0/78 Q25083 0/80 Q25109 0/79 6 lots Q25115 0/76 0/471 Q23616 0/78 Q23617 0/78 Q23618 0/78 130°C, 85%RH Cond C: -65°C to 150°C Temp Cycle 3 lots, N=>25 3 lots, N=>25 500 cycles JA103 HTSL 150°C, 1000hr 3 lots, N=>25 0/234 Pass 1 1 Pass 3 lots 0/234 Pass Test Group A – Accelerated Environment Stress Tests - ASEKR - Copper Wire JA110 HAST Temp Cycle HTSL Q29832 0/30 Q29824 0/30 Vcc=5.5V, 192 hours Q29816 0/30 JA104 Q29834 0/26 Q29826 0/26 2000 cycles Q29818 0/26 JA103 Q29833 0/28 Q29825 0/28 Q29817 0/28 130°C, 85%RH Cond C: -65°C to 150°C 150°C, 2000 hours 3 lots, N=>25 3 lots, N=>25 3 lots, N=>25 1 3 lots 0/90 1 3 lots 0/78 1 Pass Pass 3 lots 0/84 Pass Test Group A – Accelerated Environment Stress Tests - SPIL 3x3 QFN JA110 HAST Temp Cycle HTSL 423506.1 0/25 423881.1 0/25 Vcc=5.5V, 96 hours 424560.1 0/25 JA104 423506.1 0/25 423881.1 0/25 500 cycles 424560.1 0/25 JA103 423506.1 0/25 423881.1 0/25 424560.1 0/25 130°C, 85%RH Cond C: -65°C to 150°C 150°C, 1000hr 3 lots, N=>77 3 lots, N=>77 1 lot, N=>45 1 3 lots 0/75 1 3 lots 0/75 1 Pass Pass 3 lots 0/75 Pass Appendix A: Si4702/03-D30-GM Qualification Report (continued) W7206F1 Process Change Notice Form rev Z The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 3 Process Change Notice #1104212 ____________________________________________________________________________________________________ Part Rev D30, SMIC Fabrication, ASEKR Assembly except as noted Test Name Lot ID or Start Fail/Pass or End Q29407 0/79 Q29408 0/80 3 lots Vcc=5.5V, 1000 hours Q29409 0/80 0/239 JA108 Q27772 0/83 Test Condition Qualification Notes Summary Status Test Group B – Accelerated Lifetime Simulation Tests JA108 HTOL LTOL 125°C, Dynamic -10°C, Dynamic 3 lots, N=>77 1 lot, N=>32 1 lots Vcc=5.5V, 1000 hours 0/83 JA108 125°C, Dynamic 3 lots, N=>500 Vcc=5.5V, 48 hours ELFR Pass Q29624 0/999 Q29626 0/998 Q29632 0/958 Q29633 0/1035 Q29634 0/1040 Q29637 0/1038 Q29638 0/1040 8 lots Q29639 0/1040 0/8148 Q29098 0/3 Q29099 0/3 Q29100 0/3 Q29101 0/3 Q29097 0/3 ASEKR ±750V Q29766 0/3 ASEKR, Cu ±750V Q28689 0/3 SPIL ±1250V Q29096 0/6 85°C Q29102 0/6 25°C Pass Pass Test Group E – Electrical Verification JA114 ESD-HBM 1 lot, N=>3 JA115 ESD-MM 1 lot, N=>3 JC101 ESD-CDM 1 lot, N=>3 JESD78 Latch Up ±200mA 1 lot, N=>6 Overvoltage = 8.25V 2 ±2250V ±750V 2 Class 2 ±125V ±25V Class A Pass 2 lots 0/12 Pass Notes: 1. Preceeded by MSL2 @260C Preconditioning 2. No-connect pins 1 and 20 excluded W7206F1 Process Change Notice Form rev Z The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4