Si4702/03-C19 Assembly Site Expansion-SPIL Std

Process Change Notice #1005102
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PCN Date: 10May10
Effective Date: 10Aug10
Title: Si4702/03-C19 Assembly Site Expansion - SPIL
Originator: Yi Yin Chee
Phone: +65 – 6511 7749
Dept: Supplier Quality
Customer Contact: Kathy Haggar
Phone: +1.512.532.5261
Dept: Inside Sales
PCN Type:
Assembly
Discontinuance
Package
Datasheet
Fabrication
Product Revision
Packing
Labeling
Location
Test
Other
Last Order Date: 10Jul10
PCN Details
Description of Change:
Silicon Laboratories is pleased to announce the successful qualification of SPIL (Siliconware
Precision Industries Co. Ltd., Taiwan) as an additional assembly site for 20-QFN-3x3-LF devices.
SPIL is an existing assembly site for Silicon Laboratories, is certified to ISO9001, ISO14001 &
ISO/TS16949 and is a Sony Green Partner. The newly qualified 20-QFN-3x3-LF devices
manufactured/assembled at SPIL fully comply with datasheet parameters and quality levels.
Reason for Change:
Increase assembly capacity for 20-QFN-3x3-LF devices improving Silicon Laboratories’ on time
performance to customer requested delivery dates.
Impact on Form, Fit, Function, Quality, Reliability:
There is no impact on fit, function, quality or reliability. The newly qualified 20-QFN-3x3-LF
devices at SPIL will continue to comply with Silicon Laboratories’ applicable datasheet
specifications and quality levels.
SPIL uses a different bill of materials than the existing assembly suppliers; these materials have
passed all JEDEC qualifications as included in the Qualification Report. Full material declaration
documentation is available from your local Silicon Laboratories sales representative. A list of
Silicon Laboratories sales representatives may be found at www.silabs.com.
W7206F1 Process Change Notice Form rev X
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1
Process Change Notice #1005102
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Product Identification:
This PCN applies to devices using the following ordering part numbers:
Affected Order Part Numbers (OPN)
SI4702-C19-GM
SI4703-C19-GM
BCCC-P11901ZM7
SI4702-C19-GMR
SI4703-C19-GMR BCCC-P11901ZM7R
Affected parts assembled in SPIL will display “TW” at location as highlighted in green below.
Last Date of Unchanged Product: 10Aug10
Following the Effective Date of this PCN, Silicon Laboratories may utilize any of the qualified
assembly sites to schedule and fulfill orders for the affected products.
Qualification Samples:
Samples are available upon request. Please contact your local Silicon Laboratories sales
representative to order samples. A list of Silicon Laboratories sales representatives is available at
www.silabs.com.
W7206F1 Process Change Notice Form rev X
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2
Process Change Notice #1005102
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Customer Early Acceptance Sign Off:
Customers may approve early PCN acceptance by completing the information below:
Early Acceptance Date:
Name:
Company:
Email your early Acceptance approval to: [email protected]
Qualification Data:
See Appendix A for the Qualification Report. ICP and MSDS reports are available upon request. A
list of Silicon Laboratories sales representatives is available at www.silabs.com.
W7206F1 Process Change Notice Form rev X
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 3
Process Change Notice #1005102
____________________________________________________________________________________________________
Appendix A: Qualification Report
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or
used in part or w hole w ithout Silicon Laboratories’ w ritten consent. The document is uncontrolled if printed or
electronically saved.
Si4702/03-C19-GM, SPIL Assembly
Test Group A – Accelerated Environment Stress Tests - SPIL 3x3 QFN
Lot ID or Fail/Pass
Start
or End
Notes
423506
0/25
1
423881
0/25
1
3 lots
Vcc=5.5V, 96 hours
424560
0/25
1
0/75
JA104
423506
0/25
1
423881
0/25
1
3 lots
500 cycles
424560
0/25
1
0/75
JA103
423506
0/25
1
423881
0/25
1
3 lots
424560
0/25
1
0/75
423506.1
0/100
423881.1
0/100
3 lots
424560.1
0/100
0/300
423506.1
0/100
423881.1
0/100
3 lots
424560.1
0/100
0/300
423506.1
0/30
423881.1
0/30
3 lots
424560.1
0/30
0/90
423506.1
0/10
423881.1
0/10
3 lots
424560.1
0/10
0/30
Q28689
0/3
±1250V
Test Name
Test Condition
HAST
JA110
130°C, 85%RH
Temp Cycle
Cond C: -65°C to 150°C
HTSL
150°C, 1000hr
Qualification
3 lots, N=>77
3 lots, N=>77
1 lot, N=>45
Summary
Status
Pass
Pass
Pass
Test Group C – Package Assembly Integrity Tests - SPIL 3x3 QFN
Wire Bond Shear
AEC-Q100-001
5 units, N=>30
Wire Bond Pull
M-STD-883
Performed post-TC
5 units, N=>30
Physical Dimensions JB100
3 lots, N=>10
Solderability
JB102
1 lot, N=>15
Pass
Pass
Pass
Pass
Test Group E – Electrical Verification - SPIL 3x3 QFN
ESD-CDM
AEC-Q100-011
1 lot, N=>3
Pass
Notes:
1. Preceeded by MSL1@260 Preconditioning
W7206F1 Process Change Notice Form rev X
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4