Process Change Notice # 1104011 ____________________________________________________________________________________________________ User Registration Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content available only to registered users. http://www.silabs.com/profile PCN Date: 06APR11 Effective Date: 06Jul11 Title: ASEKR Die Bond Adhesive – Japan Earthquake and Tsunami Disaster Recovery Originator: Harold Melton Phone: 512.428.1699 Dept: Product Quality Customer Contact: Kathy Haggar Phone: 512.532.5261 Dept: Sales PCN Type: Assembly Discontinuance Package Datasheet Fabrication Product Revision Packing Labeling Location Test Other Last Order Date: N/A PCN Details Description of Change: Add Henkel Ablebond 8290 die attach epoxy as an additional approved package material. Reason for Change: Hitachi EN4900 supply continuity impacted by Japan earthquake and tsunami. Impact on Form, Fit, Function, Quality, Reliability: The new die attach epoxy is equivalent to the Hitachi EN4900 and meets all quality and reliability requirements. Product Identification: See Appendix A for the full list of affected part numbers. Last Date of Unchanged Product: 06JUL11 Qualification Samples: Available on request within standard lead-times. Customer Early Acceptance Sign Off: Customers may approve early PCN acceptance by completing the information below: Early Acceptance Date: Name: Company: Email your early Acceptance approval to: [email protected] W7206F1 Process Change Notice Form rev AA The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1 Process Change Notice # 1104011 ____________________________________________________________________________________________________ Qualification Data: See Appendix B for qualification data on 7x7 QFN using Ablebond 8290 epoxy. Additional qualification stresses will be reported as shown below Package Die Shear 3x3 QFN 6x6 QFN 6x6 QFN (multi-die) 4x4 QFN (AEC) Date of Report W7206F1 Process Change Notice Form rev AA MSL Verification HAST Temperature Cycling 19-Apr-11 2-May-11 The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2 Process Change Notice # 1104011 ____________________________________________________________________________________________________ Appendix A Affected Part Numbers BCCC-P11901ZM7 BCDM-P13002ZM7 C8051F571-IM C8051F580-IM C8051F588-IM C8051F980-GM C8051F981-GM Si2143-A30-GM Si2153-A40-GM Si2170-A20-GM Si2170-B30-GM Si2172-A10-GM Si2172-A20-GM Si2173-A30-GM Si2173-A31-GM Si2173-A40-GM Si2173-A40-ZM7 Si2200-F-GM Si3112-A-FM Si3112-A-ZM1 Si3203-B-FM Si3203-B-GM Si3206-B-FM Si3206-B-GM Si3208-B-FM Si3208-B-GM Si3209-B-FM Si3209-B-GM Si3210-E-FM Si3210-E-GM Si3210M-E-FM Si3210M-E-GM Si3211-E-FM Si3211-E-GM Si3215-C-FM Si3215-C-GM Si3215M-C-FM Si3215M-C-GM Si3216-C-FM Si3216-C-GM Si3216M-C-FM Si3216M-C-GM Si3230-E-FM Si3230-E-GM Si3230M-E-FM Si3230M-E-GM Si3400-E1-GM Si3402-A-GM Si3500-A-GM Si4112-D-GM Si4113-D-GM Si4123-D-GM Si4126-F-GM Si4133-D-GM Si4136-F-GM Si4702-B16-GM Si4702-C19-GM Si4702-D30-GM Si4703-B17-GM Si4703-B17-ZM1 Si4703-C19-GM Si4703-D30-GM Si4704-B20-GM Si4704-C40-GM Si4704-D50-GM Si4704-D60-GM Si4705-B20-GM Si4705-C40-GM Si4705-D50-GM Si4705-D60-GM Si4706-B20-GM Si4706-C30-GM Si4706-C31-GM Si4706-D50-GM Si4707-B20-GM Si4708-B-GM Si4708-C-GM Si4709-B-GM Si4709-C-GM Si4710-B30-GM Si4710-B31-GM Si4711-B30-GM Si4712-B30-GM Si4713-B30-GM Si4720-B20-GM Si4721-B20-GM Si4730-B20-GM Si4730-C40-GM Si4730-D60-GM Si4731-B20-GM Si4731-C40-GM Si4731-D60-GM Si4734-B20-GM Si4734-C40-GM Si4734-D60-GM Si4735-B20-GM Si4735-D60-GM Si4736-B20-GM Si4737-B20-GM Si4738-B20-GM Si4740-C10-GM Si4741-C10-GM Si4743-C10-AM Si4743-C10-GM Si4744-C10-GM Si4745-C10-AM Si4745-C10-GM Si4749-C10-AM Si4749-C10-GM Si4749-C10-ZM1 Si4784-B20-GM Si4785-B20-GM 500SxxxxxMxxxxACx 500DxxxxxMxxxxACx Note: For Tape and Reel option, add a R suffix to the part number above W7206F1 Process Change Notice Form rev AA The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 3 Process Change Notice # 1104011 ____________________________________________________________________________________________________ W7206F1 Process Change Notice Form rev AA The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4